A kind of low temperature lead-free solder alloy and vacuum casting method thereof

A lead-free solder alloy, vacuum casting technology, applied in the direction of welding/cutting media/materials, welding equipment, manufacturing tools, etc., can solve problems such as health damage, lead and its compounds are poisonous, and achieve improved oxidation resistance and good moisturization Humidity and oxidation resistance, microstructure uniform effect

Active Publication Date: 2021-03-30
云南锡业集团(控股)有限责任公司研发中心 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, lead and its compounds are toxic and will cause damage to the environment and human health. Therefore, countries have legislated to restrict the use of lead, which has promoted the development of lead-free electronic products.

Method used

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  • A kind of low temperature lead-free solder alloy and vacuum casting method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Example 1: The composition and mass percentage of the high reliability of low-temperature lead solder alloy were: Zn 11%, Bi8.5%, IN 7%, AG 0.8%, Mg 0.5%, V 0.3%, Zr 0.3%, Ga 0.3%, GE 0.3%, the margin is SN and inevitable impurities.

[0022] The preparation method is (1) industrial pure tin (Sn: 99.95 wt%), industrial pure bismuth (BI: 99.9%), industrial pure zinc (Zn: 99.9 wt%) and indium, silver, magnesium, vanadium, zirconium , Gallium, germanium metal is applied with 320 mesh paper to remove the oxide layer, which is placed in a blower drying tank (40 ° C), respectively; (2) use graphite crucible for alloy casting, prior crucible, slag tool The surface of the bell is cleaned by impurities, and then placed in a 40 ° C oven to remove moisture, the vacuum smelting furnace temperature gradient is heated to 250 ° C, which will account for 30% of the total mass of pure tin at 245 ° C. After melt into the molten tank, then the remaining pure tin; after all of which is all mel...

Embodiment 2

[0025] Example 2: The composition and mass percentage of the high reliability lead-free solder alloy were: Zn 8%, Bi 5%, IN4%, Ag 0.1%, Mg 0.05%, V 0.01%, and the margin was SN and inevitable. Impurities.

[0026] The preparation method is (1) industrial pure tin (Sn: 99.95 wt%), industrial pure 铋 (BI: 99.95 wt%) and indium pure zinc (Zn: 99.9 wt%), and indium, silver, magnesium, vanadium metal The oxide layer was applied with 320 mesh paper, and the drying preheating was carried out in the blower drying tank (40 ° C), respectively; (2) using graphite crucible for alloy casting, prior crucible, slag tool, clock hood, etc. Cleaning and remove the impurities, then placed in a 40 ° C oven to remove moisture, the temperature gradient of the vacuum smelting furnace is heated to 250 ° C, and the total weight of the total mass of pure tin is melted into a molten pool. , Add the remaining pure tin; after all of which is all melted, the temperature is increased to 270 ° C; (3) add indium, ...

Embodiment 3

[0029] Example 3: The composition and mass percentage of the high reliability lead-free solder alloy were: Zn 15%, Bi 12%, IN10%, Ag 1.5%, Mg 1%, V 0.5%, Zr 0.5%, Ga 0.5%. GE 0.5%, the margin is SN and inevitable impurities.

[0030] Its preparation method is (1) industrial pure tin (Sn: 99.95 wt%), industrial pure bismuth (Bi: 99.95 wt%) and indium pure zinc (Zn: 99.9 wt%), and indium, silver, magnesium, vanadium, Zirconium, gallium, and germanium metal were used to remove the oxide layer with 320 mesh sandpaper, respectively, in the blower drying case (40 ° C), the drying precision is carried out; (2) use graphite crucible for alloy casting, before use, 坩 坩, 渣Tools, clock-hood, etc. Cleaning in addition to impurities, then placed in a 40 ° C oven to remove moisture to remove moisture, raise the vacuum smelting furnace temperature gradient to 250 ° C, will account for 40% pure tin in total weight of pure tin at 250 ° C After the lower melting into the molten tank, the remaining pur...

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Abstract

The invention discloses a low-temperature lead-free solder alloy which is characterized by being prepared from the following components in percent by mass: 8-15% of Zn, 5-12% of Bi, 4-10% of In, 0.1-1.5% of Ag, 0.05-1% of Mg, 0.01-2% of M and the balance Sn and inevitable impurities, wherein the mass percent of Sn is not smaller than 58.5%, and M is RE or at least one of V, Zr, Ga and Ge. The Sn-based low-temperature alloy solder provided by the invention has excellent wettability and good mechanical properties, and the reliability of welding spots is enhanced. Meanwhile, by smelting the components in a vacuum condition, influence of oxidative burning loss and oxidizing slag in the smelting process of metals to reliability of the welding spots can be avoided. The low-temperature lead-freesolder alloy can be applied to welding electronic parts and components with the not high heating temperature, so that the demand on light and thin development of electronic products is met.

Description

Technical field [0001] The present invention relates to a highly reliable lead-free solder alloy and its vacuum casting preparation method, which belongs to the field of electronic product connection materials. Background technique [0002] With the continuous development and innovation of electron manufacturing technology, electronic products are increasingly developing less and more tiny trends. Since the substrate is short, the spacing of the solder joints is getting narrower, and the requirements for electronic packaging technologies are gradually improved, and the reliability of solder joints is critical, and people are more concerned about high-performance electronic package technology. During the manufacture of electronic products, the method of connecting the components and substrates is brazing, brazing, and directly affects the quality of welding quality, is a very important part. However, lead and its compounds are toxic and will cause damage to the health of the envir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B22D18/06
Inventor 彭巨擘唐芸生鲍庆煌张家涛普友福陈光云罗晓斌贾元伟梁华鑫郭绍雄
Owner 云南锡业集团(控股)有限责任公司研发中心
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