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A kind of highly water-soluble modified epoxy acrylic resin and preparation method thereof

A technology of epoxy acrylic acid and epoxy acrylate, which is applied in the direction of coating, etc., can solve the problems of insufficient hardness of the cured film, low water solubility of the resin, unstable storage, etc., to avoid the decline of physical and chemical properties, good hardness, and crosslinking high degree of effect

Active Publication Date: 2021-08-24
SHENZHEN POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The non-ionic type generally uses PEG as the hydrophilic group. There are reports on the self-emulsifying system of polyethylene glycol-modified acrylic polyurethane. Although the water-based polyurethane acrylate is very flexible after curing, the hardness of the cured film is not enough. limit its use
In the synthesis of these water-based resins, there are also few water-based functional groups in the resin, and the water-solubility of the resin is not high. Generally, the water content is below 30%. If the water content exceeds 30%, a turbid self-emulsifying system will generally be formed, and it is easy to Delamination phenomenon, unstable storage

Method used

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  • A kind of highly water-soluble modified epoxy acrylic resin and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0032] In the first step, add 250g of bisphenol A epoxy (epoxy E51) into a 500mL three-necked flask, heat the oil bath to 105°C, stir, and add acrylic acid (the molar ratio of epoxy group to acrylic acid is 1:1) Add a total mass of 0.8% catalyst N,N-diethylbenzylamine and 0.6% p-hydroxyanisole, and add it dropwise to the epoxy resin. After 4.5 hours of reaction, the acid value of the system is less than 3mgKOH / g, that is, the epoxy acrylic acid Ester ①; the second step, in a 1000mL three-necked flask, add 2mol of toluene diisocyanate (TDI), 38g of solvent ethylene glycol ether acetate, heated to 66 ° C, dibutyltin dilaurate by 0.6% of the total mass Add 1mol of 2,2-dimethylolbutyric acid, gradually add toluene diisocyanate (TDI) solution, and react for 3.5 hours to obtain water-based polyurethane segment ②; the third step is to synthesize the first step The epoxy acrylate ① is slowly added to the water-based polyurethane ② system synthesized in the second step, and the added a...

Embodiment 2

[0035] In the first step, add 450g of bisphenol A epoxy (epoxy E44) into a 1000mL three-necked flask, heat the oil bath to 115°C, stir, and add acrylic acid (the molar ratio of epoxy group to acrylic acid is 1:1) Add the total mass of 0.9% catalyst chromium trichloride and 0.6% p-hydroxyanisole, drop in the epoxy resin, and react for 4 hours, and the acid value of the system is less than 3mgKOH / g, to obtain epoxy acrylate ①; the second step , add 2mol of diphenylmethane diisocyanate (MDI) in a 1000mL three-necked flask, 35g of solvent propylene glycol methyl ether acetate, heat to 66 ° C, dibutyltin dilaurate is added to 1mol of 2,3-dihydroxypropionic acid, gradually added in diphenylmethane diisocyanate (MDI) solution, reacted for 3.5h to obtain water-based polyurethane segment; the third step, the epoxy acrylic acid synthesized in the first step The ester resin is slowly added to the water-based polyurethane system synthesized in the second step, and the amount of the epoxy ...

Embodiment 3

[0038] In the first step, add 500g of aliphatic epoxy resin into a 1000mL three-necked flask, heat the oil bath to 108°C, stir, and add a total mass of 0.5 % catalyst tetrabutylammonium bromide and 0.5% p-hydroxyanisole are added dropwise in the epoxy resin, and the acid value of the system is less than 3mgKOH / g after reacting for 3.5h to obtain epoxy acrylate ①; in the second step, Add 2mol of dicyclohexylmethane diisocyanate (HMDI) in the three-necked flask of 1000mL, 40g solvent propylene glycol butyl ether acetate, be heated to 76 ℃, dibutyltin dilaurate joins 1mol of 2 by 0.6% of gross mass, 2-Dihydroxymethylbutyric acid, gradually added in the dicyclohexylmethane diisocyanate (HMDI) solution, after reacting for 3.2h, the polyurethane segment that can be water-based is obtained; in the third step, the epoxy acrylic acid synthesized in the first step is Ester resin ① Slowly add to the water-based polyurethane system synthesized in the fourth step, the amount of epoxy acryl...

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Abstract

The invention discloses a highly water-soluble modified epoxy acrylic resin with polyurethane side chains and a preparation method thereof. The preparation method is to first synthesize epoxy acrylic ester; The polymer is grafted onto the main chain of epoxy acrylate, and the grafted resin is added into a concentrated alkaline solution to prepare a modified epoxy acrylic resin with high water solubility. The molecular structure of the resin contains multiple acrylate double bonds, which can be cured by ultraviolet light. The moisture content of the water-based resin of the present invention can reach more than 50%. In addition, the present invention grafts the polyurethane segment to the side chain of the epoxy acrylic resin, which can properly reduce the brittleness of the original acrylic epoxy resin after curing, and improve the hardness of the cured film. Flexibility, the elongation at break of the cured film is increased to more than 8%; the double bond density in the resin is higher than that of the cationic water-based epoxy acrylic resin, which can improve the gel rate and wear resistance during the curing process.

Description

technical field [0001] The invention relates to the technical field of organic polymer synthesis; in particular, it relates to a highly water-soluble modified epoxy acrylic resin and a preparation method thereof. Background technique [0002] Ultraviolet (UV) curing technology is an environmentally friendly curing technology. It refers to the photochemical reaction of the liquid coating after being irradiated by ultraviolet light, thereby causing polymerization, crosslinking, and rapid crosslinking into a solid film. Compared with traditional solvent-based coatings or adhesives, it has the following advantages: energy saving, energy consumption is about 1 / 5-1 / 10 of thermal curing coatings; no solvent emissions, safe and does not pollute the environment; fast curing speed (within 10s), high production efficiency, suitable for assembly line production; can coat heat-sensitive substrates; excellent coating performance, with good friction resistance, solvent resistance and stain...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G81/00C08G59/17C08G18/34C09D187/00
CPCC08G18/348C08G59/1466C08G81/00C09D187/005
Inventor 刘红波张霞隗晶晶严晓萍陈贤柔杨光照张武锋赖舜
Owner SHENZHEN POLYTECHNIC
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