A kind of anti-adhesive tape for composite material forming and its manufacturing method and application

Abstract

The invention provides a release tape for forming composite materials, a manufacturing method and application thereof. The release tape includes the following structures stacked in sequence: the first layer is a fluorine-containing resin layer, the second layer is a first adhesive layer, the third layer is a reinforcing material layer, and the fourth layer is a second adhesive layer, the bonding force between the first layer and the resin used for composite material molding is less than the 180-degree peel adhesion force of the fourth layer, and the first adhesive layer, the second adhesive layer The intermolecular cohesion is greater than the 180 degree peel adhesion of the fourth layer. The anti-adhesive tape of the present invention is easy to separate from the resin used for composite material molding when the mold is opened, and is convenient to completely separate from the mold when the tape is replaced, so that the service life of the mold is long, and the production efficiency of the composite material molding process can be greatly improved at the same time.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to a release adhesive tape for forming composite materials. The present invention also relates to the manufacturing method and application of the above-mentioned release tape. Background technique [0002] Composite materials, generally referring to polymer composite materials, are multi-phase system solid materials composed of matrix materials and reinforcing materials. It can give full play to the characteristics of each component material and present excellent properties that the original single material does not have. . Reinforcing materials for this type of composite include carbon fiber, aramid (Kevlar) fiber and glass fiber, and the matrix material is usually selected from thermoplastic or thermosetting resins such as epoxy, cyanate ester, phenolic resin, etc., wherein the thermosetting resin-based composite material is Currently the most researched and most widely used composite materia...

AI Technical Summary

Problems solved by technology

Since resins used in composite materials such as unsaturated polyester and epoxy resin have a certain degree of viscosity, they are easy to stick to the mold after being injected into contact with the mold. After high temperature curing, it will cause difficulty in demoulding and easily lead to damage to the mold.

In order to ensure simple and non-destructive demoulding, the mold usually needs to be sprayed with a release agent such as polyvinyl alcohol or silicone wax on its surface before use, but it has the following problems: 1) Some commonly used mold release agents are organic-based Solvent, smelly, highly toxic, and easy to pollute the environment when dried and evaporated; 2) Due to the presence of solvents, the release agent requires a relatively long drying and curing time, and the release agent needs to be sprayed again before each manufacturing cycle, so Before each cycle, it will cause a long shutdown, which greatly affects the production efficiency; 3) In order to apply the release agent evenly, a high requirement is placed on the surface smoothness of the mold. If the surface of the mold is not smooth enough, the release agent should be applied The cloth is uneven, and it is easy for the resin to deposit on individual parts of the mold; 4) It is easy to have the problem that the release agent is partially transferred to the part, which makes the subsequent processing such as surface coating difficult, and the release agent needs to be removed. also affect production efficiency

However, due to the rigidity and poor flexibility of the PTFE-treated glass fabric carrier, air bubbles are easily generated under the tape, and the common PTFE-coated glass fabric used in the mold is prone to the center of the tape being soaked by liquid resin, resulting in recycling. Reduced lifespan

In addition, the pressure-sensitive adhesives it uses sometimes show a dramatic increase in bond strength, resulting in high forces upon peeling, making the tape difficult to remove from the mold without leaving adhesive residue

[0005] The above-mentioned problems are particularly prominent in the preparation of large parts (such as structural parts such as vehicles, ships, aircraft, satellites, spacecraft, and large blades of wind power generation), and the problem of demoulding seriously affects production efficiency

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