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High heat conductivity copper clad laminate

A technology of copper clad laminates and high thermal conductivity, applied in the field of copper clad laminates, can solve the problems of inability to mass production, decreased light output efficiency, shortened service life, etc. The effect of thermal conductivity

Pending Publication Date: 2019-08-09
广州恒荣电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal materials have a high thermal conductivity, but the high thermal mismatch between it and the LED chip substrate is difficult to meet the packaging requirements of high-power LEDs
The thermal conductivity of composite materials is too low to solve the heat dissipation problem of high-power LEDs
With the development of process technology, the power of LED chips and the integration of packaging are getting higher and higher, and the heat flux density from the chip to the heat sink is also increasing. If the problem of heat dissipation is not solved, the accumulation of heat inside the chip will cause the junction temperature to rise continuously. , will cause a series of problems such as the drift of the emission wavelength, the accelerated aging of the phosphor, the decrease of the light extraction efficiency and the shortening of the service life.
The existing copper-clad substrates for packaging basically use metal as the heat dissipation carrier. The processing performance of the downstream PCB process is insufficient, and it cannot be mass-produced. The cost is high, and the existing PCB process capabilities cannot be utilized, resulting in high investment and low output.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Prepare the resin solution according to the formula in Table 1, impregnate the 1080 type E glass fiber cloth with a thickness of 60 μm with the prepared resin solution, the diameter of this glass fiber is 5 μm, and the weaving density is: 60 yarns / 25mm in the longitudinal direction and 46 yarns in the transverse direction / 25mm; drying at 120°C-160°C for 5-10 minutes to obtain a porous prepreg with a porosity of 75%.

[0037] Prepare the resin resin solution according to the formula in Table 2, and then evenly coat it on a polyester film with a thickness of 75 μm, and dry it at 120-140°C for 5-10 minutes to obtain a high thermal conductivity resin film of about 100 μm.

[0038] Such as figure 1 As shown, the high thermal conductivity resin film 2 is laminated on both sides of the multi-void prepreg 3. After lamination, a piece of 35 μm copper foil 1 is placed on the upper and lower sides. At 180°C, the pressure is 40kg / cm 2 Under the condition of heating and pressing ...

Embodiment 2

[0040] Prepare the resin solution according to the formula in Table 1, impregnate the 7628 type E glass fiber cloth with a thickness of 200 μm, the weaving density is: 60 yarns / 25mm in the longitudinal direction, 47 yarns / 25mm in the transverse direction, and the diameter of the glass fiber is 9 μm; ℃ drying for 5-10 minutes to obtain a porous prepreg with a porosity of 75%.

[0041] Prepare the resin resin solution according to the formula in Table 2, and then evenly coat it on a polyester film with a thickness of 75 μm, and dry it at 120-140°C for 5-10 minutes to obtain a high thermal conductivity resin film of about 100 μm.

[0042] Such as figure 1 As shown, the high thermal conductivity resin film 2 is laminated on both sides of the multi-void prepreg 3. After lamination, a piece of 35 μm copper foil 1 is placed on the upper and lower sides. At 180°C, the pressure is 40kg / cm 2 Under the condition of heating and pressing for 90 minutes, a high thermal conductivity copper...

Embodiment 3

[0044] Prepare the resin solution according to the formula in Table 1, impregnate the 1080 type E glass fiber cloth with a thickness of 60 μm with the prepared resin solution, and dry it at 120°C-160°C for 5-10 minutes to obtain a porosity of more than 75%. Void prepreg.

[0045] Prepare the resin resin solution according to the formula in Table 2, and then evenly coat it on a polyester film with a thickness of 75 μm, and dry it at 120-140°C for 5-10 minutes to obtain a high thermal conductivity resin film of about 100 μm.

[0046] Such as figure 1 As shown, the high thermal conductivity resin film 2 is laminated on both sides of the multi-void prepreg 3. After lamination, a piece of 35 μm copper foil 1 is placed on the upper and lower sides. At 180°C, the pressure is 40kg / cm 2 Under the condition of heating and pressing for 90 minutes, a high thermal conductivity copper clad laminate is made.

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Abstract

The invention discloses a high heat conductivity copper clad laminate. The high heat conductivity copper clad laminate comprises high heat conductivity resin film sheets, a porous prepreg, and copperfoils; the high heat conductivity resin film sheets are laminated on the two sides of the porous prepreg; the copper foils are laminated on the two sides of the high heat conductivity resin film sheets; and hot pressing moulding is carried out so as to obtain the high heat conductivity copper clad laminate. The high heat conductivity copper clad laminate is excellent in heat conductivity, thickness uniformity, insulation performance, and comprehensive performance, is used for upside-down mounting large power LED packaging, and the heat conduction coefficient is as high as 3W / m.k. The high heatconductivity copper clad laminate possesses better PCB processing performance; existing equipment can be adopted in production power; integration batch production can be realized; the preparation technology is simple; and performance is excellent.

Description

technical field [0001] The invention relates to a copper-clad laminate, in particular to a copper-clad laminate with high thermal conductivity. Background technique [0002] At present, LED packaging technology is mainly developed in the direction of high luminous efficiency, high reliability, high heat dissipation capacity and thinning. The development of packaging technology is mainly based on ceramic substrate packaging and flip chip. High thermal conductivity aluminum nitride substrate replaces ordinary packaging substrate. Copper clad sheet. Substrate material with high heat dissipation coefficient is an important part of LED packaging. As the main path of heat flow, the heat dissipation substrate is essential in the packaging application of high-power LEDs. It is essential for improving the heat dissipation efficiency of devices, reducing junction temperature and improving device reliability Speed ​​and longevity play a very important role. [0003] Existing products...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/04B32B17/10B32B15/09B32B15/20B32B27/36B32B33/00B32B37/06B32B37/10H05K1/02H05K1/03C08L63/00C08K3/22C08K7/14C08J5/24C08J7/04C08L67/00
CPCB32B5/024B32B15/09B32B15/20B32B27/12B32B33/00B32B37/06B32B37/10C08J5/24H05K1/0373H05K1/0203B32B2250/40B32B2255/10B32B2255/26B32B2260/021B32B2260/046B32B2262/101B32B2307/302B32B2307/206B32B2307/308B32B2307/536B32B2457/08C08J2363/00C08J2463/00C08K2003/2227C08K7/14C08J2367/00C08J7/0427
Inventor 蒋海明
Owner 广州恒荣电子科技有限公司
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