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A kind of phenyl vinyl siloxane resin, high refractive index LED encapsulation silicone resin composition and preparation method thereof

A technology of phenylvinylsiloxane and tetramethyldivinyldisiloxane, applied in high refractive index LED packaging silicone resin composition and its preparation, in the field of phenylvinylsiloxane resin, can solve the problem of Affect the brittleness of polysiloxane, the material is easy to yellow, etc., to achieve the effect of increased flexibility, simple process, and improved refractive index

Active Publication Date: 2022-03-08
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the increase of phenyl content will affect the brittleness of polysiloxane and make the material more prone to yellowing

Method used

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  • A kind of phenyl vinyl siloxane resin, high refractive index LED encapsulation silicone resin composition and preparation method thereof
  • A kind of phenyl vinyl siloxane resin, high refractive index LED encapsulation silicone resin composition and preparation method thereof
  • A kind of phenyl vinyl siloxane resin, high refractive index LED encapsulation silicone resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] This embodiment provides a phenyl vinyl siloxane resin, the preparation method of which is as follows.

[0093]Mix 50g of diphenyldimethoxysilane, 15g of methylvinyldimethoxysilane, 20g of octamethylcyclotetrasiloxane, and 5g of tetramethyldivinyldisiloxane in a round bottom flask , adding toluene to form a mixed solution with a monomer mass ratio of 50%, and adding 0.1 g of trifluoromethanesulfonic acid dropwise to make the solution acidic. At 40° C., slowly add pure water in an equimolar ratio to the reactive functional groups dropwise within 3 hours for hydrolysis reaction, and then hydrolyze for 1 hour after the dropwise addition is completed. Transfer the solution to a separatory funnel and wash with water until the solution is neutral. Use a rotary evaporator to remove the solvent and water under reduced pressure at 55°C, add 0.1% potassium hydroxide to adjust the pH, carry out the condensation reaction at 150°C for 2 hours, transfer to a separatory funnel and wa...

Embodiment 2

[0097] This embodiment provides a phenyl vinyl siloxane resin, the preparation method of which is as follows.

[0098] Mix 50g of diphenyldimethoxysilane, 15g of methylvinyldimethoxysilane, 20g of octamethylcyclotetrasiloxane, and 5g of tetramethyldivinyldisiloxane in a round bottom flask , adding toluene to form a mixed solution with a monomer mass ratio of 50%, and adding 0.1 g of trifluoromethanesulfonic acid dropwise to make the solution acidic. At 40° C., slowly add pure water in an equimolar ratio to the reactive functional groups dropwise within 3 hours for hydrolysis reaction, and then hydrolyze for 1 hour after the dropwise addition is completed. Transfer the solution to a separatory funnel and wash with water until the solution is neutral. Use a rotary evaporator to remove the solvent and water under reduced pressure at 55°C, add 0.1% potassium hydroxide to adjust the pH, carry out the condensation reaction at 150°C for 0.5h, transfer to a separatory funnel and wash...

Embodiment 3

[0100] This embodiment provides a phenyl vinyl siloxane resin, the preparation method of which is as follows.

[0101] Mix 50g of diphenyldimethoxysilane, 15g of methylvinyldimethoxysilane, 20g of octamethylcyclotetrasiloxane, and 5g of tetramethyldivinyldisiloxane in a round bottom flask , adding toluene to form a mixed solution with a monomer mass ratio of 50%, and adding 0.1 g of trifluoromethanesulfonic acid dropwise to make the solution acidic. At 40° C., slowly add pure water in an equimolar ratio to the reactive functional groups dropwise within 3 hours for hydrolysis reaction, and then hydrolyze for 1 hour after the dropwise addition is completed. Transfer the solution to a separatory funnel and wash with water until the solution is neutral. Use a rotary evaporator to remove the solvent and water under reduced pressure at 55°C, add 0.1% potassium hydroxide to adjust the pH, carry out the condensation reaction at 150°C for 5 hours, move to a separatory funnel and wash ...

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Abstract

The invention relates to a phenyl vinyl siloxane resin, a high refractive index LED encapsulating silicone resin composition and a preparation method thereof. The phenyl vinyl siloxane resin is prepared by the following method: S1: mix the monomers, add an organic solvent to obtain a mixed solution, add a hydrolysis catalyst; S2: add water dropwise at 0-60°C for hydrolysis reaction, wash, Suction filtration, adding an alkali catalyst to carry out condensation reaction at 120-160° C., washing, and suction filtration to obtain the phenyl vinyl siloxane resin. The phenyl vinyl siloxane resin provided by the invention has high refractive index, excellent flexibility and yellowing resistance; when used to prepare LED packaging silicone resin, it has high refractive index, excellent tensile strength, bonding strength, The light transmittance and anti-yellowing performance, some of which have reached or exceeded the level of similar imported products abroad, can meet the basic requirements of LED packaging; the packaged surface-mounted LED devices have excellent air tightness.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and in particular relates to a phenyl vinyl siloxane resin, a high refractive index LED packaging silicone resin composition and a preparation method thereof. Background technique [0002] A light emitting diode (Light Emitting Diode, hereinafter referred to as LED) is a semiconductor element that can directly convert electrical energy into light energy. Compared with incandescent or fluorescent lighting, it has the advantages of energy saving, low consumption, long life, environmental protection, controllable color, small size, etc. It is expected to replace traditional light sources as a new generation of lighting sources. The packaging materials used in LED lighting equipment are mainly epoxy resin and silicone resin. Compared with epoxy resin, silicone has many advantages: such as excellent UV aging resistance, weather resistance, thermal stability, high light transmittance and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/20C08L83/07C08L83/05C08L87/00
CPCC08G77/20C08L83/04C08L2205/025C08L2205/03C08L2203/206C08L87/00
Inventor 容敏智张泽平章明秋
Owner SUN YAT SEN UNIV
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