Porous polyimide film and preparation method and application thereof
A technology of polyimide film and polyamic acid, which is applied in the direction of electrical components, circuits, battery components, etc., can solve the problems of low porogen removal efficiency, long etching treatment time, and difficult process, and achieve Achieve large-scale industrial application, good wettability and good repeatability
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[0033] A kind of porous polyimide film preparation method of the present invention, comprises the following steps:
[0034] S1. Polycondensation of dibasic anhydrides and diamines in a polar solvent at low temperature, mechanically stirring for 18-20 hours to generate a precursor polyamic acid (PAA) solution, wherein the molar ratio of monomeric dibasic anhydrides to diamines is 1 :1;
[0035] The dibasic anhydrides are diphenylsulfone tetracarboxylic dianhydride, pyromellitic dianhydride, biphenyltetracarboxylic dianhydride, benzophenone tetraacid dianhydride, diphenylhexafluoroisopropyl tetraacid dianhydride, diphenylsulfide One or more of ether tetra-acid dianhydrides;
[0036] The diamines are m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenyl ether, 4,3'-diaminodiphenyl ether, 3,3'-diphenylenediamine, 4,4 One or more of '-diphenylfengdiamine.
[0037] The polar solvent is one or more of N,N-dimethylacetamide, N,N-dimethylformamide, and N-methylpyrrolidone.
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Embodiment 1
[0048] see figure 1 , Add 2.39g of 4,4'-diaminodiphenyl ether in a three-necked flask and dissolve it in 20.35g of N,N-dimethylacetamide, stir well, then add in batches a total mass of 2.61g of pyromellitic tetracarboxylic acid diphenyl ether anhydride, stirred at room temperature for 5h to obtain a PAA solution;
[0049] Weigh 3.50g of PAA solution and add 5% glycerin, stir well for 2h to obtain casting solution;
[0050] Leave the casting solution to stand or vacuum degassing, use a 100 μm scraper to obtain a film according to the conventional casting method, and then immerse it in an ethanol coagulation bath for 15 minutes, take out the film, dry it naturally, and put it in a muffle furnace for thermal imidization. According to the program of 100°C / 1h, 200°C / 1h, 300°C / 1h, stepwise heating and curing;
[0051] After the temperature dropped to room temperature, the film was peeled off from the glass plate to obtain a polyimide porous film with a thickness of 10 μm, a pore d...
Embodiment 2
[0054] see figure 2 , add 2.39g of 4,4'-diaminodiphenyl ether in a three-necked flask and dissolve it in 20.35g of N,N-dimethylacetamide, stir well, and then add in batches a total mass of 2.61g of pyromellitic tetracarboxylate Acid dianhydride, stirred at room temperature for 5h to obtain PAA solution;
[0055] Weigh 3.50g of PAA solution and add 20% dibutyl phthalate, fully stir for 2h to obtain casting solution;
[0056] Leave the casting solution to stand or vacuum degassing, use a 150 μm scraper to obtain a film according to the conventional casting method, and then immerse it in an ethanol coagulation bath for 25 minutes, take out the film, dry it naturally, and put it in a muffle furnace for thermal imidization. According to the program of 100°C / 1h, 200°C / 1h, 300°C / 1h, stepwise heating and curing;
[0057] After the temperature dropped to room temperature, the film was peeled off from the glass plate to obtain a polyimide porous film with a thickness of 25 μm, a pore...
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