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A preparation method of high-strength and high-conductivity anti-friction copper contact wire

A contact wire, high-conductivity technology, applied in conductors, conductive materials, conductive materials, etc., can solve problems such as insufficient wear resistance, and achieve the effects of short process, high efficiency and simple process

Active Publication Date: 2020-07-03
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, chromium-zirconium copper and dispersion-strengthened copper materials have insufficient wear resistance during use. The development of new copper-based materials with high strength, high conductivity, and excellent friction and wear properties is of great significance to the development of rail transit networks.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Example 1: Cu-0.1wt%MnS contact wire

[0019] The electrolytic copper plate and the electrolytic manganese are weighed in proportion, after non-vacuum melting, the Cu-0.1wt% Mn alloy powder is prepared by the water atomization process, and the atomized Cu-0.1wt% Mn alloy powder is placed in a hydrogen sulfide atmosphere. For vulcanization treatment, the vulcanization temperature is 300°C, the time is 20min, and the gas flow rate is 5l / min. After the vulcanization is completed, the powder is placed in a silica gel sheath for cold isostatic pressing, and the pressing pressure is 50 MPa, and the pressure holding time is 10 min to obtain a green body. The green body is sintered in an atmosphere of decomposing ammonia, the sintering temperature is 750°C, the temperature is kept for 10 hours, and the hot extrusion is performed online, and the contact wires of the required specifications are obtained by drawing. Its room temperature tensile strength is 465MPa, electrical conduct...

Embodiment 2

[0020] Example 2: Cu-1wt%MnS contact wire

[0021] Weigh the electrolytic copper plate and electrolytic manganese in proportion, prepare Cu-1wt% Mn alloy powder by a nitrogen atomization process after vacuum melting, and place the atomized Cu-1wt% Mn alloy powder in thiourea for liquid-phase vulcanization The curing temperature is 180℃, and the time is 120min. After the vulcanization is completed, the powder is placed in a silica gel sheath for cold isostatic pressing, the pressing pressure is 200 MPa, and the pressure holding time is 2 min to obtain a green body. The green body is in a vacuum environment (the vacuum degree is 10 -1 Pa) for sintering, the sintering temperature is 1050°C, the holding time is 0.5h, the hot extrusion is performed online, and the contact wire of the required specification is obtained by rolling. Its room temperature tensile strength is 513MPa, electrical conductivity is 84% ​​IACS, and friction coefficient is 0.16.

Embodiment 3

[0022] Example 3: Cu-5wt%MnS contact wire

[0023] The electrolytic copper plate and the electrolytic manganese are weighed in proportion, after vacuum melting, the Cu-5wt% Mn alloy powder is prepared by the argon atomization process, and the atomized Cu-5wt% Mn alloy powder is placed in sulfur for vulcanization treatment. The temperature is 600℃ and the time is 3h. After the vulcanization is completed, the powder is placed in a silicone sleeve for cold isostatic pressing and molding, the pressing pressure is 400 MPa, and the holding time is 10 s to obtain a green body. The green body is sintered in a hydrogen atmosphere, the sintering temperature is 850°C, the temperature is kept for 4 hours, and the hot extrusion is performed on-line, and the contact wires of the required specifications are obtained by rolling. Its room temperature tensile strength is 630MPa, conductivity is 76%IACS, and friction coefficient is 0.11.

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Abstract

The invention discloses a method for preparing a high-strength and high-conductivity anti-friction copper contact wire, which belongs to the technical field of powder metallurgy copper-based materials. The present invention uses copper-manganese alloy powder as raw material, performs vulcanization treatment in a medium containing a sulfur source, generates manganese sulfide nanoparticles in situ inside the copper-manganese alloy powder through high-temperature diffusion, and undergoes cold isostatic pressing and sintering-hot extrusion Manganese sulfide dispersion-strengthened copper contact wires were obtained by combination of pressure and densification process. The invention has simple preparation process, short process, low energy consumption, rich and easy-to-obtain raw materials, low cost, and is suitable for large-scale production; the prepared contact wire has room temperature tensile strength greater than 450 MPa, electrical conductivity greater than 75% IACS, and friction coefficient less than 0.2.

Description

Technical field [0001] The invention relates to a high-strength, high-conductivity, friction-reducing copper contact wire and a preparation method thereof, and belongs to the technical field of powder metallurgy copper-based materials. [0002] technical background [0003] With the continuous improvement of train speed, higher and higher requirements are put forward on the performance of contact wire materials for catenary. As a contact wire alloy material for railway electrification contact nets, the basic requirements are: high electrical conductivity, high tensile strength, high softening temperature, good fatigue resistance, good wear resistance and corrosion resistance, etc. . [0004] Among them, the wear performance of the contact wire is a key indicator that characterizes the actual service life and safety evaluation of the contact wire. Various countries are conducting research on the wear performance of the contact wire. At present, the most researched high-strength, hig...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/05C22C32/00C22C1/10C22C1/04B22F1/00B22F3/04B22F3/10B22F3/20B22F9/08H01B1/02
CPCC22C9/05C22C32/0089C22C1/10B22F9/082B22F3/04B22F3/10B22F3/20H01B1/026B22F2003/208B22F2998/10B22F1/145
Inventor 陈存广李沛郭志猛杨芳王雯雯路新陆天行冯娜
Owner UNIV OF SCI & TECH BEIJING
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