A kind of sodium gold sulfite plating solution and electroplating method thereof

Abstract

A sodium gold sulfite plating solution and an electroplating method thereof. The present invention relates to the field of gold plating solutions. In order to find a gold plating solution that does not contain cyanide ions and has stable properties to replace the cyanide gold plating process and reduce the harm to the environment and operators, At the same time, the chemical and physical properties of the plating solution are stable, which can meet the needs of transportation and storage. The invention proposes a cyanide-free gold plating solution. The sodium gold sulfite plating solution includes gold sulfite, complexing agent, conductive agent, current stabilizer and buffer solution. The beneficial effects of the present invention are: the gold ions in the solution are more stable, and the storage time of the plating solution is longer; the addition of a brightener in the composition makes the surface of the gold-plated layer more fine and smooth, the gaps are reduced, and the surface gloss of the gold-plated layer is better; the composition The dispersant is added to the plating solution, the stability, dispersion and uniformity of the plating solution are good, the cathode current efficiency is high, the welding performance of the coating is good, the corrosion resistance is good, and the bonding force is good.

Description

technical field [0001] The invention relates to a sodium gold sulfite plating solution, relates to the field of gold plating solutions, in particular to a sodium gold sulfite gold plating solution composition and a use method thereof. [0002] technical background [0003] Gold has a golden yellow metallic luster, low hardness, good ductility, stable chemical properties, good conductivity and heat, so it is widely used in electrical appliances, sockets, circuit boards, decorations and other fields. Gold has limited storage in the world and is a scarce resource. In the process of use, gold electroplating is usually used to obtain the excellent properties of metallic gold. [0004] During the electroplating process, the basic reaction process of gold is as follows: trivalent gold obtains two electrons and is reduced to monovalent gold, and monovalent gold obtains one more electron and is reduced to elemental gold. In the absence of a complex stabilizer for gold ions, monovalen...

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Problems solved by technology

[0005] At present, many non-cyanogen gold salts are mostly trivalent gold, such as common gold trichloride and aluminum alloy salts. In order to achieve the reaction potential, more reducing agent needs to be added. First, the more impurities are introduced, the more difficult it is to obtain a pure gold coating. Second, adding more reducing agent will easily cause disproportionation reaction, which is not conducive to the stability of the plating solution. Long-term preservation

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