Copper-based modified graphene oxide composite material with high thermal conductivity and preparation method thereof

A composite material and high thermal conductivity technology, applied in the direction of electrolytic coating, electrophoretic plating, coating, etc., can solve the problems of weakened metal machining performance, different material properties, and environmental pollution, so as to reduce thermal contact resistance and heat dissipation. Effects of boundary resistance, improved thermal conductivity, and excellent thermal conductivity
CN110468441BActive Publication Date: 2021-07-16GUANGXI NORMAL UNIV
0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
GUANGXI NORMAL UNIV
Publication Date
2021-07-16

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention provides a copper-based modified graphene oxide composite material with high thermal conductivity and a preparation method thereof, belonging to the technical field of composite materials. In the present invention, a silane coupling agent is used to modify the surface of graphene oxide to obtain a silane coupling agent-graphene oxide product; finally, an electrophoretic deposition method is adopted to prepare a layer of controllable silane coupling agent modification on the conductive substrate aluminum. Graphene / aluminum composites. The prepared silane coupling agent modified graphene / copper alloy composite material is evenly distributed and does not contain other impurities, can significantly improve the thermal conductivity of the copper matrix, and the obtained composite material has potential application value in heat dissipation materials.
Need to check novelty before this filing date? Find Prior Art

Description

【Technical field】

[0001] The invention relates to the technical field of composite materials, in particular to a copper-based modified graphene oxide composite material with high thermal conductivity and a preparation method. 【Background technique】

[0002] Efficient heat dissipation is very important for electronic equipment. If the heat cannot be dissipated in time, the local temperature of the equipment will be too high, which will reduce the reliability and service life of the equipment. Metals and alloys have good thermal conductivity, electrical conductivity and machinability, and are often used as thermal conductive materials. However, with the development of electronic devices towards high power and high integration, the original heat conduction of metals and their alloys can no longer fully meet the heat dissipation requirements of equipment, so a more efficient heat conduction material is urgently needed.

[0003] One way to improve the heat dissipation of metal h...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More