Copper-based modified graphene oxide composite material with high thermal conductivity and preparation method thereof

A composite material and high thermal conductivity technology, applied in the direction of electrolytic coating, electrophoretic plating, coating, etc., can solve the problems of weakened metal machining performance, different material properties, and environmental pollution, so as to reduce thermal contact resistance and heat dissipation. Effects of boundary resistance, improved thermal conductivity, and excellent thermal conductivity

Active Publication Date: 2021-07-16
GUANGXI NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the above two methods also have shortcomings. For the first method, it is mainly reflected in: 1) the cost advantage will be lost if the second heat conduction phase is added too much; 2) the machinability of the metal after the second heat conduction phase is added 3) The preparation process is complex and polluting to the environment; for the second method, it is mainly reflected in: 1) There are micron-scale gaps between the coating and the substrate, resulting in thermal contact resistance; 2) Forming a two-phase interface The nature of the material differs from the thermal boundary resistance resulting from phonon or electron scattering processes

Method used

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  • Copper-based modified graphene oxide composite material with high thermal conductivity and preparation method thereof
  • Copper-based modified graphene oxide composite material with high thermal conductivity and preparation method thereof
  • Copper-based modified graphene oxide composite material with high thermal conductivity and preparation method thereof

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Embodiment 1

[0034] Using H96 brass as the substrate, using the silane coupling agent KH560 modified graphene oxide as the thermal conductivity enhancing phase, the copper-based modified graphene oxide composite material of the present invention is prepared by pulse electrophoretic deposition, specifically comprising the following steps:

[0035](1) Pretreatment of copper alloy: the quality index of Cu alloy raw material is, in terms of mass percentage: copper 95%, impurity≤0.2%, and the balance is zinc; first, H96 copper alloy is ultrasonically cleaned in clear water, and then Ultrasonic cleaning was carried out in anhydrous ethanol solution to remove impurities attached to the surface; then the copper alloy substrate was degreased in a sodium carbonate solution with a mass fraction of 15% at 55°C for 3 minutes, and then rinsed with clean water; then the copper alloy substrate was placed in The mass fraction is 30% in dilute nitric acid solution for 3 minutes, and then rinsed with water; t...

Embodiment 2

[0040] Using H96 brass as the substrate, using the silane coupling agent KH560 modified graphene oxide as the thermal conductivity enhancing phase, the copper-based modified graphene oxide composite material of the present invention is prepared by pulse electrophoretic deposition, specifically comprising the following steps:

[0041] (1) Pretreatment of copper alloy: the quality index of Cu alloy raw material is, in terms of mass percentage: copper 96%, impurity≤0.2%, and the balance is zinc; first, H96 copper alloy is ultrasonically cleaned in clear water, and then Ultrasonic cleaning was carried out in absolute ethanol solution to remove impurities attached to the surface; then the copper alloy substrate was degreased in a sodium carbonate solution with a mass fraction of 18% at 60°C for 2.5 minutes, and then rinsed with clean water; then the copper alloy substrate Remove impurities in 35% dilute nitric acid solution for 2.5 minutes, then rinse with clean water; then polish t...

Embodiment 3

[0046] Using H96 brass as the substrate, using the silane coupling agent KH560 modified graphene oxide as the thermal conductivity enhancing phase, the copper-based modified graphene oxide composite material of the present invention is prepared by pulse electrophoretic deposition, specifically comprising the following steps:

[0047] (1) Pretreatment of copper alloy: the quality index of Cu alloy raw material is, in terms of mass percentage: copper 97%, impurity≤0.2%, and the balance is zinc; first, H96 copper alloy is ultrasonically cleaned in clear water, and then Ultrasonic cleaning was carried out in absolute ethanol solution to remove impurities attached to the surface; then the copper alloy substrate was degreased in a 65°C sodium carbonate solution with a mass fraction of 20% for 2 minutes, and then rinsed with clean water; then the copper alloy substrate was placed in The mass fraction is 40% dilute nitric acid solution for 2 minutes, and then rinsed with clean water; t...

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Abstract

The invention provides a copper-based modified graphene oxide composite material with high thermal conductivity and a preparation method thereof, belonging to the technical field of composite materials. In the present invention, a silane coupling agent is used to modify the surface of graphene oxide to obtain a silane coupling agent-graphene oxide product; finally, an electrophoretic deposition method is adopted to prepare a layer of controllable silane coupling agent modification on the conductive substrate aluminum. Graphene / aluminum composites. The prepared silane coupling agent modified graphene / copper alloy composite material is evenly distributed and does not contain other impurities, can significantly improve the thermal conductivity of the copper matrix, and the obtained composite material has potential application value in heat dissipation materials.

Description

【Technical field】 [0001] The invention relates to the technical field of composite materials, in particular to a copper-based modified graphene oxide composite material with high thermal conductivity and a preparation method. 【Background technique】 [0002] Efficient heat dissipation is very important for electronic equipment. If the heat cannot be dissipated in time, the local temperature of the equipment will be too high, which will reduce the reliability and service life of the equipment. Metals and alloys have good thermal conductivity, electrical conductivity and machinability, and are often used as thermal conductive materials. However, with the development of electronic devices towards high power and high integration, the original heat conduction of metals and their alloys can no longer fully meet the heat dissipation requirements of equipment, so a more efficient heat conduction material is urgently needed. [0003] One way to improve the heat dissipation of metal h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D13/04C25D13/18C25D13/20C22C9/04C23G1/10
CPCC22C9/04C23G1/103C25D13/04C25D13/18C25D13/20
Inventor 黄有国王少伊王红强李庆余傅浩丘志安
Owner GUANGXI NORMAL UNIV
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