Electronic pouring sealant and preparation method thereof

A potting and electronic technology, used in the field of sealants, can solve the problems of low requirements for equipment and reaction conditions, poor flame retardancy and bonding performance, low thermal conductivity, etc., and does not meet the requirements of equipment and reaction conditions. , excellent thermal conductivity and flame retardant performance, excellent comprehensive performance

Inactive Publication Date: 2019-12-10
孙培丽
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the defects in the prior art, the present invention provides an electronic potting glue and a preparation method thereof, the preparation method is simple and easy, the raw materials are easy to obtain, the price is low, the requirements for equipment and reaction conditions are not high, and it is suitable for industrial production; The electronic potting adhesive prepared by the preparation method overcomes the more or less low thermal conductivity, poor flame retardancy and bonding performance, easy yellowing, complex potting process, and high price of traditional potting adhesives. Defects, high temperature resistance, insulation, sealing, waterproof, thermal conductivity and flame retardancy are more excellent

Method used

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  • Electronic pouring sealant and preparation method thereof

Examples

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Effect test

Embodiment 1

[0029] An electronic potting glue, which is composed of component A and component B in a weight ratio of 100:90, and the component A includes raw materials in the following weight ratio: 50 parts of modified vinyl silicone oil, silicon dioxide modified Cu - 5 parts of Al-O-B, 1 part of γ-aminopropyltriethoxysilane; the B component includes the following raw materials in weight ratio: 45 parts of dibromoneopentyl glycol diglycidyl ether, silica modified 5 parts of Cu-Al-O-B, 1 part of γ-(2,3-glycidoxy)propyltrimethoxysilane.

[0030] The preparation method of the modified vinyl silicone oil comprises the following steps: under a nitrogen atmosphere, mix 20 g of vinyl silicone oil with 1,1-dicyano-2-methoxy-4-dimethylamino-1,3 - Add 10g of butadiene into a three-neck flask equipped with a reflux condenser and an electric stirrer, then add 50g of isopropanol into the bottle, and reflux and stir the reaction at 125°C for 2 hours, then spin evaporate to remove the solvent, and obta...

Embodiment 2

[0037]An electronic potting glue, which is composed of component A and component B in a weight ratio of 100:95, and the component A includes raw materials in the following weight ratio: 53 parts of modified vinyl silicone oil, silicon dioxide modified Cu -6 parts of Al-O-B, 2 parts of γ-(methacryloyloxy)propyltrimethoxysilane; the B component includes raw materials in the following weight ratio: 47 parts of dibromoneopentyl glycol diglycidyl ether, Silica-modified Cu-Al-O-B 7 parts, γ-aminopropyltriethoxysilane 2 parts.

[0038] The preparation method of the modified vinyl silicone oil comprises the following steps: under a helium atmosphere, mix 23 g of vinyl silicone oil with 1,1-dicyano-2-methoxy-4-dimethylamino-1, Add 10 g of 3-butadiene into a three-necked flask equipped with a reflux condenser and an electric stirrer, then add 60 g of acetone into the bottle, and reflux and stir the reaction at 128°C for 2.3 hours, then remove the solvent by rotary evaporation to obtain ...

Embodiment 3

[0045] An electronic potting glue, which is composed of component A and component B in a weight ratio of 100:100; the component A includes raw materials in the following weight ratio: 56 parts of modified vinyl silicone oil, silicon dioxide modified Cu - 8 parts of Al-O-B, 3 parts of γ-(2,3-glycidyloxy) propyltrimethoxysilane; the B component includes raw materials in the following weight ratio: dibromoneopentyl glycol diglycidyl ether 51 parts, 8 parts of silica-modified Cu-Al-O-B, 2 parts of γ-aminopropyltriethoxysilane;

[0046] The preparation method of the modified vinyl silicone oil comprises the following steps: under a neon gas atmosphere, mix 26 g of vinyl silicone oil with 1,1-dicyano-2-methoxy-4-dimethylamino-1, Add 10 g of 3-butadiene into a three-necked flask equipped with a reflux condenser and an electric stirrer, then add 70 g of dichloromethane into the bottle, reflux and stir the reaction at 130 ° C for 2.6 hours, and then spin evaporate to remove the solvent...

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Abstract

The invention discloses an electronic pouring sealant which is composed of a component A and a component B with the weight ratio of 100:(90-110). The component A includes the following raw materials by weight: 50-60 parts of modified vinyl silicone oil, 5-10 parts of Cu-Al-O-B modified by silica, and 1-3 parts of a coupling agent A. The component B includes the following raw materials by weight: 45-55 parts of dibromoneopentyl glycol diglycidyl ether, 5-10 parts of Cu-Al-O-B modified by silica and 1-3 parts of a coupling agent B. The invention also discloses a preparation method of the electronic pouring sealant, wherein the preparation method includes the following steps: preparation of the component A, preparation of the component B and preparation of the pouring sealant finished product. The electronic pouring sealant provided by the invention has more excellent high temperature resistant, insulation, sealing, waterproofing and heat conduction performance and flame retardancy.

Description

technical field [0001] The invention relates to the technical field of sealants, in particular to an electronic potting glue and a preparation method thereof. Background technique [0002] In recent years, electronic products have gradually entered people's lives and become a part of people's lives. With the advancement of science and technology and the expansion of application scope, the requirements for electronic products are getting higher and higher. Lightweight, high performance and high standardization are the development trends of electronic products. To meet these requirements for electronic products, the electronic potting adhesive used for bonding, sealing, potting and coating protection of electronic components must have excellent high and low temperature resistance, waterproof and moisture-proof performance, dust-proof performance, mechanical properties, thermal conductivity Performance, electrical insulation performance, anti-corrosion and anti-shock performan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/08C09J11/04C09J11/06C09J9/00C08G77/388
CPCC08G77/388C09J9/00C09J11/04C09J11/06C09J183/08C08K9/02C08K5/544C08K3/38C08K5/1515
Inventor 孙培丽
Owner 孙培丽
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