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Heat-conducting low-temperature co-fired ceramic material and preparation method thereof

A technology of low-temperature co-fired ceramics and alumina ceramic powder, which is applied in the field of thermally conductive low-temperature co-fired ceramic materials and its preparation, can solve the problems of inability to obtain thermally conductive products, restrict the scope of application, and poor thermal conductivity of products, and achieve Low cost, simple process, improved thermal conductivity and dielectric properties

Pending Publication Date: 2020-01-14
HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although this product reduces the sintering temperature of the green body and shortens the sintering time, it has shortcomings with its preparation method. First, the thermal conductivity of the product is not good, which limits the scope of application, especially for relatively large When packaging high-power circuits; secondly, the preparation method is not only too complicated, but also cannot obtain products with high thermal conductivity

Method used

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  • Heat-conducting low-temperature co-fired ceramic material and preparation method thereof
  • Heat-conducting low-temperature co-fired ceramic material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0047] In step 1, the molar ratio of bismuth trioxide, boron oxide, silicon oxide, zinc oxide and aluminum oxide is 1:0.1:0.2:0.5:0.2, and the mixture is obtained. Then the mixture was melted at 900°C, and quenched with water to obtain Bi-based glass slag.

[0048] In step 2, the Bi-based glass slag is ball-milled into Bi-based glass powder with a particle size of 360nm. This was then mixed with alumina ceramic powder having a particle diameter of 2 μm to obtain a mixed powder.

[0049]Step 3: Firstly, according to the weight ratio of Bi-based glass powder, solvent and dispersant in the mixed powder as 1:0.1:0.1, the mixed powder, solvent and dispersant are jointly ball milled for 2 hours; wherein, the solvent is ethanol, and the dispersed The agent is castor oil to obtain a uniformly dispersed slurry. Then according to the ratio of Bi-based glass powder, binder, plasticizer and leveling agent in the uniformly dispersed slurry, the weight ratio is 1:0.05:0.2:0.005, for the u...

Embodiment 2

[0052] In step 1, the molar ratio of bismuth trioxide, boron oxide, silicon oxide, zinc oxide and aluminum oxide is 1:0.3:0.16:0.63:0.15, and the mixture is obtained. Then the mixture was melted at 975°C, and quenched with water to obtain Bi-based glass slag.

[0053] In step 2, the Bi-based glass slag is ball-milled into Bi-based glass powder with a particle size of 370nm. This was then mixed with alumina ceramic powder having a particle diameter of 1.8 μm to obtain a mixed powder.

[0054] Step 3: First, according to the weight ratio of Bi-based glass powder, solvent and dispersant in the mixed powder in a ratio of 1:0.5:0.078, the mixed powder, solvent and dispersant are jointly ball milled for 4.5 hours; wherein, the solvent is ethanol, The dispersant is castor oil to obtain a uniformly dispersed slurry. Then according to the weight ratio of Bi-based glass powder, binder, plasticizer and leveling agent in the uniformly dispersed slurry is 1:0.063:0.18:0.016, the uniforml...

Embodiment 3

[0057] In step 1, the molar ratio of bismuth trioxide, boron oxide, silicon oxide, zinc oxide and aluminum oxide is 1:0.6:0.13:0.75:0.1, and the mixture is obtained. Then the mixture was melted at 1050°C, and then quenched with water to obtain Bi-based glass slag.

[0058] In step 2, the Bi-based glass slag is ball-milled into Bi-based glass powder with a particle size of 380nm. This was then mixed with alumina ceramic powder having a particle diameter of 1.5 μm to obtain a mixed powder.

[0059] Step 3, according to the weight ratio of the Bi-based glass powder, solvent and dispersant in the mixed powder is 1:1.05:0.055, the mixed powder, solvent and dispersant are jointly ball milled for 7 hours; wherein, the solvent is ethanol, dispersed The agent is castor oil to obtain a uniformly dispersed slurry. Then according to the weight ratio of Bi-based glass powder, binder, plasticizer and leveling agent in the uniformly dispersed slurry is 1:0.075:0.15:0.028, the uniformly dis...

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Abstract

The invention discloses a heat-conducting low-temperature co-fired ceramic material and a preparation method thereof, wherein the material comprises, by weight, 100 parts of Bi-based glass, 80-150 parts of aluminum oxide ceramic powder and less than or equal to 3 parts of carbide, wherein the particle size of the aluminum oxide ceramic powder is 1-2 [mu]m. The method comprises: mixing bismuth trioxide, boron oxide, silicon oxide, zinc oxide and aluminum oxide, melting, and carrying out water-cooling quenching; carrying out ball milling on obtained Bi-based glass residue into powder, and mixingwith aluminum oxide ceramic powder; sequentially carrying out joint ball milling on the obtained mixed powder, a solvent, a dispersing agent, a binding agent, a plasticizer and a homogenizing agent;and carrying out casting molding on the obtained stable and uniform slurry in a mold, drying, sequentially placing the obtained raw ceramic sheet at 300-600 DEG C to remove organic additives, and carrying out sintering molding at 800-950 DEG C to obtain the target product. According to the invention, the heat-conducting low-temperature co-fired ceramic material has characteristics of significantlyincreased heat-conducting property and significantly improved dielectric property, and is easily, widely and commercially applied to the field of electronic packaging.

Description

technical field [0001] The invention relates to a ceramic material and a preparation method, in particular to a thermally conductive low-temperature co-fired ceramic (LTCC) material and a preparation method thereof. Background technique [0002] With the rapid development of the information industry, people have put forward higher and higher requirements for the miniaturization, integration and portability of electronic products. In order to modularize and highly integrate electronic components and circuits, it is necessary to further increase the assembly density of circuits and the stability of the system. Low-temperature co-fired ceramics is a technology that prints interconnected conductors, components and circuits on unsintered cast ceramic materials, laminates them and presses them together, and then sinters them into an integrated ceramic multilayer material. goals provide practical solutions. Recently, people have made unremitting efforts to obtain low-temperature ...

Claims

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Application Information

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IPC IPC(8): C04B35/10C04B35/622C04B35/638C03C3/066
CPCC03C3/066C04B35/10C04B35/622C04B35/638C04B2235/365C04B2235/6025C04B2235/6567
Inventor 陈林冯祥艳丁建军李潇潇孙俊郑康张献王化田兴友
Owner HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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