The invention discloses a heat-conducting low-temperature co-fired
ceramic material and a preparation method thereof, wherein the material comprises, by weight, 100 parts of Bi-based glass, 80-150 parts of aluminum
oxide ceramic powder and less than or equal to 3 parts of
carbide, wherein the particle size of the aluminum
oxide ceramic powder is 1-2 [mu]m. The method comprises: mixing
bismuth trioxide,
boron oxide,
silicon oxide,
zinc oxide and aluminum oxide, melting, and carrying out water-cooling
quenching; carrying out ball milling on obtained Bi-based glass residue into
powder, and mixingwith aluminum
oxide ceramic powder; sequentially carrying out joint ball milling on the obtained mixed powder, a
solvent, a dispersing agent, a binding agent, a
plasticizer and a homogenizing agent;and carrying out
casting molding on the obtained stable and uniform
slurry in a mold,
drying, sequentially placing the obtained raw ceramic sheet at 300-600 DEG C to remove organic additives, and carrying out
sintering molding at 800-950 DEG C to obtain the target product. According to the invention, the heat-conducting low-temperature co-fired ceramic material has characteristics of significantlyincreased heat-conducting property and significantly improved
dielectric property, and is easily, widely and commercially applied to the field of
electronic packaging.