A kind of bonding silver wire material with high spheroidity and preparation method thereof

Abstract

The invention belongs to the technical field of bonding wire materials, and relates to a high spherical bonding silver wire material and a preparation method thereof. The composition of the material comprises silver 99%±0.2%, nickel 0.4%±0.04%, and cobalt 0.4% ±0.05%, calcium 0.01%±0.001%, copper 0.01%±0.001%, gold 0.03%±0.004%, palladium 0.03%±0.004%, lanthanum 0.01%±0.001% and lead 0.0025%±0.0005%, also including other trace amounts The elements include one or more of indium, cerium, yttrium, and selenium. The preparation method of the bonding silver wire material of the present invention makes each metal component melt and synthesizes separately by steps, so that the crystal grains of each component are fully matched during the synthesis process of the bonding silver wire material, and the spheroidization of the synthesized bonding silver wire is improved. , in order to improve the chemical stability and mechanical properties of the alloy wire material.

Description

technical field [0001] The invention belongs to the technical field of bonding wire materials, and in particular relates to a bonding silver wire material with high ball forming property and a preparation method thereof. Background technique [0002] In recent years, the development of semiconductors has attracted more and more attention, and its development has become more and more rapid. The integration requirements of integrated circuits have become higher and higher. Therefore, the requirements for the chemical and mechanical properties of bonding gold wire materials are also very high. Under normal circumstances, the bonding gold wire needs to have high electrical conductivity, excellent chemical stability and plasticity, and must also have a specified tensile strength and elongation. The ideal bonding gold wire material generally has the following characteristics: the bonding gold wire can be combined with The lead material outside the pad achieves good bonding; the bo...

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Problems solved by technology

[0004] In the current research progress on bonding wire materials, the development of bonding copper wire products is relatively good. Although the price of bonding copper wire products has an advantage, it has problems such as poor oxidation resistance and insufficient mechanical properties, which will affect the use. The stability and working efficiency of the components increase the production cost and use cost, and the high hardness will cause damage to the chip and affect the yield

[0005] Metal silver has the characteristics of excellent electrical conductivity, its resistivity is 1.586μΩ·cm, which is the smallest among all metals, and it also has relatively good heat dissipation performance, but pure silver is easily oxidized in the atmosphere, and when it is melted into a ball, the surface of the ball is not smooth As a result, its service life is not long, and the mechanical properties of pure silver are relatively poor, and its ductility is poor.

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