Production process of electrodeposited copper foil with shiny surface subjected to roughening

Abstract

The invention discloses a production process of electrodeposited copper foil with a shiny surface subjected to roughening. The copper foil is subjected to acid pickling, roughening I, curing I, roughening II, curing II, curing III, curing IV, high-temperature anti-oxidation, water washing I, normal-temperature anti-oxidation, water washing II, silane spraying and drying in sequence; and the process conditions of the roughening I and the roughening II are that the current densities is 28 A / dm<2>-33 A / dm<2>, the temperature is 25 DEG C-35 DEG C, the sulfuric acid concentration is 160 g / l-180 g / l, the copper ion concentration is 7 g / l-13 g / l, the chloride ion concentration is 15 mg / l-30 mg / l, the sodium tungstate concentration is 0 mg / l-90 mg / l, the sodium molybdate concentration is 0 mg / l-70mg / l, and the cobalt sulfate concentration is 0 g / l-45 g / l. According to the process, tungsten, cobalt and molybdenum elements are added in the roughening procedures, so that the surface morphology of the copper foil is improved, and the anti-stripping strength of the electrodeposited copper foil is improved; and elements such as lanthanum or cerium are added in the high-temperature anti-oxidation process to form a special plating layer, and the structural morphology of the plating layer is changed, so that the anti-stripping strength and the corrosion resistance of the electrodeposited copper foil are improved.

Description

technical field [0001] The invention relates to a production process of electrolytic copper foil, in particular to a production process of smooth surface roughened electrolytic copper foil, and belongs to the field of high-precision electrolytic copper foil preparation. Background technique [0002] With the development of electronic information technology, multi-layer complex or high-density thin circuit PCB boards are increasingly used in high-precision miniaturized electronic products. Traditional methods usually use high-precision electronic copper foil or double-sided roughened electrolytic copper foil for high-precision electronic products. Density fine line PCB board or multi-layer complex PCB board inner layer, the use of traditional high-precision electrolytic copper foil side requires complex processes such as corrosion and blackening after pressing the board, the production process is long and the cost is high; the use of double-sided roughened electrolytic copper ...

AI Technical Summary

Problems solved by technology

However, with the gradual increase in the current requirements for the peeling resistance of PCB boards, the peeling resistance of the electrolytic copper foil of the above process can no longer meet the current needs. Therefore, it is necessary to develop a new production process for smooth and roughened electrolytic copper foil. To improve the peeling resistance of smooth copper foil after roughening

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