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Flexible circuit board and manufacturing method thereof

A flexible circuit board and manufacturing method technology, applied in printed circuit manufacturing, printed circuit dielectric, printed circuit and other directions, can solve the problems of increasing transmission loss, high process difficulty, affecting electrical properties, etc. Effect

Active Publication Date: 2020-03-03
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The substrate material of the circuit board is the key to the high frequency of circuit signal transmission, especially the copper clad substrate material technology. The dielectric loss factor (Df) and relative dielectric constant (Dk) of the existing polyimide substrate material are relatively high. High, even if the circuit design is improved, it is not easy to fully meet the application requirements of high-speed signal transmission and signal integrity at all high frequencies, because high DK will slow down the signal transmission rate, and high Df will cause part of the signal to be converted into heat energy loss in the substrate material , plus the material is easy to absorb moisture in the manufacturing process and affect the electrical properties, which increases the transmission loss
Liquid crystal polymers have good electrical properties, but the manufacturing process is difficult, which reduces the production efficiency

Method used

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  • Flexible circuit board and manufacturing method thereof
  • Flexible circuit board and manufacturing method thereof
  • Flexible circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Embodiment 1: configuration viscosity is the following solution of 5000CPS, wherein, the solvent of described following solution is carbitol acetate, weighs respectively the fluorinated cycloaliphatic modified polyamic acid of 52.8g, the quality of 13.2g Silsesquioxane modified polyamic acid, carboxy-modified polyphenylene ether with a quality of 11.5g, bisphenol F type epoxy resin with a quality of 10.3g, N-beta (aminoethyl)- γ-Aminopropyltrimethoxysilane, silica filler with a quality of 9.5g and hexaphenoxycyclotriphosphazene with a quality of 15g are put into a container, and then a predetermined volume of carbitol acetate is poured into Place the following solution in the container and stir.

Embodiment 2

[0053] Embodiment 2: configuration viscosity is the following solution of 5000CPS, wherein, the solvent of described following solution is carbitol acetate, weighs respectively the fluorinated cycloaliphatic modified polyamic acid of 39.6g, the quality of 26.4g Silsesquioxane modified polyamic acid, carboxy-modified polyphenylene ether with a quality of 11.3g, bisphenol F type epoxy resin with a quality of 10.3g, N-beta (aminoethyl)- γ-Aminopropyltrimethoxysilane, silica filler with a quality of 9.5g and hexaphenoxycyclotriphosphazene with a quality of 15g are put into a container, and then a predetermined volume of carbitol acetate is poured into Place the following solution in the container and stir.

Embodiment 3

[0054] Embodiment 3: configuration viscosity is the following solution of 5000CPS, wherein, the solvent of described following solution is carbitol acetate, weighs the fluorocycloaliphatic modified polyamic acid of 33g respectively, the quality is 33g half and a half times Siloxane-modified polyamic acid, carboxy-modified polyphenylene ether with a mass of 11.1g, bisphenol F-type epoxy resin with a mass of 10.3g, N-β (aminoethyl)-γ- with a mass of 0.7g Aminopropyltrimethoxysilane, 9.5g of silica filler and 15g of hexaphenoxycyclotriphosphazene in a container are put into a container, and then a predetermined volume of carbitol acetate is poured into the container and stir to form the following solution.

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Abstract

The invention provides a manufacturing method for a flexible circuit board. The manufacturing method comprises the following steps: a substrate is provided; the two opposite surfaces of the substrateare coated with an adhesion solution in a coating manner, and two adhesion layers are formed through drying treatment, wherein the adhesion solution contains an adhesion agent and a solvent, and the viscosity of the adhesion solution being 5000 mPa.s; a first copper layer and a second copper layer are respectively formed on the surface, deviating from the substrate, of each adhesion layer; the first copper layer and the second copper layer are etched to form a first signal circuit layer and a second signal circuit layer respectively; and the surfaces of the first signal circuit layer and the second signal circuit layer are coated with insulating layers respectively. The flexible circuit board prepared by the manufacturing method is low in dielectric loss. In addition, the invention also provides a flexible circuit board.

Description

technical field [0001] The invention relates to a flexible circuit board and a manufacturing method thereof, in particular to a flexible circuit board with low transmission loss and a manufacturing method thereof. Background technique [0002] With the advancement of current information and communication technology, electronic information products have entered the gigahertz era, and terminal electronic products are increasingly demanding high confidentiality and high transmission quality, such as mobile phones, car phones, wireless communications , while high confidentiality and high transmission quality are all developing in the direction of high frequency. [0003] The substrate material of the circuit board is the key to the high frequency of circuit signal transmission, especially the copper clad substrate material technology. The dielectric loss factor (Df) and relative dielectric constant (Dk) of the existing polyimide substrate material are relatively high. High, eve...

Claims

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Application Information

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IPC IPC(8): H05K3/38
CPCH05K3/386H05K2203/0783H05K2201/012H05K3/4676H05K3/389H05K3/429H05K2201/0715H05K1/0218H05K1/0393H05K1/189H05K1/028H05K3/4635H05K3/0017H05K2201/015H05K2201/0158H05K2201/0162H05K2201/0195Y10T29/49155
Inventor 沈芾云何明展徐筱婷
Owner AVARY HLDG (SHENZHEN) CO LTD