High-temperature coating material for forming weldable metal circuit, and preparation method thereof

A technology for welding metal and wires, which is applied in the direction of fireproof coatings, epoxy resin coatings, coatings, etc., can solve the problems that antennas are incompetent, unsatisfactory, and limit applications, so as to improve heat resistance and weather resistance, and improve overall performance , the effect of strong weather resistance

Inactive Publication Date: 2020-04-10
深圳市玖远科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This technology requires the use of special plastic raw materials, which is costly and cannot meet the needs of large electronic product casings and high-end electronic products with high material performance requirements.
Moreover, LDS antennas cannot implement conductive lines on glass and ceramics, which greatly limits the application of high-performance composite materials such as carbon fiber composite materials, glass fiber composite materials, and ceramic materials in LDS antenna technology.
As 5G has higher and higher requirements on radio frequency and substrates, antennas with traditional substrates will also be difficult to meet

Method used

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  • High-temperature coating material for forming weldable metal circuit, and preparation method thereof
  • High-temperature coating material for forming weldable metal circuit, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A high-temperature coating for forming weldable metal circuits, comprising the following components by mass percentage: 50% of high-temperature resistant resin, 15% of radium engraving powder, 2% of leveling agent, 2% of active diluent, and 31% of curing agent.

[0039]Wherein, in the high temperature resistant resin, the weight ratio of epoxy resin, silicone resin and polyphenylene sulfide is 3:3:1.

[0040] The high-temperature coating in this example is prepared by the following method: first mix the epoxy resin, the silicone resin and the active diluent in the formulated amount at high speed, dry and pulverize, and then add the remaining components, according to the routine in the field Methods Mixing, crushing, that is.

[0041] The application process of the high-temperature coating in this embodiment on the conductive circuit is as follows:

[0042] The above-mentioned high-temperature coating is sprayed on the substrate by thermal spraying method, and the spray...

Embodiment 2

[0045] A high-temperature coating for forming weldable metal circuits, comprising the following components by mass percentage: 60% high-temperature-resistant resin, 20% laser engraving powder, 0.8% leveling agent, 1% active diluent, and 18.2% curing agent.

[0046] Among them, in the high temperature resistant resin, the weight ratio of epoxy resin, silicone resin and polyphenylene sulfide is 2:3:1.5.

[0047] The high-temperature coating in this example is prepared by the following method: first mix the epoxy resin, silicone resin and 2 / 3 of the reactive diluent in the formula amount at high speed, dry and pulverize, then add the remaining components, according to It is obtained by mixing and pulverizing by conventional methods in the art.

Embodiment 3

[0049] A high-temperature coating for forming weldable metal circuits, comprising the following components by mass percentage: 70% of high-temperature resistant resin, 18% of radium engraving powder, 0.5% of leveling agent, 0.5% of active diluent, and 11% of curing agent.

[0050] Wherein, in the high temperature resistant resin, the weight ratio of epoxy resin, silicone resin and polyphenylene sulfide is 2:2:2.

[0051] The preparation method of the high-temperature coating in this example is the same as that in Example 1, and will not be described in detail here.

[0052] The high-temperature coating in this example is prepared by the following method: first mix the epoxy resin, silicone resin and 1 / 3 of the reactive diluent in the formula at high speed, dry and pulverize, then add the remaining components, according to It is obtained by mixing and pulverizing by conventional methods in the art.

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PUM

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Abstract

The invention discloses a high-temperature coating material for forming a weldable metal circuit. The high-temperature coating material comprises the following components in percentage by mass: 50-70%of a high-temperature-resistant resin, 15-20% of laser engraving powder, 0.5-2% of a leveling agent, 0.5-2% of an active diluent and 10-35% of a curing agent. According to the invention, the high-temperature-resistant resin formed by combining an epoxy resin, an organic silicon resin and polyphenylene sulfide has high adhesion to PPS, LCP materials, glass, ceramics, metals and other base materials; the laser engraving powder is added according to a specific ratio, and laser engraving and chemical plating are carried out after different base materials are sprayed and cured to form a conductivemetal circuit, so that the formed circuit can be subjected to high-temperature tin soldering and has outstanding high-temperature resistance; and the prepared antenna is strong in signal receiving capability, and the impedance performance of the conductive circuit is good. The invention further discloses a preparation method of the high-temperature coating material for forming the weldable metalcircuit, wherein the high-temperature-resistant resin components are good in compatibility, the coating material components are uniformly dispersed, and the operation is simple.

Description

technical field [0001] The invention relates to the technical field of coatings, in particular to a high-temperature coating for forming weldable metal circuits and a preparation method thereof. Background technique [0002] In recent years, my country's mobile communications have made unprecedented achievements. The world's largest 4G network has been built, and the 5G network is ready to go. The Internet of Things and smart hardware products need antennas to transmit data through the Internet. Antennas are very important components in wireless communication devices. At present, FPC and LDS antennas are commonly used, but FPC antennas need to be adjusted individually according to each product, which makes assembly difficult, and the base material PI film cannot meet the transmission requirements of 5G millimeter waves. LDS (Laser Direct Structuring) is an evolutionary version of FPC antennas, with extremely high space utilization. It is suitable for situations where there ...

Claims

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Application Information

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IPC IPC(8): C09D163/00C09D183/04C09D181/02C09D7/61C09D7/63
CPCC08K2003/2224C08K2003/2241C08K2003/3045C08L2201/08C08L2205/03C09D5/18C09D163/00C09D181/02C09D183/04C09D7/61C09D7/63C08L83/04C08L81/02C08K13/02C08K3/04C08K5/56C08K3/30C08K3/22C08K3/34C08L63/00
Inventor 钟迎春
Owner 深圳市玖远科技有限公司
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