Pouring sealant and preparation method thereof, solar inverter and electronic component

A potting and mixing technology, applied in electrical components, semiconductor devices, circuits, etc., can solve problems such as water resistance defects, achieve low viscosity, good water resistance, and overcome poor water resistance.

Pending Publication Date: 2020-05-12
上海汉司实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiments of the present invention is to provide a potting compound and its preparation method, a solar inverter, and electronic components, so as to solve the problem of water resistance of the existing epoxy-anhydride system potting compound proposed in the above-mentioned background technology. question

Method used

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  • Pouring sealant and preparation method thereof, solar inverter and electronic component
  • Pouring sealant and preparation method thereof, solar inverter and electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] A potting glue, including A component and B component, wherein, the A component includes the following raw materials: 300g of epoxy resin (select CEL 2021P), 30g of diluent (select XY-692), 10g of auxiliary agent (Alkyl ammonium salt anti-settling agent is selected), flame retardant 80g (non-reactive flame retardant is selected), thermal conductive filler 580g (aluminum oxide is selected), hydrophobic filler 40g (polytetrafluoroethylene powder is selected), water resistance Silane coupling agent 40g (select epoxy trimethoxysilane coupling agent for use); Described B component comprises following raw material: acid anhydride curing agent 280g (select methyl hexahydrophthalic anhydride for use), accelerator 10g (select imidazoles for use to promote agent), 10g of additives (choose hydrophobic copolymer dispersant), 700g of thermally conductive filler (choose alumina).

[0047] Wherein, the preparation method of the A component is: take epoxy resin, diluent, and auxiliary ...

Embodiment 2

[0051] A potting glue, including A component and B component, wherein, the A component includes the following raw materials: epoxy resin 260g (select NPEF-170), diluent 50g (select XY-692), auxiliary agent 10g (choose alkyl ammonium salt anti-settling agent), 80g flame retardant (choose non-reactive flame retardant), 600g thermal conductive filler (choose alumina), 40g hydrophobic filler (choose polytetrafluoroethylene powder), water-resistant 40g of permanent silane coupling agent (selecting epoxy trimethoxysilane coupling agent); said B component includes the following raw materials: anhydride curing agent 250g (selecting methyl hexahydrophthalic anhydride), accelerator 10g (selecting imidazoles Accelerator), 10g of additives (choose hydrophobic copolymer dispersant), 730g of thermally conductive filler (choose alumina).

[0052] Wherein, the preparation method of the A component is: take epoxy resin, diluent, and auxiliary agent to mix, manually stir evenly, and then use a ...

Embodiment 3

[0056] A potting glue, including A component and B component, wherein, the A component includes the following raw materials: 200g of epoxy resin (select CEL 2021P), 10g of diluent (select XY-692), 5g of auxiliary agent (Alkyl ammonium salt anti-settling agent is selected), flame retardant 50g (non-reactive flame retardant is selected), thermal conductive filler 500g (alumina is selected), hydrophobic filler 10g (polytetrafluoroethylene powder is selected), water resistance Silane coupling agent 10g (select epoxy trimethoxysilane coupling agent for use); Described B component comprises following raw material: acid anhydride curing agent 200g (select methyl hexahydrophthalic anhydride for selection), accelerator 5g (select imidazoles for use to promote agent), 5g of additives (choose hydrophobic copolymer dispersant), 700g of thermally conductive filler (choose alumina).

[0057] Wherein, the preparation method of the A component is: take epoxy resin, diluent, and auxiliary agen...

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Abstract

The invention relates to the field of chemical engineering, and particularly discloses a pouring sealant and a preparation method thereof, a solar inverter and an electronic component. The pouring sealant comprises a component A and a component B. The component A comprises the following raw materials: epoxy resin, a diluent, an auxiliary agent, a flame retardant, a heat conduction filler, a hydrophobic filler and a waterproof silane coupling agent. The component B at least comprises an anhydride curing agent and an accelerant. The pouring sealant prepared in an embodiment of the invention hasexcellent performances of water resistance, moisture resistance, heat conduction, flame retardance and the like, and also has high bonding force, high strength and high hardness unique to epoxy glue;the provided preparation method is simple; the water resistance of the pouring sealant is improved by adding the hydrophobic filler and the water-resistant silane coupling agent, and the original heat-conducting and flame-retardant properties of the pouring sealant are not influenced; the problem that conventional epoxy-anhydride system pouring sealants have water resistance defects is solved; andthe application of the epoxy-anhydride system pouring sealant in the solar inverter is realized.

Description

technical field [0001] The invention relates to the field of chemical engineering, in particular to a potting glue and a preparation method thereof, a solar inverter, and electronic components. Background technique [0002] Potting adhesive is also called potting adhesive. As a thermosetting polymer insulation material with excellent performance that can be cured at room temperature or under heating conditions, it can be used for bonding, sealing, potting and coating protection of electronic components. An important insulating material indispensable to industry. The potting glue is liquid before it is cured and has fluidity. The colloidal viscosity of the potting glue varies according to the material, performance and production process of the product. At present, the common types of potting glue include: epoxy potting glue, polyurethane potting glue, silicone potting glue, epoxy-anhydride system potting glue and so on. [0003] In recent years, with the continuous expansio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08H01L31/048C08G59/42
CPCC08G59/4215C08K2003/2227C08L2201/02C08L2203/206C09J11/04C09J11/06C09J11/08C09J163/00H01L31/0481C08L27/18C08K13/02C08K3/22C08K5/5435Y02E10/50
Inventor 肖娟林孝蔚吴海平向劲松
Owner 上海汉司实业有限公司
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