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Super-hard abrasive grinding wheel for fingerprint identification lock substrate grinding and preparation method thereof

A technology of fingerprint recognition locks and superhard abrasives, which is applied in the direction of grinding/polishing equipment, abrasives, grinding devices, etc., can solve the problems of low yield rate, low process efficiency, and many substrate processing procedures, and achieve low strength and high Effect of surface finish, low thickness deviation

Active Publication Date: 2020-06-16
北京荣锋精密工具有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is that there are many substrate processing procedures used in the existing fingerprint recognition technology, the process is controllable, the yield rate is low, and the process efficiency is low. In order to solve the above problems, the present invention provides a fingerprint recognition lock substrate grinding Cut superabrasive grinding wheel and preparation method thereof

Method used

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  • Super-hard abrasive grinding wheel for fingerprint identification lock substrate grinding and preparation method thereof
  • Super-hard abrasive grinding wheel for fingerprint identification lock substrate grinding and preparation method thereof
  • Super-hard abrasive grinding wheel for fingerprint identification lock substrate grinding and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] The soft elastic matrix with medium and low elastic modulus includes calcium sulfate whiskers, carbon fibers, copper-tin-titanium alloy powder, bakelite powder, polyimide resin powder, and is composed of the following parts by weight: 10 parts of calcium sulfate whiskers, carbon fiber 10 parts, copper-tin-titanium alloy 2 parts, bakelite powder 5 parts, polyimide resin powder 35 parts.

[0041] The superhard abrasive is single crystal diamond, the functional filler is silica hollow spheres, phenol novolac epoxy acrylate, and dextrin, the resin binder is foamed modified phenolic resin, and the superhard abrasive The shaved layer includes the following raw materials in parts by weight: 5 parts of single crystal diamond, 30 parts of hollow silicon dioxide spheres, 30 parts of phenol novolac epoxy acrylate, 15 parts of dextrin, and 25 parts of phenolic resin solution.

[0042] The single crystal diamond is selected from particles with a particle size in the range of 10-20 μ...

Embodiment 2

[0045] The soft elastic matrix with medium and low elastic modulus includes calcium sulfate whiskers, carbon fibers, copper-tin-titanium alloy powder, bakelite powder, polyimide resin powder, and is composed of the following parts by weight: 20 parts of calcium sulfate whiskers, carbon fiber 20 parts, copper-tin-titanium alloy 5 parts, bakelite powder 15 parts, polyimide resin powder 40 parts.

[0046] The superhard abrasive is single crystal diamond, the functional filler is silica hollow spheres, phenol novolac epoxy acrylate, and dextrin, the resin binder is foamed modified phenolic resin, and the superhard abrasive The shaved layer includes the following raw materials in parts by weight: 7.5 parts of single crystal diamond, 32 parts of hollow silicon dioxide spheres, 28 parts of phenol novolac epoxy acrylate, 16 parts of dextrin, and 16.5 parts of phenolic resin solution.

[0047] The single crystal diamond is selected from particles with a particle size in the range of 20...

Embodiment 3

[0050] The soft elastic matrix with medium and low elastic modulus includes calcium sulfate whiskers, carbon fibers, copper-tin-titanium alloy powder, bakelite powder, polyimide resin powder, and is composed of the following parts by weight: 30 parts of calcium sulfate whiskers, carbon fiber 10 parts, copper-tin-titanium alloy 5 parts, bakelite powder 10 parts, polyimide resin powder 50 parts.

[0051] The superhard abrasive is single crystal diamond, the functional filler is silica hollow spheres, phenol novolac epoxy acrylate, and dextrin, the resin binder is foamed modified phenolic resin, and the superhard abrasive The shaving layer includes the following raw materials in parts by weight: 10 parts of single crystal diamond, 34 parts of hollow silicon dioxide spheres, 26 parts of phenol novolac epoxy acrylate, 17 parts of dextrin, and 13 parts of phenolic resin solution.

[0052] The single crystal diamond is selected from particles with a particle size in the range of 25-3...

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Abstract

The invention provides a super-hard abrasive grinding wheel for fingerprint identification lock substrate grinding. The super-hard abrasive grinding wheel comprises a grinding wheel base body and a super-hard grinding layer; and the super-hard grinding layer is of an annular structure and is bonded to the grinding wheel base body, the grinding wheel base body is a soft elastic base body with the medium-low elastic modulus, and the super-hard grinding layer is a layer prepared by mixing a super-hard abrasive, a functional filler and a resin binder. The soft elastic base body with the medium andlow elastic modulus can buffer the surface of a ground material well, during grinding, under the action of counter-acting force of a workpiece, elastic deformation can occur, thus the abrasive can well adapt to the change of the feed amount and is not so deep as to be pressed into a fingerprint substrate material, the effects of flexible grinding and polishing are achieved, and finally the fingerprint lock substrate material reaches the extremely high surface smoothness and the extremely low thickness deviation.

Description

technical field [0001] The invention relates to the technical field of grinding abrasives, in particular to a superabrasive grinding wheel for grinding fingerprint identification lock substrates and a preparation method thereof. Background technique [0002] With the development of electronics, optical communications, mobile phones and other industries, fingerprint recognition systems are showing rapid explosive growth. Modern mobile phone fingerprint recognition, company punch card fingerprint recognition, and household fingerprint code locks are developing rapidly. The core technology in the fingerprint identification system lies in the optical signal transmission technology and the high-precision and high-quality processing technology of contact substrate materials. [0003] Fingerprint identification technology is a set of technical solutions combining software and hardware. The hardware package is mainly composed of sensors, substrates and metal rings. In order to prev...

Claims

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Application Information

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IPC IPC(8): B24D3/32B24D7/02B24D18/00C04B26/20C04B26/28
CPCB24D3/32B24D7/02B24D18/0009B24D18/0072C04B26/20C04B26/28C04B18/22C04B22/04C04B14/383C04B14/386C04B24/302C04B14/324C04B14/06
Inventor 李东李永军刘帅博
Owner 北京荣锋精密工具有限公司
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