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Mono-blocked propionyloxy silicone resin and preparation method thereof, conductive adhesive containing the same and preparation method thereof

A technology of terminal propionyloxy and adhesive, which is applied in conductive adhesives, adhesives, polymer adhesive additives, etc. Low requirements for bonding and curing equipment, easy to popularize and apply, and excellent effect of cured product elongation

Active Publication Date: 2022-04-01
SHANGHAI TENGSHUO ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the hydrosilylation reaction has strict requirements on the material to be bonded. If organic phosphorus, sulfur, amine, organic tin, moisture and other substances are attached to the surface of the bonded material, it will often lead to poisoning of the platinum catalyst and poor curing.
The selection of conductive powder for addition-type silicone conductive adhesive is also relatively strict, and the surface treatment agent often poisons the platinum catalyst, which affects the curing of the conductive adhesive.
Addition-type silicone also has no adhesion to most materials because its molecular structure has no polarity, and it needs an adhesion promoter to achieve a certain bonding strength. However, its bonding strength is much smaller than that of condensation-type silicone, and Most adhesion promoters will only produce adhesion when they are cured at a high temperature above 120 degrees. Therefore, when the addition-type silicone conductive adhesive in the prior art is used for SMD crystal silicon packaging, degumming or debonding will occur when the vibration is strong. The problem of crystal oscillator not vibrating

Method used

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  • Mono-blocked propionyloxy silicone resin and preparation method thereof, conductive adhesive containing the same and preparation method thereof
  • Mono-blocked propionyloxy silicone resin and preparation method thereof, conductive adhesive containing the same and preparation method thereof
  • Mono-blocked propionyloxy silicone resin and preparation method thereof, conductive adhesive containing the same and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] This embodiment provides a kind of single-end propionyloxy silicone resin, the structural formula is as shown in formula (I):

[0047]

[0048] Among them, R 1 for CH 3 ;

[0049] R 2 for CH 2 CH 2

[0050] R 3 for CH 3 ;

[0051] R 4 for CH 3 ;

[0052] n is 500.

[0053] The preparation method of the above-mentioned single-end propionyloxy silicone resin comprises the following steps:

[0054] React hydroxyl-containing silane and vinyl-containing silane under the action of dibutyltin dilaurate. After the viscosity of the system reaches 1000-50000mPa·S, add quinone to terminate the reaction, and the obtained reaction product is cleaned and distilled by alcohol. That is, the mono-blocked propionyloxy silicone resin is obtained.

[0055] Wherein, the molar ratio of hydroxy-containing silane, vinyl-containing silane, catalyst, and hydroquinone is 10:10:0.5:0.5.

Embodiment 2

[0057] The present embodiment provides a kind of modified silver powder, and its preparation method comprises the following steps: add 10g silver powder in the NaOH solution of 5kg, leave standstill for 12 hours after high-speed stirring reaction 3 hours, adopt pure water to wash 3 times, then adopt alcohol to wash 2 times, drying through a 450-mesh stainless steel sieve to obtain modified silver powder.

[0058] Wherein, the mass fraction of NaOH solution is 1%.

[0059] Wherein, the stirring reaction temperature is less than 50°C. If the reaction temperature is higher than 50°C, the fine particles of silver powder will fuse, changing the shape of the silver powder itself, and then affecting the viscosity and bonding strength of the conductive adhesive.

[0060] Wherein, the silver powder in this embodiment is the silver powder with the brand name of TC-505 produced by Japan Deli. The average particle size of the TC-505 silver powder produced by Japan Deli is 3 μm.

[0061...

Embodiment 3

[0063] The present embodiment provides a kind of modified silver powder, and its preparation method comprises the following steps: add 10g silver powder in the NaOH solution of 5kg, leave standstill for 12 hours after high-speed stirring reaction 3 hours, adopt pure water to wash 3 times, then adopt alcohol to wash 2 times, drying through a 450-mesh stainless steel sieve to obtain modified silver powder.

[0064] Wherein, the mass fraction of NaOH solution is 1%.

[0065] Wherein, the stirring reaction temperature is less than 50°C. If the reaction temperature is higher than 50°C, the shape of the silver powder itself will be changed.

[0066] Wherein, the silver powder in this embodiment is the silver powder with the brand name TCG-1 produced by Japan Deli. The average particle size of the TCG-1 silver powder produced by Japan Deli is 4.3 μm.

[0067] Further, the modified silver powder prepared in the present invention must be used up within 24 hours. During the preparat...

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Abstract

The invention discloses a single-end propionyloxy silicone resin and a preparation method thereof, a conductive adhesive containing the silicone resin and a preparation method thereof. The structural formula of the single-end propionyloxy silicone resin is as follows: (1), the conductive adhesive includes 10 to 30 parts of the single-terminated propionyloxy silicone resin, and also includes the following raw materials in parts by weight: 0.5 to 5 parts of thermal initiator, 1 to 5 parts of thermoplastic powder filler parts, 60-80 parts of modified silver powder, 1-10 parts of solvent, and 0.1-1 part of stabilizer; wherein, the parts by weight of the single-end propionyloxy silicone resin are 10-30 parts. The conductive adhesive in the invention has excellent cured product elongation, bonding strength, conductivity, flexibility and drop resistance, and can be widely used in the electronics industry.

Description

technical field [0001] The invention relates to the technical field of conductive adhesives, in particular to a single-end propionyloxy silicone resin and a preparation method thereof, a conductive adhesive containing the silicone resin and a preparation method thereof. Background technique [0002] In the prior art, the conductive glue used in SMD (Surface Mounted Devices) crystal oscillator package is addition type silicone conductive glue. Addition-type silicone conductive adhesive is generally prepared from vinyl silicone oil or vinyl MQ resin, hydrogen-containing silicone oil, conductive powder, platinum catalyst and inhibitor. When heated, the inhibitor dissociates or volatilizes to produce active platinum to trigger Hydrosilylation reaction. However, the hydrosilylation reaction has strict requirements on the material to be bonded. If organic phosphorus, sulfur, amine, organic tin, moisture and other substances are attached to the surface of the bonded material, it w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/20C09J183/07C09J9/02C09J11/08C09J11/04
CPCC08G77/20C09J183/06C09J9/02C09J11/08C09J11/04C08K2003/0806C08K2201/011C08K2201/001C08L2201/08C08L79/08C08K13/06C08K9/02C08K3/08C08K3/36C08L33/04
Inventor 张建平
Owner SHANGHAI TENGSHUO ELECTRONICS MATERIAL CO LTD
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