Preparation method of ceramic powder for metal-based ceramic copper-clad plate

Abstract

The invention discloses a preparation method of ceramic powder for a metal-based ceramic copper-clad plate, and relates to the technical field of ceramic powder. A key technology of scientific formulaand preparation is used; the preparation method comprises the steps: uniformly mixing 1-1.5 parts by weight of magnesium boride, 1.5-2 parts by weight of barium carbonate, 0.2-0.5 part by weight of neodymium oxide, 0.2-0.5 part by weight of tantalum oxide, 2-8 parts by weight of aluminum nitride, 1-1.5 parts by weight of titanium dioxide, 0.5-3 parts by weight of silicon dioxide and 0.1-0.5 partby weight of zinc oxide to form a raw material; heating the raw materials to 900 DEG C or above to melt the raw materials to obtain a melt; putting the melt into normal-temperature water to be cooledto obtain a cooled material; and drying the cooled substance to obtain a dried substance, heating the dried substance to 900 DEG C or above, melting the dried substance to obtain a re-melted substance, putting the re-melted substance into normal-temperature water for 3-7 times, repeatedly cooling the re-melted substance to obtain a repeatedly cooled substance, drying the repeatedly cooled substance again, and carrying out ball milling to 3500 mesh by using a ball mill to obtain a ceramic powder finished product. The preparation method is used for preparing the ceramic copper-clad plate. The method is simple, feasible and stable and reliable in effect.

Description

technical field [0001] The invention discloses a method for preparing ceramic powder for metal-based ceramic copper-clad laminates, and relates to the technical field of ceramic powder. Background technique [0002] At present, the insulating layer bonding material of metal-based copper-clad laminates is mainly made of resin materials such as epoxy resin or phenolic resin, and the thermal conductive filler is mainly alumina (or silicon oxide) micropowder, etc., and the resin-loaded thermal conductive filler is used to coat the metal surface. Pressed to make products; there are also powders such as aluminum nitride and alumina sintered at a temperature above 1300 °C. In the existing known technology, although there are preparation methods of aluminum nitride electronic ceramic powder, preparation methods of aluminum nitride ceramic substrates, debinding methods of aluminum nitride green bodies and preparation methods of aluminum nitride ceramic substrates, ceramic powder Inj...

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Problems solved by technology

In the existing known technology, although there are preparation methods of aluminum nitride electronic ceramic powder, preparation methods of aluminum nitride ceramic substrates, debinding methods of aluminum nitride green bodies and preparation methods of aluminum nitride ceramic substrates, ceramic powder Injection molding raw materials and ceramic powder injection molding methods, preparation methods of aluminum nitride / boron nitride composite ceramic powder, etc., but the thermal conductivity of the metal-based copper clad laminate is generally only 0.5W, the highest is 1-5W, and the withstand voltage per square meter is only 2 -8KV, if you want to improve the withstand voltage index, you must make up for the defects of the insulating layer and thicken the thickness of the insulating layer. If you increase the thickness of the insulating layer----it will also lead to a decrease in thermal conductivity. In addition, copper foil and The adhesion between the insulating layer and the metal substrate, therefore, how to keep all the indicators in the best state is currently a well-known technical difficulty that needs to be solved

Therefore, the existing known technology and the current situation have disadvantages such as low thermal conductivity, poor pressure resistance, high sintering temperature, difficult production, incapable of mass production, poor product flatness, low rate of good products, and limited product size. , defects and disadvantages

Although there are also ceramic powder cold pressing methods to make metal-based copper-clad laminates, there are outstanding defects, defects and disadvantages such as low density and low efficiency of the ceramic layer.

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