Method for preparing colorless isopropanol from organic cleaning waste liquid of electronic factory

Abstract

The invention provides a method for preparing colorless isopropanol from an organic cleaning waste liquid of an electronic factory. Catechol is removed from an isopropanol fraction obtained by distilling the waste liquid in an aeration heating mode, and then potassium fluoride is added to obtain an isopropanol oil phase with low water content, so that the organic waste liquid is prevented from being directly treated in an incineration mode, a rectification dehydration mode with high energy consumption and high equipment requirements is not needed, and the resource utilization rate is increased; and the prepared isopropanol is a colorless product, is not easy to discolor after being placed for a long time, and has high product value.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for preparing colorless isopropanol from organic cleaning waste liquid in electronics factories. Background technique [0002] The development of the information industry has promoted the demand for commonly used materials in the microelectronics industry. According to statistics, in the manufacturing of the integrated circuit industry, material consumption accounts for more than half of the production cost. In addition to large-size monocrystalline silicon wafers, the closely related materials also include high-purity reagents for microfabrication in the manufacturing process. In the sub-micron VLSI process, the surface of the silicon wafer needs to be cleaned no matter after oxidation or etching, and film deposition and high-temperature furnace diffusion require multiple treatments with various chemical agents and pure water. Finally, cleaning with high-purity ...

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Problems solved by technology

Disclosed as CN105551942A is a method for cleaning deep holes after semiconductor wafer etching, the method uses EKC solution to clean the etched semiconductor wafer for the first time, wherein the EKC solution is N-methylpyrrolidone solvent and There is a mixed solution of alkaline amine; the semiconductor wafer is cleaned for the second time with N-methylpyrrolidone solvent; the semiconductor wafer is cleaned for the third time with IPA solvent; the semiconductor wafer is cleaned for the fourth time with pure water Cleaning; drying semiconductor wafers, this treatment method results in a large amount of IPA and quaternary amine hydroxides, alcohol amines, solvents, polyether-modified silicones, ortho-phenols and other substances in the waste liquid, and recycling is difficult

[0004] For the waste liquid in the above process, the industry is generally regarded as industrial waste or burned or buried to be discarded. This treatment method not only wastes high-purity reagents, but also increases the cost of semiconductor manufacturing and causes environmental damage. Pollution

[0005] CN202912802U discloses a device for extracting isopropanol from waste liquid, which can be reclaimed by heating distillation recovery, but this method can only be aimed at waste liquids with high content of isopropanol in waste liquid and few other organic matter contents, And the cost of reverse osmosis membrane is high

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