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A kind of preparation method of copper electrode composite layer of thermistor

A thermistor and copper electrode technology, applied in resistance manufacturing, resistors, coatings, etc., can solve the problems of easy diffusion, failure, and reduced working performance of copper electrodes, and achieve inhibition of copper diffusion, excellent oxidation resistance, The effect of good thermal stability

Active Publication Date: 2021-07-23
JIANGSU JINGWEI INTELLECTUAL PROPERTY OPERATION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problems caused by copper cannot be ignored. Copper electrodes are easy to diffuse into the ceramic matrix and are easily oxidized, resulting in reduced performance or even failure.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A preparation method of a thermistor copper electrode composite layer, comprising the following steps:

[0020] (1) Wash the ceramic substrate twice with deionized water after ultrasonic cleaning, and place it in a dryer for drying treatment. The drying treatment time is 10 minutes, and the drying treatment temperature is 160 ° C; after drying, it is ready to use;

[0021] (2) Ti powder is ball milled to obtain Ti nano-powder; the ceramic substrate is put into a direct current arc plasma evaporation equipment, and the vacuum is 10 -3 Mpa, filled with inert gas, Ti nano-powder plasma sputtering treatment in inert gas reflux, the treatment temperature is 1600°C, the sputtering speed is 1800m / s, after obtaining the first barrier layer with a thickness of 1300nm, the temperature is lowered to 20°C, and the temperature is lowered. The speed is 200°C / s; after standing for 1 hour, the Ti powder is replaced with Ti-Ni nano-powder, and the Ti-Ni nano-powder plasma sputtering tre...

Embodiment 2

[0028] A preparation method of a thermistor copper electrode composite layer, comprising the following steps:

[0029] (1) Wash the ceramic substrate with deionized water three times after ultrasonic cleaning, and place it in a dryer for drying treatment. The drying treatment time is 15 minutes, and the drying treatment temperature is 200 ° C; after drying, it is ready to use;

[0030] (2) Ti powder is ball milled to obtain Ti nano-powder; the ceramic substrate is put into a direct current arc plasma evaporation equipment, and the vacuum is 10 -4 Mpa, filled with inert gas, Ti nano powder plasma sputtering treatment in the inert gas reflux, the treatment temperature is 2000°C, the sputtering speed is 2000m / s, after obtaining the first barrier layer with a thickness of 1800nm, the temperature is lowered to 20°C, and the temperature is lowered. The speed is 300°C / s; after standing for 2 hours, the Ti powder is replaced with Ti-Ni nano-powder, and the Ti-Ni nano-powder plasma spu...

Embodiment 3

[0037] A preparation method of a thermistor copper electrode composite layer, comprising the following steps:

[0038] (1) Wash the ceramic substrate with deionized water three times after ultrasonic cleaning, and place it in a dryer for drying treatment. The drying treatment time is 14 minutes, and the drying treatment temperature is 180 ° C; after drying, it is ready to use;

[0039] (2) Ti powder is ball milled to obtain Ti nano-powder; the ceramic substrate is put into a direct current arc plasma evaporation equipment, and the vacuum is 10 -4 Mpa, filled with inert gas, Ti nano powder plasma sputtering treatment in inert gas reflux, the treatment temperature is 1800°C, the sputtering speed is 1900m / s, after obtaining the first barrier layer with a thickness of 1700nm, the temperature is lowered to 20°C, and the temperature is lowered. The speed is 250°C / s; after standing for 1.5 hours, the Ti powder is replaced with Ti-Ni nano-powder, and the Ti-Ni nano-powder plasma sputt...

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Abstract

A method for preparing a copper electrode composite layer of a thermistor. The ceramic substrate is washed and dried for use; the Ti powder is ball-milled to obtain Ti nano powder; the ceramic substrate is placed in a DC arc plasma evaporation device, vacuumed, vacuum degree is 10 ‑3 -10 ‑4 Mpa is filled with inert gas, and plasma sputtering treatment of Ti nano powder and Ti-Ni nano powder is respectively carried out in the inert gas reflux to obtain a semi-finished substrate; the semi-finished substrate is placed in an annealing device for annealing treatment, and after annealing, it will contain nano-aluminum The ion solution is coated on the surface of the semi-finished substrate to form a film, and after heat treatment, the copper electrode composite layer of the thermistor is obtained. The thermistor copper electrode composite layer prepared by the method has excellent electrical conductivity and anti-oxidation performance, and the method is simple, low in cost and convenient for industrialized production.

Description

technical field [0001] The invention belongs to the field of thermistor copper electrode preparation, in particular to a method for preparing a thermistor copper electrode composite layer. Background technique [0002] Copper is a metal chemical element and a trace element necessary for the human body. Copper is also the first metal discovered by humans. It is a metal widely used by humans and belongs to heavy metals. Copper is the earliest metal used by humans. As early as prehistoric times, people began to mine open-pit copper mines and used the obtained copper to make weapons, utensils and other utensils. The use of copper had a profound impact on the progress of early human civilization. Copper is a metal found in the Earth's crust and oceans. The content of copper in the earth's crust is about 0.01%, and in individual copper deposits, the content of copper can reach 3% to 5%. Copper in nature mostly exists as compounds, namely copper minerals. Copper minerals are ag...

Claims

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Application Information

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IPC IPC(8): H01C17/00C23C14/14C23C14/35
CPCC23C14/14C23C14/35H01C17/00
Inventor 桑胜伟
Owner JIANGSU JINGWEI INTELLECTUAL PROPERTY OPERATION CO LTD
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