Method for machining micro holes in ceramic matrix composite through femtosecond lasers

A technology of femtosecond laser and composite materials, which is applied in the field of micropore processing of ceramic matrix composite materials by using femtosecond laser, to achieve the effect of small thermal effect, high processing precision and small processing damage

Active Publication Date: 2015-05-13
NORTHWESTERN POLYTECHNICAL UNIV
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  • Abstract
  • Description
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Problems solved by technology

[0012] In order to avoid the deficiencies of the prior art, the present invention proposes a method for micropore processing of ceramic matrix composite materials using a femtosecond laser to solve the requirements for ultrafine micropore processing of CMC-SiC materials in the existing service environment. That is to meet the needs of micro-hole machining with high precision positioning in practical applications

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  • Method for machining micro holes in ceramic matrix composite through femtosecond lasers
  • Method for machining micro holes in ceramic matrix composite through femtosecond lasers
  • Method for machining micro holes in ceramic matrix composite through femtosecond lasers

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Embodiment 1

[0041] The method for forming circular holes proposed in this embodiment is applicable to CMC-SiC materials, and this embodiment only uses C / SiC composite materials as an example for illustration. The diameter of the formed hole is 600 μm (such as figure 2 ).

[0042] In this embodiment, the femtosecond laser used is the PHAROS femtosecond laser from Lithuania Light Conversion Company.

[0043] The specific process of this implementation is:

[0044] Step 1, the surface of the sample is cleaned. The 2D CVI C / SiC composite material was processed into a rectangular block sample of 20 mm × 10 mm × 3 mm, then ultrasonically cleaned for 15 minutes under alcohol immersion to remove surface dust, oil and other impurities, and finally dried in an oven to obtain the cleaned sample.

[0045] Step 2, processing micro-holes. Micromachining of 2D CVI C / SiC composite samples by femtosecond laser. . In this embodiment, the sample is processed by layer-by-layer removal, the processing h...

Embodiment 2

[0056] The method for forming a square hole proposed in this embodiment is suitable for silicon carbide ceramic matrix composite materials, and in this embodiment only a C / SiC composite material sample is used as an example for illustration. The plane size of the formed hole is 650μm×650μm (such as image 3 ).

[0057] In this embodiment, the femtosecond laser used is the PHAROS femtosecond laser from Lithuania Light Conversion Company.

[0058] Step 1. Clean the sample surface. The 2D CVI C / SiC composite material was processed into a rectangular block sample of 20 mm × 10 mm × 3 mm, then ultrasonically cleaned for 15 minutes under alcohol immersion to remove surface dust, oil and other impurities, and finally dried in an oven to obtain the cleaned sample.

[0059] Step 2, machining holes. Holes are machined in 2D CVI C / SiC composite samples by femtosecond laser. In this embodiment, the linear scanning square hole processing is performed on the sample by layer-by-layer rem...

Embodiment 3

[0070] The method for forming a rectangular hole proposed in this embodiment is suitable for silicon carbide ceramic matrix composite materials, and this embodiment only uses a C / SiC composite material sample as an example for illustration. The plane size of the formed rectangular hole is 1300μm×650μm (such as Figure 4 ).

[0071] In this embodiment, the femtosecond laser used is the PHAROS femtosecond laser from Lithuania Light Conversion Company.

[0072] Step 1. Clean the sample surface. The 2D CVI C / SiC composite material was processed into a rectangular block sample of 20 mm × 10 mm × 3 mm, then ultrasonically cleaned for 15 minutes under alcohol immersion to remove surface dust, oil and other impurities, and finally dried in an oven to obtain the cleaned sample.

[0073] Step 2, process the rectangular hole. A rectangular hole is machined on a 2D CVI C / SiC composite sample by a femtosecond laser. In this embodiment, the linear scanning rectangular hole processing is...

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Abstract

The invention relates to a method for machining micro holes in a ceramic matrix composite through femtosecond lasers. According to the method, the silicon carbide ceramic matrix composite sample is placed on a working table and machined layer by layer in a spiral line mode through the femtosecond lasers or machined in a linear scanning mode, wherein the thickness of the sample is smaller than 3 mm; in the micro-machining process, the wave length of femtosecond laser machining ranges from 400 nm-1500 nm, the pulse width ranges from 80 fs to 500 fs, the output power of the lasers is determined according to the requirements of micro-machining and ranges from 20 mW to 20 W, and the repetition frequency of the lasers is determined according to the requirements of micro-machining and ranges from 50 K to 25 MHz; the sample is machined in a layer-by-layer removal mode, wherein the rotation speed of a machining head is 2400 rev/s. In the machining process, the method has the advantages that machining damage is small, and because material around the damage region is still in a cold state after machining, the heat effect is small; machining precision is high, energy of the femtosecond lasers is in Gaussian distribution, absorption and action of the energy in the machining process are limited within the size of which the focus center is quite small, and the machining dimension is expressed from a micro form to a sub-micro form.

Description

technical field [0001] The invention belongs to the field of ultrafine micromachining of ceramic matrix composite materials, and in particular relates to a method for processing micropores of ceramic matrix composite materials by using a femtosecond laser. Background technique [0002] Continuous fiber toughened silicon carbide ceramic matrix composite (CMC-SiC) not only has excellent properties of silicon carbide ceramic materials such as high temperature resistance, low density, high specific modulus, high specific strength, oxidation resistance and ablation resistance, but also overcomes the The Achilles heel of high material brittleness and poor reliability is characterized by insensitivity to cracks and no catastrophic damage. It is mainly manifested in the aspects of increasing service temperature, reducing structural weight and enhancing reliability. Therefore, it has huge potential in the fields of aerospace and national defense. The application potential is highly v...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382
CPCB23K26/16B23K2103/16
Inventor 王晶刘永胜张青成来飞张立同
Owner NORTHWESTERN POLYTECHNICAL UNIV
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