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Aromatic polyamide sulfonamide polymer, negative photosensitive composition containing aromatic polyamide sulfonamide polymer and application of negative photosensitive composition

A technology of aromatic polyamide sulfonamide and polyamide sulfonamide, which is applied in the field of negative photosensitive compositions, can solve the problems of unresolved material stability, poor tensile performance, and large loss of film thickness, etc., and achieve performance reduction, Improvement of solubility and small loss of film thickness

Pending Publication Date: 2020-09-25
崔国英
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These three materials have their own advantages and disadvantages, but they all have some disadvantages in practical applications: the first photosensitive polyimide material is still the best choice for many processes, but it has high water absorption and is difficult to cure during post-curing. The shortcomings of large loss of film thickness and the use of environmentally unfriendly organic developers; the benzocyclobutene (BCB) material developed by Dow Electronic Chemicals in the United States has poor tensile properties, which cannot be solved in some applications. The problem of material stability in device deformation caused by long-term thermal expansion and contraction; photosensitive polybenzobisoxazole has been more and more widely used in recent years due to the use of alkaline aqueous developer and better tensile strength, but It cannot solve the problem of large film thickness loss of materials during the process
It can be seen that the above-mentioned existing photosensitive composition containing polyimide, polybenzobisoxazole, benzocyclobutene, and the cured product prepared therefrom still have various inconveniences and defects, and urgently need to be improved. further improvement

Method used

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  • Aromatic polyamide sulfonamide polymer, negative photosensitive composition containing aromatic polyamide sulfonamide polymer and application of negative photosensitive composition
  • Aromatic polyamide sulfonamide polymer, negative photosensitive composition containing aromatic polyamide sulfonamide polymer and application of negative photosensitive composition
  • Aromatic polyamide sulfonamide polymer, negative photosensitive composition containing aromatic polyamide sulfonamide polymer and application of negative photosensitive composition

Examples

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Effect test

Synthetic example 1

[0075] Synthesis Example 1: Synthesis of m-chlorosulfonyl benzoyl chloride

[0076] The acid chloride precursor (m-chlorosulfonyl benzoyl chloride, as shown in formula 10) used in the synthesis of polyamide sulfonamide polymers mentioned in the present invention can be passed through trichloromethylbenzene (formula 11-1) and chlorosulfonic acid ( Formula 11-2) It is obtained by heating reaction under normal pressure under mechanical stirring. The following is a synthetic method for preparing m-chlorosulfonyl benzoyl chloride: Put 6 parts (molar) of chlorosulfonic acid in a three-necked flask, heat and stir to 110~130℃, and then slowly add 1~6 parts (molar) ) Trichloromethylbenzene is added dropwise in about 1.5 to 2 hours, after which the temperature is maintained for 3 hours. After the completion of the reaction, distillation was carried out under reduced pressure, and the fraction at 146°C was collected under a pressure of 9 mm Hg to obtain m-chlorosulfonyl benzoyl chloride.

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Synthetic example 2

[0079] Synthesis Example 2: Synthesis of Polymer-1

[0080] In a four-necked flask with a mechanical stirrer, a thermometer and a high-purity nitrogen atmosphere, add 2,2'-bis(trifluoromethyl)diaminobiphenyl (100mmol), 2-methylpyridine (300mmol), and Water N-methyl-2-pyrrolidone (NMP) (47.25g), stir until completely dissolved (the solution becomes clear), and cool to -10°C. Keeping the above solution in the temperature range of -10 to -5°C, add dropwise the dissolved m-chlorosulfonyl benzoyl chloride (100 mmol) (obtained from Synthesis Example 1) and anhydrous N-methyl-2-pyrrolidone ( 42.00 g) of the mixed solution, drip in about half an hour, and then continue to stir for 1 hour while keeping the temperature of the solution at 0 to 5°C. The obtained reaction solution was slowly trickled into about 8 kg of water, settled and filtered to recover the precipitate, and the same process was repeated and washed with pure water 3 times to obtain a wet product. And dried in a vacuum ov...

Synthetic example 3

[0083] Synthesis Example 3: Synthesis of Polymer-2

[0084] The synthesis method of polymer-2 is exactly the same as that of polymer-1, except that the diamine precursor 2,2'-bis(trifluoromethyl)diaminobiphenyl (100mmol) is used in the synthesis of polymer-2 It is completely replaced by 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (100mmol). Therefore, the three structural fragments of polymer-2 constitute the following formula (polymer-2). Among them, the ratio between m, n and p satisfies the relationship of 1:1:2. The weight average molecular weight of Polymer-2 is 58,765 and the dispersion degree is 1.74.

[0085] (Polymer-2)

[0086]

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Abstract

The invention discloses an aromatic polymer (aromatic polyamide sulfonamide polymer) with a main chain containing amido bonds and sulfonamide bonds at the same time, a negative photosensitive composition (polyamide sulfonamide composition) containing the aromatic polyamide sulfonamide polymer and an application of the aromatic polymer and the negative photosensitive composition. Wherein the negative photosensitive composition is prepared from the following raw materials in percentage by weight: an aromatic polyamide sulfonamide polymer, a photoacid generator, a cross-linking agent and a solvent. The composition can be used for preparing a polyamide sulfonamide cured film at a lower curing temperature (less than or equal to 250 DEG C), and the cured film can be used as a redistribution layer, an interlayer insulation buffer film, a cover coating or a surface protection film material in an electronic device.

Description

Technical field [0001] The present invention relates to a photosensitive dielectric material used in the field of electronic devices, in particular to a negative photosensitive composition containing an aromatic polyamide sulfonamide polymer, a cured product prepared therefrom and its application in semiconductor packaging and Application in display manufacturing. Background technique [0002] The progress of science and technology has always been closely related to the development of materials science. In particular, the semiconductor chip and display manufacturing that supports many current frontier technology fields is closely dependent on the latest developments in materials science. In recent years, the newly developed semiconductor chip and display manufacturing methods are inseparable from high-performance organic polymer materials. These new manufacturing methods require organic polymer materials to have good insulation properties, high mechanical properties, excellent ad...

Claims

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Application Information

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IPC IPC(8): C08G75/30C08G69/42G03F7/004G03F7/038
CPCC08G69/42C08G75/30G03F7/004G03F7/0387
Inventor 崔庆洲
Owner 崔国英