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Method for high-valued recycling of wastes of diamond wire silicon wafer cutting

A technology of silicon wafer cutting and diamond wire, applied in chemical instruments and methods, silicon compound, polycrystalline material growth and other directions, can solve the problems of difficult to ensure silicon recovery rate, increase of particle melting point, high surface activity, and achieve added value of products High, low cost, simple equipment requirements

Pending Publication Date: 2020-10-16
KUNMING UNIV OF SCI & TECH
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Problems solved by technology

[0003] However, due to the characteristics of fine particle size, high surface activity, and easy oxidation at room temperature, the ultra-fine silicon-based particles are exposed to air and moisture for a long time during cutting, storage, and transportation. The surface oxidizes and grows to form an amorphous surface layer of silicon dioxide. The surface layer of silicon dioxide increases the melting point of the particles during the high-temperature smelting process, making it difficult to ensure the recovery rate of silicon in other pyroprocessing methods.

Method used

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  • Method for high-valued recycling of wastes of diamond wire silicon wafer cutting

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Effect test

Embodiment 1

[0027] Embodiment 1: A kind of method of high-value recycling of diamond wire silicon chip cutting waste (see figure 1 ),Specific steps are as follows:

[0028] (1) The crystalline silicon diamond wire cutting scraps in a certain place in Yunnan are subjected to plate and frame press filtration to remove liquids such as water-based lubricants to achieve liquid-solid separation, and the filter block is vacuum-dried for diamond wire silicon wafer cutting waste solid blocks, and the diamond Wire silicon wafer cutting waste solid blocks are crushed, classified, and ground to obtain silicon fine-grained powder; the average particle size of silicon fine-grained powder is 45 μm, and the total content of metal impurities in silicon fine-grained powder is 11503ppm: Al 7738ppm, Ca 2877ppm , Fe 531ppm, Mg212ppm, Ni 145ppm, in terms of mass percentage, the water content of the silicon fine particle powder is 6%;

[0029] (2) Add the silicon fine particle powder into the hydrochloric acid...

Embodiment 2

[0035] Embodiment 2: A kind of method of high-value recycling of diamond wire silicon chip cutting waste (see figure 1 ),Specific steps are as follows:

[0036](1) The crystalline silicon diamond wire cutting scraps in a certain place in Yunnan are subjected to plate and frame press filtration to remove liquids such as water-based lubricants to achieve liquid-solid separation, and the filter block is vacuum-dried for diamond wire silicon wafer cutting waste solid blocks, and the diamond Wire silicon wafer cutting waste solid blocks are crushed, classified, and ground to obtain silicon fine-grained powder; the average particle size of silicon fine-grained powder is 40 μm, and the total content of metal impurities in silicon fine-grained powder is 710ppm: Al 1ppm, Fe 596ppm , Mg 47ppm, Ni 58ppm, Ti5ppm, Cu 2ppm, V1ppm, in terms of mass percentage, the water content of the silicon fine particle powder is 8%;

[0037] (2) Add silicon microparticles powder into hydrochloric acid s...

Embodiment 3

[0043] Embodiment 3: A method for high-value recycling of diamond wire silicon wafer cutting waste, the specific steps are as follows:

[0044] (1) The crystalline silicon diamond wire cutting scraps in a certain place in Yunnan are subjected to plate and frame press filtration to remove liquids such as water-based lubricants to achieve liquid-solid separation, and the filter block is vacuum-dried for diamond wire silicon wafer cutting waste solid blocks, and the diamond Wire silicon wafer cutting waste solid blocks are crushed, classified, and ground to obtain silicon fine-grained powder; the average particle size of silicon fine-grained powder is 40 μm, and the total content of metal impurities in silicon fine-grained powder is 6692.7ppm: Al 6400ppm, Fe 6.7ppm, Mg 58ppm, Ni68ppm, in terms of mass percentage, the moisture content of the silicon fine particle powder is 5%;

[0045] (2) Add silicon fine particle powder into hydrochloric acid solution for a section of mechanical...

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Abstract

The invention relates to a method for high-valued recycling of wastes of diamond wire silicon wafer cutting, and belongs to the technical field of silicon secondary resource recycling. In order to realize high-valued recycling of diamond wire cutting wastes, an acid wet leaching pretreatment is adopted; a large number of metal impurities on the surfaces of silicon micro-particles and the oxidizedlayer of silicon dioxide can be quickly dissolved and removed, high-purity silicon powder purified by a wet method is mixed with ingot casting raw materials by a polycrystalline silicon ingot castingmethod, and ingot casting and crystal growth are carried out to obtain a polycrystalline silicon ingot for a polycrystalline silicon solar cell. The method has the advantages of simple equipment requirements, short flow, low cost, easy operation, and suitability for large-scale industrial production.

Description

technical field [0001] The invention relates to a method for high-value regeneration and utilization of diamond wire silicon chip cutting waste, and belongs to the technical field of silicon secondary resource regeneration and utilization. Background technique [0002] Among the many new energy materials, solar-grade crystalline silicon is currently the most widely used conversion material. How to achieve low-cost and high-efficiency production of solar-grade crystalline silicon is an important factor that directly affects the survival and development of the photovoltaic manufacturing industry. However, in the process of manufacturing wafers by diamond wire cutting, it is inevitable that about 30% of the solar-grade pure silicon material enters the silicon wafer cutting waste in the form of chip loss. Therefore, finding an efficient and environmentally friendly process method to recover the valuable silicon materials in the recycled diamond wire cutting waste silicon powder ...

Claims

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Application Information

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IPC IPC(8): C01B33/021C30B28/04C30B29/06
CPCC01B33/021C30B29/06C30B28/04
Inventor 魏奎先马文会杨时聪伍继君万小涵李绍元
Owner KUNMING UNIV OF SCI & TECH
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