Activator and Nickel Plating Method for Tin Alloy Activated Copper Layer Nickel Plating

Abstract

The invention belongs to the technical field of electroless nickel plating, and provides an activator and a nickel plating method for tin alloy activated copper layer nickel plating, characterized in that: the activator includes a metal salt composed of component I and component II, and also includes a promoter , pH adjuster and brightener, wherein the component I is a tin salt, the component II is a catalytic metal salt, and the accelerator includes thiourea, citric acid, tartaric acid, EDTA, sodium fluoride and polyethylene glycol alcohol. The nickel plating method includes the following steps: degreasing, pre-copper, thick copper, activation and nickel plating. The present invention has the following advantages and effects: the activator using tin alloy to activate copper layer nickel plating does not contain precious metal palladium, which can greatly reduce the production cost of copper surface activation; the operating process range comparison of the activator for tin alloy activated copper layer nickel plating Wide, relatively easy to operate; production control is relatively easy, there will be no missing plating and overflow plating during the operation process, which greatly improves the qualified rate of the product.

Description

technical field [0001] The invention belongs to the technical field of electroless nickel plating, and in particular relates to an activator for nickel plating of a tin alloy activated copper layer and a nickel plating method. Background technique [0002] LDS mobile phone antenna technology is Laser-Direct-structuring technology (Laser-Direct-structuring), using the computer to control the movement of the laser according to the trajectory of the conductive pattern, projecting the laser onto the molded three-dimensional plastic device, within a few seconds , activate the circuit pattern. After copper plating in the circuit pattern of the LDS mobile phone antenna, nickel plating on the copper surface can improve the corrosion resistance of copper. At present, the method of depositing nickel plating on the surface is usually used to protect the copper substrate. Although the electromotive sequence of metallic nickel is ahead of hydrogen, it can self-passivate to form a dense ...

AI Technical Summary

Problems solved by technology

[0006] But when the replacement nickel plating layer prepared under strongly acidic conditions was used as the catalytic layer of electroless nickel plating, the plating time was slightly longer than palladium activation, and its catalytic activity had not fully reached the level of palladium activation; the replacement nickel plating layer was used as When the protective coating on the copper substrate is thin, it is necessary to study a method to increase the thickness of the coating