Annual-ring-shaped graphene organic silicon resin biomimetic composite material, and preparation method and application thereof

A biomimetic composite material and graphene technology are applied in the field of annual ring-shaped graphene silicone resin biomimetic composite materials and their preparation, and can solve the problems of low mechanical properties, difficult processing, insufficient thermal conductivity and the like

Active Publication Date: 2020-10-20
JIAXING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problems of insufficient thermal conductivity, low mechanical properties and difficult processing of silicone resin composite materials containing thermal conductive fillers, the present invention provides an annual ring-shaped graphene silicone resin biomimetic composite material and its preparation method and application. The annual ring-shaped graphene biomimetic skeleton array is prepared by 3D printing technology. The skeleton presents a concentric circular hierarchical structure, which can effectively form a vertical through-conduction network, so that the composite material exhibits excellent thermal and electrical conductivity at a low graphene content. The method is convenient to prepare, environmentally friendly, low in cost, easy for industrial production and commercial application

Method used

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  • Annual-ring-shaped graphene organic silicon resin biomimetic composite material, and preparation method and application thereof
  • Annual-ring-shaped graphene organic silicon resin biomimetic composite material, and preparation method and application thereof
  • Annual-ring-shaped graphene organic silicon resin biomimetic composite material, and preparation method and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0038] Mix 10 grams of graphite, 10 grams of sodium nitrate, and 30 grams of potassium permanganate in a flask, add 300 milliliters of sulfuric acid, stir thoroughly for 6 hours, and keep the reaction temperature at 45 o c. After the reaction, add deionized water and raise the temperature to 90 o C for 15 minutes. After the solution is cooled to room temperature, add hydrogen peroxide and deionized water, wash with water three times, take out the product and dry it in a freeze dryer to obtain graphene oxide;

[0039](2) Put 6 grams of pyromellitic dianhydride and 6.5 grams of 4,4'-diaminodiphenyl ether into a flask protected by a nitrogen atmosphere, add dimethylacetamide, and o C was stirred for 5 hours. After the reaction was completed, deionized water was added to precipitate the precipitated product. After being cleaned with ion water, it is dried in a vacuum drying oven to obtain polyamic acid salt;

[0040] (3) Dissolve 4 grams of graphene and 1 gram of graphene oxi...

Embodiment 2

[0043] Example 2: The implementation method is the same as in Example 1, and the components of the graphene mixed slurry obtained in step (3) are changed to 3 grams of graphene and 2 grams of graphene oxide dissolved in deionized water, fully stirred evenly, and then ultrasonicated for 0.5 hours , and then add 0.5 grams of triethanolamine and 2 grams of polyamic acid salt according to the proportion, and the other components and quality remain unchanged.

Embodiment 3

[0044] Example 3: The implementation method is the same as in Example 1, and the components of the graphene mixed slurry obtained in step (3) are changed to 2 grams of graphene and 3 grams of graphene oxide dissolved in deionized water, fully stirred evenly, and then ultrasonicated for 0.5 hours , and then add 0.5 grams of triethanolamine and 2 grams of polyamic acid salt according to the proportion, and the other components and quality remain unchanged.

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Abstract

The invention relates to an annual-ring-shaped graphene organic silicon resin biomimetic composite material, and a preparation method and application thereof. The annual-ring-shaped graphene organic silicon resin biomimetic composite material comprises, by mass, 55-73% of an organic silicon resin matrix, 20-40% of an annual-ring-shaped graphene biomimetic skeleton array and 5-7% of a curing agent.The annual-ring-shaped graphene bionic skeleton array is prepared by using a 3D printing technology, and the skeleton is of a concentric-circle hierarchical structure and can effectively form a vertical through conduction network, so that the composite material shows excellent heat conduction and electric conduction performance under the condition of relatively low graphene content. The highest thermal conductivity of the composite material is greater than 20 W/mK, and the highest electric conductivity is greater than 100 S/m. The bionic composite material disclosed by the invention is non-toxic, environment-friendly, low in cost, convenient to prepare and easy for expanded production, is a thermal interface material with excellent performance, and can be applied to the fields of 5G communication equipment, electronic packaging, aerospace, energy and chemical industry and the like.

Description

technical field [0001] The invention belongs to the field of electronic packaging and thermal interface materials, and in particular relates to an annual ring-shaped graphene organic silicon resin bionic composite material and its preparation method and application. Background technique [0002] High-performance 5G communication devices and wearable devices require the use of electronic packaging and thermal interface materials with high thermal conductivity to conduct heat in a timely manner to prevent excessive waste heat generated during the operation of electronic systems from causing damage to devices and avoid fires. However, as a common electronic packaging polymer, especially a flexible packaging polymer, silicone resin usually only has a very low thermal conductivity, about 0.2 W / mK. This directly restricts the application of silicone resin in the field of electronic packaging and heat dissipation, and limits the further improvement of the performance of advanced el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K3/04C08K7/00C09K5/14
CPCC08K3/042C08K7/00C09K5/14C08K2201/014C08K2201/001C08L83/04
Inventor 徐之光江悦
Owner JIAXING UNIV
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