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Method for preparing anti-irradiation tungsten/copper coating on surface of low-activation steel

A low-activation steel and copper coating technology, applied in the coating, metal material coating process, ion implantation plating, etc., can solve the problems of easy falling off, large difference in thermal expansion coefficient between the substrate and tungsten, and achieve good repeatability, Excellent radiation resistance and simple preparation process

Inactive Publication Date: 2020-11-03
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to provide a method for preparing an anti-irradiation tungsten / copper coating on the surface of low-activation steel. The problem of easy falling off in the environment, in addition, the coating grains prepared by magnetron sputtering method are fine, which improves the radiation resistance of the coating

Method used

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  • Method for preparing anti-irradiation tungsten/copper coating on surface of low-activation steel
  • Method for preparing anti-irradiation tungsten/copper coating on surface of low-activation steel
  • Method for preparing anti-irradiation tungsten/copper coating on surface of low-activation steel

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Embodiment 1

[0026] In this embodiment, the method for preparing an anti-irradiation tungsten / copper coating on the surface of low-activation steel is as follows:

[0027] Step 1: Pretreatment of the substrate

[0028] Pass the RAFM steel matrix through 120 # 、320 # 、600 # , 800 # Silicon carbide sandpaper was ground and polished step by step to the mirror surface, and after ultrasonic cleaning and drying, a RAFM steel sample with a smooth surface was obtained;

[0029] Step 2: Preparation of copper interlayer

[0030] The RAFM steel sample and the copper target with a purity of 99.99% were installed in the magnetron sputtering chamber, and then evacuated to 2×10 -4 Pa (about 3 to 4 hours), pass in argon gas, adjust the flow rate of argon gas to 50 through the flowmeter, adjust the total working pressure to 2.5Pa, then turn on the DC sputtering switch, set the sputtering power to 40W, and pre-sputter After about ten minutes of sputtering, the sputtering program was started, and the s...

Embodiment 2

[0035] In this embodiment, the method for preparing an anti-irradiation tungsten / copper coating on the surface of low-activation steel is as follows:

[0036] Step 1: Pretreatment of the substrate

[0037] Pass the RAFM steel substrate through 120 # 、320 # 、600 # , 800 # Silicon carbide sandpaper was ground and polished step by step to the mirror surface, and after ultrasonic cleaning and drying, a RAFM steel sample with a smooth surface was obtained;

[0038] Step 2: Preparation of copper interlayer

[0039] The RAFM steel sample and the copper target with a purity of 99.99% were installed in the magnetron sputtering chamber, and then evacuated to 2×10 -4 Pa (about 3 to 4 hours), pass in argon gas, adjust the flow rate of argon gas to 50 through the flowmeter, adjust the total working pressure to 2.5Pa, then turn on the DC sputtering switch, set the sputtering power to 40W, and pre-sputter After about ten minutes of sputtering, the sputtering program was started, and th...

Embodiment 3

[0044] In this embodiment, the method for preparing an anti-irradiation tungsten / copper coating on the surface of low-activation steel is as follows:

[0045] Step 1: Pretreatment of the substrate

[0046] Pass the RAFM steel substrate through 120# 、320 # 、600 # , 800 # Silicon carbide sandpaper was ground and polished step by step to the mirror surface, and after ultrasonic cleaning and drying, a RAFM steel sample with a smooth surface was obtained;

[0047] Step 2: Preparation of copper interlayer

[0048] The RAFM steel sample and the copper target with a purity of 99.99% were installed in the magnetron sputtering chamber, and then evacuated to 2×10 -4 Pa (about 3 to 4 hours), pass in argon gas, adjust the flow rate of argon gas to 50 through the flowmeter, adjust the total working pressure to 2.5Pa, then turn on the DC sputtering switch, set the sputtering power to 40W, and pre-sputter After about ten minutes of sputtering, the sputtering program was started, and the ...

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Abstract

The invention discloses a method for preparing an anti-irradiation tungsten / copper coating on the surface of low-activation steel. The problem that a matrix and tungsten are easy to fall off in a high-temperature environment due to a large difference of thermal expansion coefficients is solved by the tungsten / copper coating prepared by a magnetron sputtering method, in addition, the coating prepared by a magnetron sputtering method is fine in grain, and the anti-irradiation performance of the coating is improved. The thickness of a tungsten coating obtained on the surface of the low-activationsteel is 2-4 microns, the thickness of a copper coating is about 5 microns, the surface of the coating is smooth and compact, the coating is intact after irradiation, and the morphology and the structure are not changed.

Description

technical field [0001] The invention relates to a method for preparing a functional coating on the surface of low-activation steel, in particular to a method for preparing an anti-irradiation tungsten / copper coating on the surface of low-activation steel. Background technique [0002] Controlled thermonuclear fusion energy has become an ideal energy source for the future of human society due to its abundant resources and environmental friendliness. It is one of the most likely methods to realize controlled thermonuclear fusion at present. However, the realization of nuclear fusion energy still faces many challenges. One of the key issues is the first-wall materials facing high-temperature plasma, that is, plasma-facing materials (PFMs, Plasma-Facing Materials). Inside the fusion device, the PFM and its components are faced with a complex service environment, and they have to withstand the bombardment of various particles (D, T, He, electrons, neutrons, impurity particles, et...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/02C23C14/16C23C14/54
CPCC23C14/352C23C14/028C23C14/165C23C14/54
Inventor 罗来马吴左生吴玉程徐跃刘东光昝祥
Owner HEFEI UNIV OF TECH
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