Power synthesis amplifier, implementation method, device and system

Abstract

The invention discloses a power synthesis amplifier, and an implementation method, device and system, and the method comprises the steps that multi-stage waveguide power divisionis conducted on an input signal through a waveguide power division unit, and a to-be-displayed input power is obtained after one path of input signal passes through a unidirectional coupling detection unit at an input end;and after being amplified by a power amplification unit and synthesized by a waveguide synthesis unit in sequence, the multiple paths of input signals subjected to multi-stage waveguide power division pass through a bidirectional coupling detection unit at an output end to obtain output power to be displayed. By adopting the integrated design of power division, amplification, synthesis, couplingand detection, the output path is shortened, the path loss is reduced, the synthesis efficiency is improved, and the display of the input power and the output power obtained by completing coupling detection through the unidirectional coupling detection unit at the input end and the bidirectional coupling detection unit at the output end is realized.

Description

technical field [0001] The present invention relates to the technical field of power synthesis and amplification, in particular to a power synthesis amplifier, an implementation method, a device and a system. Background technique [0002] The statements in this section merely provide background information related to the present invention and do not necessarily constitute prior art. [0003] With the development of amplifier technology, millimeter-wave solid-state power amplifiers are used for millimeter-wave signal amplification, and can be used in wireless communication systems, radar jammers, reconnaissance aircraft, and electronic equipment. The internal integrated coupling detection unit is used to detect the coupled signal of the forward output power and the coupled signal of the reflected power. At the same time, in order to improve the power of the whole machine, a high-power chip will be used for multiplexing. As the amplifier uses high-power chips for multiplexing...

AI Technical Summary

Problems solved by technology

[0004] The coupling detection unit of the current millimeter-wave solid-state power amplifier is a waveguide directional coupler located at the output of the power amplifier. The coupler is added to the output of the amplifier as a separate component. When the signal passes through the coupler after being amplified and output, it will be coupled. Part of the signal is detected; however, this method not only lengthens the output path, which affects the miniaturization design of the whole machine, but also requires high processing accuracy due to the small size of the waveguide in the millimeter wave frequency band. The signal transmission between the waveguide couplers is not smooth, which increases the path loss and reduces the synthesis efficiency of the whole machine

[0005] The main heat dissipation solution of the current power combiner is to add a radiator to the lower chamber of the combiner module, and rely on screws to fix the two together, and maximize the heat dissipation efficiency by optimizing the size and number of fins on the radiator; but , this method will cause the heat sink and the cavity to be not tightly bonded, and the heat inside the cavity cannot be conducted in time, resulting in low heat dissipation efficiency of the module

[0006] In the solid-state power amplifier, due to the large number of synthetic circuits, each chip needs to be powered separately. After the positive and negative voltages of the chip are drawn out through the power supply wires, the power supply wires of multiple modules are merged into a bias board, so the voltage supply There are too many power supply lines between the bias board and the synthesizer; and the large number of internal power supply cables leads to crosstalk problems, resulting in unstable output power, affecting the supply voltage, resulting in unstable supply voltage, and the output power of the chip will also fluctuate. The beating will affect the stability of the output power of the whole machine; at present, more winding magnetic rings are used to suppress the mutual influence between the power supply lines, but it will increase the difficulty of wiring inside the whole machine and increase the cost

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