High-performance acrylic resin type photosensitive circuit board ink and preparation method thereof

A technology of acrylic resin and circuit board, which is applied in the field of ink and can solve problems such as thermal stability and poor electrical signal transmission

Active Publication Date: 2021-01-05
连云港百利合新材料发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The anti-etching ink prepared by the invention has the characteristics of strong water solubility, high sensitivity, good heat resistance, fast film removal speed, and good acid and alkali resistance, but there are problems of thermal stability and poor electrical signal transmission.

Method used

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  • High-performance acrylic resin type photosensitive circuit board ink and preparation method thereof

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preparation example Construction

[0026] The preparation method of described high-performance acrylic resin type photosensitive circuit board ink comprises the following steps:

[0027] S1: Mix epoxy acrylate resin, cyanate prepolymer, and N-phenylmaleimide, add epoxy resin curing agent, heat up to 70-78°C, stir for 25-35min, then add maleic anhydride , styrene, acrylic acid, slowly heated up to 90°C, reacted for 1-2h, and then distilled under reduced pressure to remove the organic solvent, to obtain a weak base water-soluble photosensitive epoxy acrylate prepolymer;

[0028] S2: Mix the weak base water-soluble photosensitive epoxy acrylate prepolymer, photosensitive monomer and water-based photoinitiator, pigment, filler, wetting agent, dispersant, defoamer, drier, thixotropic agent, water according to Proportionally mixed, fully stirred and emulsified by a high-speed disperser for 2-3 hours, and then ground by a three-roll mill to a fineness of ≤5 μm to obtain the ink.

[0029] Preferably, in the step S1, t...

Embodiment 1

[0032]A high-performance acrylic resin type photosensitive circuit board ink, in parts by weight, includes the following components: 140 parts of the epoxy acrylate resin, 35 parts of cyanate ester prepolymer, N-phenylmaleimide 25 parts of amine, 1.8 parts of maleic anhydride, 3 parts of styrene, 10 parts of acrylic acid, 3 parts of epoxy resin curing agent, 6 parts of photosensitive monomer, 0.6 part of wetting agent, 0.4 part of dispersant, 1.5 parts of defoamer, 3 parts of drier, 0.4 parts of thixotropic agent, 11 parts of water-based photoinitiator, 0.5 parts of pigment, 30 parts of filler, 4 parts of water.

[0033] The preparation method of above-mentioned high-performance acrylic resin type photosensitive circuit board ink, comprises the following steps:

[0034] S1: Mix epoxy acrylate resin, cyanate prepolymer and N-phenylmaleimide, add epoxy resin curing agent, heat up to 75°C, stir for 30min, then add maleic anhydride, styrene, Acrylic acid, slowly heated up to 90°C...

Embodiment 2

[0037] A high-performance acrylic resin photosensitive circuit board ink, in parts by weight, comprising the following components: 130 parts of epoxy acrylate resin, 31 parts of cyanate ester prepolymer, 22 parts of N-phenylmaleimide 2.4 parts of maleic anhydride, 4 parts of styrene, 8 parts of acrylic acid, 1 part of epoxy resin curing agent, 5 parts of photosensitive monomer, 0.6 parts of wetting agent, 0.3 parts of dispersant, 1.2 parts of defoamer, drying 2.5 parts of agent, 0.5 parts of thixotropic agent, 12 parts of water-based photoinitiator, 0.5 parts of pigment, 38 parts of filler, and 2 parts of water.

[0038] The preparation method of above-mentioned high-performance acrylic resin type photosensitive circuit board ink, comprises the following steps:

[0039] S1: Mix epoxy acrylate resin, cyanate prepolymer, and N-phenylmaleimide, add epoxy resin curing agent, heat up to 78°C, stir for 25 minutes, then add maleic anhydride, styrene, For acrylic acid, slowly raise t...

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PUM

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Abstract

The invention provides a high-performance acrylic resin type photosensitive circuit board ink and a preparation method thereof, and belongs to the technical field of ink. The ink comprises the following components in parts by weight: 120-160 parts of epoxy acrylate resin, 25-40 parts of cyanate ester prepolymer, 12-40 parts of N-phenylmaleimide, 1.2-2.4 parts of maleic anhydride, 2-4 parts of styrene, 8-12 parts of acrylic acid, 1-5 parts of epoxy resin curing agent, 5-7 parts of photosensitive monomer, 0.5-0.7 part of wetting agent, 0.2-0.6 part of dispersing agent, 1.2-1.8 parts of defoamingagent, 2.5-4.5 parts of drier, 0.3-0.5 part of thixotropic agent, 10-12 parts of water-based photoinitiator, 0.4-0.6 part of pigment, 25-38 parts of filler and 2-5 parts of water. Under the mutual cooperation of the epoxy acrylate resin, the cyanate ester prepolymer and the N-phenyl maleimide, the dielectric property and the thermal stability of the ink are synergistically improved.

Description

technical field [0001] The invention belongs to the technical field of ink, and in particular relates to a high-performance acrylic resin type photosensitive circuit board ink and a preparation method thereof. Background technique [0002] Photocurable insulating ink, also known as Ultraviolet UV photosensitive imaging ink, was first successfully developed in Japan in the 1990s and applied to the manufacture of high-density multilayer circuit boards. It is developed on the basis of photosensitive solder resist ink for PCB, and its difference lies in its electrical insulation, adhesion with electroplated copper lines, moisture resistance, heat resistance, flatness and other aspects have been significantly improved and improve. It is to screen-print the photosensitive ink layer on the copper clad board, and develop the image at the specific hole position, so that the reserved copper pad at the bottom of the bowl is exposed to form a bowl-shaped bare blind hole. Then chemical...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101C09D11/03G03F7/027G03F7/004
CPCC09D11/03C09D11/101G03F7/004G03F7/027
Inventor 张鲁桂王胜平张海庭
Owner 连云港百利合新材料发展有限公司
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