Preparation method of high-frequency high-Q capacitor

Abstract

The invention discloses a preparation method of a high-frequency high-Q capacitor, which sequentially comprises the following steps of preparing high-activity composite powder with a 'shell-core' structure, mixing the high-activity composite powder with an organic solvent, a dispersing agent, a plasticizer, a defoaming agent and a slurrying agent to prepare high-rheological-property casting slurry, and carrying out casting treatment to prepare a dielectric film, processing the capacitor ceramic chip into a bar block through dielectric film printing lamination, laminating the bar block into a capacitor green chip, performing high-temperature glue discharging and high-temperature sintering on the capacitor green chip to form the capacitor ceramic chip, covering the surface with a nickel layer and a tin layer, sorting after a reliability test, and packaging qualified products. The capacitor prepared by the invention has the characteristics of high Q value, low equivalent series resistanceand high self-resonant frequency, and ensures extremely low loss transmission of microwave circuit signals.

Description

technical field [0001] The invention belongs to a preparation method of a high-frequency high-Q capacitor. Background technique [0002] Information technology is leading the transformation of our times at an unprecedented speed, promoting the development of electromagnetic materials and devices in the radio frequency, microwave and millimeter wave bands from analog to digital, from fixed frequency to frequency conversion, and from connectors to planar chips. The use frequency band of materials, synthesis process and means, microstructure and mechanical, thermal, optical and electrical properties have all put forward new requirements. Components based on these materials must be small, thin, light, low power consumption, high reliability, and high stability as the development goals. New high-performance core components and their manufacturing materials have become the main focus in the field of high-end passive electronic components in the world today. research problem. The...

AI Technical Summary

Problems solved by technology

The high-frequency and high-Q capacitors produced by Chinese enterprises have small capacity and are used under 1MHz radio frequency conditions. The Q value is low (generally lower than 1000), which cannot meet the requirements of modern mobile communication equipment.

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