Preparation method of high-frequency high-Q capacitor

A capacitor and high-frequency technology, applied in the field of high-frequency high-Q capacitor preparation, can solve the problems of high-frequency, high-Q capacitors with small capacity, low Q value, and inability to meet the requirements of mobile communication equipment, and achieves low equivalent series connection. Effects of resistance, high Q, high self-resonant frequency

Pending Publication Date: 2021-03-23
GUANGDONG FENGHUA BANGKE ELECTRONIC CO LTD
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

The high-frequency and high-Q capacitors produced by Chinese enterprises have small capacity and are used under 1MHz radio frequency c

Method used

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  • Preparation method of high-frequency high-Q capacitor
  • Preparation method of high-frequency high-Q capacitor
  • Preparation method of high-frequency high-Q capacitor

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Experimental program
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Effect test

Embodiment

[0034] A method for preparing a high-frequency high-Q capacitor, comprising the following steps:

[0035]Step 1. Preparation of highly active composite powder with "shell-core" structure, the specific steps are as follows:

[0036] e. First, prepare Ba6-3xNd8+2xTi18O54 powder by hydrothermal method, put titanium tetrachloride, barium acetate, neodymium chloride and doping element solution in an autoclave, and carry out high pressure at 175-275°C

[0037] f. Hydrothermal reaction to obtain Ba6-3xNd8+2xTi18O54 high-activity powder uniformly doped with trace elements, for future use;

[0038] c. It is planned to add ultrasonic vibration treatment to the powder obtained in the specific step a, so that the agglomeration effect of the powder is reduced, and the dispersibility and activity are further improved. The Ba6-3xNd8+2xTi18O54 powder preparation process flow chart is as follows figure 1 shown. Then, mix the Ba6-3xNd8+2xTi18O54 powder prepared in the specific step b with Mg(...

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Abstract

The invention discloses a preparation method of a high-frequency high-Q capacitor, which sequentially comprises the following steps of preparing high-activity composite powder with a 'shell-core' structure, mixing the high-activity composite powder with an organic solvent, a dispersing agent, a plasticizer, a defoaming agent and a slurrying agent to prepare high-rheological-property casting slurry, and carrying out casting treatment to prepare a dielectric film, processing the capacitor ceramic chip into a bar block through dielectric film printing lamination, laminating the bar block into a capacitor green chip, performing high-temperature glue discharging and high-temperature sintering on the capacitor green chip to form the capacitor ceramic chip, covering the surface with a nickel layer and a tin layer, sorting after a reliability test, and packaging qualified products. The capacitor prepared by the invention has the characteristics of high Q value, low equivalent series resistanceand high self-resonant frequency, and ensures extremely low loss transmission of microwave circuit signals.

Description

technical field [0001] The invention belongs to a preparation method of a high-frequency high-Q capacitor. Background technique [0002] Information technology is leading the transformation of our times at an unprecedented speed, promoting the development of electromagnetic materials and devices in the radio frequency, microwave and millimeter wave bands from analog to digital, from fixed frequency to frequency conversion, and from connectors to planar chips. The use frequency band of materials, synthesis process and means, microstructure and mechanical, thermal, optical and electrical properties have all put forward new requirements. Components based on these materials must be small, thin, light, low power consumption, high reliability, and high stability as the development goals. New high-performance core components and their manufacturing materials have become the main focus in the field of high-end passive electronic components in the world today. research problem. The...

Claims

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Application Information

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IPC IPC(8): H01G4/30H01G4/12H01G13/00C04B35/462C04B35/50C04B35/628C04B41/90
CPCC04B35/462C04B35/50C04B35/62218C04B35/62805C04B41/009C04B41/52C04B41/90C04B2235/444C04B2235/449C04B2235/606H01G4/1209H01G4/1227H01G4/30H01G13/00C04B41/5144C04B41/5161
Inventor 高泮嵩黎锐郭军坡黄浩徐建平李飞张孟熙
Owner GUANGDONG FENGHUA BANGKE ELECTRONIC CO LTD
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