Check patentability & draft patents in minutes with Patsnap Eureka AI!

Novel UV thermal dual-curing adhesive and preparation method thereof

A dual-curing, curing agent technology, applied in the direction of in-line phenolic epoxy resin adhesives, adhesives, polyurea/polyurethane adhesives, etc., can solve the problems of insufficient hardness and strength, poor adhesion, and high optical radiation energy. Achieve excellent high strength and adhesion and sealing, excellent UV curing performance and anti-yellowing performance, excellent heat resistance.

Inactive Publication Date: 2021-04-13
深圳市宏进科技有限公司
View PDF2 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the following shortcomings in the prior art. The existing UV-heat dual-curable UV heat dual-cure adhesive has a low photocuring rate or requires high light radiation energy, insufficient hardness and strength, and stickiness. Poor adhesion and other defects, and a new type of UV heat dual curing adhesive proposed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Novel UV thermal dual-curing adhesive and preparation method thereof
  • Novel UV thermal dual-curing adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] S1: Add 15 parts of IBOMA and 10 parts of epoxidized novolac resin to 40 parts of EPC-1 with a viscosity of 20,000 cps and 60 parts of EPC-2 with a viscosity of 3,000 cps, and dehydrate for 2 hours at 600 Pa, 120°C and vacuum;

[0071] S2: After cooling to room temperature, 15 parts of tetrakis(3-mercaptobutyric acid) pentaerythritol ester and 0.1 part of barbituric acid were added to the above base polymer, and the stirring was continued for 30 minutes under vacuum;

[0072] S3: Add 0.4 parts of 2-hydroxy-2-methyl-1-phenyl-1-propanone and 0.15 parts of ethyl-4-methylimidazole to the above base polymer, and continue stirring for 0.5 h to make it well mixed;

[0073] S4: After vacuum defoaming and sealed storage, the product is UV heat dual curing adhesive.

Embodiment 2

[0075] S1: Add 10 parts of HDDA and 15 parts of bisphenol A type epoxy resin to 100 parts of EPC-2 with a viscosity of 3000cps and 60 parts of epoxy-modified polyurethane acrylic resin with a viscosity of 30000cps, and put them under 600pa, 120℃ and vacuum conditions Dehydration for 2 hours;

[0076] S2: After cooling to room temperature, 10 parts of pentaerythritol tetrakis(3-mercaptobutyrate) and 0.2 parts of methylhydroquinone were added to the above polymer, and the stirring was continued for 50 minutes under vacuum;

[0077]S3: Add 0.5 part of 2-hydroxy-2-methyl-1-phenyl-1-propanone, 0.2 part of the adduct of 2-methylimidazole and butyl glycidyl ether to the above polymer, and Continue to stir for 0.5h under vacuum to make it fully mixed;

[0078] S4: After vacuum defoaming and sealed storage, the product is UV heat dual curing adhesive.

Embodiment 3

[0080] S1: Add 15 parts of NPGDA to 100 parts of EPC-2 synthesized in Example 1, 40 parts of bisphenol A epoxy resin with a viscosity of 30000cps, and dehydrate for 2 hours at 600Pa, 120°C and vacuum conditions;

[0081] S2: After cooling to room temperature, add 15 parts of trimethylolpropane tris(3-mercaptopropionate) ester and 0.5 part of 4-methoxy-1-naphthol to the gum base, and continue stirring under vacuum 60min;

[0082] S3: Add 0.5 parts of 1-hydroxycyclohexylbenzophenone and 0.2 parts of 2-ethylimidazole to the above base polymer together, and continue to stir for 0.5 h under vacuum to make them fully mixed;

[0083] S4: After vacuum defoaming and sealed storage, the product is UV heat dual curing adhesive.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a novel UV thermal dual-curing adhesive which comprises an adhesive, and the adhesive comprises (A) 100 parts of epoxy modified polyurethane acrylic resin, (B) 0-200 parts of acrylic monomer, (C) 0-100 parts of epoxy resin, (D) 0.01-5 parts of photoinitiator, (E) 10-20 parts of curing agent, (F) 0.01-5 parts of stabilizer and (G) 0.0001-2 parts of accelerant. The UV thermal dual-curing adhesive can be cured in an ultraviolet irradiation mode and can also be cured in a heating mode, and the obtained UV thermal dual-curing adhesive has excellent high strength and bonding sealing performance, also has excellent ultraviolet curing performance and yellowing resistance, and has wide application in attachment of connectors, sensors and optical devices.

Description

technical field [0001] The invention relates to the technical field of organosilicon polymer materials, in particular to a novel UV heat dual curing adhesive. Background technique [0002] With the advent of the smart era, fast charging and data transmission have become increasingly popular, and the fast propagation effect of optical fiber will be used more extensively. Using UV heat dual-curing adhesive to seal and bond optical fibers and connectors can reduce glare and light loss, increase bonding strength, sealing performance, and significantly improve the reliability of optical fiber signal transmission. [0003] The UV thermal dual curing adhesive based on epoxy modified polyurethane resin acrylic modified material has the characteristics of non-toxic, odorless, high hardness and good adhesion. This material has dual characteristics of UV curing and thermal curing , UV curing can be used to quickly shape the system or achieve surface dryness, and heat curing can be use...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J175/14C09J163/04C09J11/06
CPCC09J175/14C09J11/06C08L2205/03C08L2205/025C08L2201/08C08L75/14C08L63/04C08L63/00C08K5/3462C08K5/13
Inventor 康润华刘奇明
Owner 深圳市宏进科技有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com