Passivation contact cell and preparation method and application thereof
A battery and oxide layer technology, applied in the field of solar cells, can solve the problems of battery efficiency and solar energy efficiency, and achieve good light conversion efficiency and yield
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Embodiment 1
[0125] This embodiment provides a method for preparing a passivated contact electrode, comprising the following steps:
[0126] (1) The N-type base layer (phosphorus-doped monocrystalline silicon chip) is pre-textured, and then the N-type base layer after the texture is divided into three steps for boron diffusion. In boron bromide, conduct source deposition at a temperature of 900°C for 40 minutes, in the second step, carry out push treatment at a temperature of 1050°C for 60 minutes in nitrogen gas with a flow rate of 15 slm, and in the third step at a flow rate of 15 slm of oxygen In the process, oxidation treatment was carried out at a temperature of 1050°C for 80 minutes to obtain an N-type base layer in which the emitter layer and the borosilicate glass layer were sequentially stacked on the front, back and sides;
[0127] (2) The front, back and sides obtained in step (1) are all sequentially laminated with the N-type base layer of the emitter layer and the borosilicate...
Embodiment 2
[0138] This embodiment provides a method for preparing a passivated contact electrode, comprising the following steps:
[0139] (1) The N-type base layer (phosphorus-doped monocrystalline silicon wafer) is pre-textured, and then the N-type base layer after the texture is divided into three steps for boron diffusion. In boron bromide, the source deposition was carried out at a temperature of 850°C for 50 minutes, the second step was carried out at a temperature of 1000°C for 100 minutes in a nitrogen gas with a flow rate of 20slm, and the third step was simultaneously passed through a flow rate of 20slm Oxygen, oxidize at a temperature of 1100°C for 60 minutes to obtain an N-type base layer with an emitter layer and a borosilicate glass layer laminated in sequence on the front, back and sides;
[0140] (2) The N-type base layer with emitter layer and borosilicate glass layer laminated in sequence on the front, back and side surfaces obtained in step (1) is subjected to hydroflu...
Embodiment 3
[0148] This embodiment provides a method for preparing a passivated contact cell, comprising the following steps:
[0149] (1) The N-type base layer (phosphorus-doped monocrystalline silicon wafer) is pre-textured, and then the N-type base layer after the texture is divided into three steps for boron diffusion. In boron bromide, conduct source deposition at a temperature of 950°C for 30 minutes, in the second step, carry out push treatment at a temperature of 1100°C for 40 minutes in a nitrogen gas with a flow rate of 10 slm, and in the third step in an oxygen flow rate of 10 slm Under the condition of oxidizing at 1000°C for 100 minutes, an N-type base layer with an emitter layer and a borosilicate glass layer laminated in sequence on the front, back and side surfaces was obtained;
[0150] (2) The front, back and sides obtained in step (1) are all sequentially laminated with the N-type base layer of the emitter layer and the borosilicate glass layer, and the concentration is 1...
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