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Boron-doped graphene reinforced copper-based composite material and preparation method thereof

A copper-based composite material and composite material technology, which is applied in the field of boron-doped graphene-reinforced copper-based composite materials and its preparation, can solve problems such as the decline in electrical conductivity, improve mechanical strength and electrical conductivity, realize close connection, increase Combining the effects of the interface

Active Publication Date: 2021-06-01
AVIC BEIJING AERONAUTICAL MFG TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] To sum up, the current composite methods all have shortcomings. Most of the methods can effectively improve the mechanical strength of copper-based composite materials, but will cause a decrease in electrical conductivity.

Method used

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  • Boron-doped graphene reinforced copper-based composite material and preparation method thereof
  • Boron-doped graphene reinforced copper-based composite material and preparation method thereof
  • Boron-doped graphene reinforced copper-based composite material and preparation method thereof

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Experimental program
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Embodiment 1

[0041] In this embodiment, the boron-doped graphene-reinforced copper-based composite material includes a copper substrate and boron-doped graphene uniformly distributed in the copper substrate. The boron-doped graphene is doped with boron on the graphene sheet, and Cu-B-C bonds are formed between the graphene and the copper substrate.

[0042] The preparation method of boron-doped graphene reinforced copper-based composite material in the present embodiment ( figure 1 shown), the steps are as follows:

[0043] (1) Preparation of boron-doped graphene

[0044] Boric acid is dissolved in ethanol, then add graphene and mix, obtain graphene / boric acid mixed solution, the mass ratio of described boric acid and graphene is 1:1, and graphene sheet size is 30-50 μ m, sheet layer 2- 3 floors;

[0045] Filter the graphene / boric acid mixed solution to obtain a solid mixture; place the solid mixture in a hydrogen-argon gas mixture, wherein hydrogen accounts for 5 vol%, raise the temper...

Embodiment 2

[0051] In this embodiment, the boron-doped graphene-reinforced copper-based composite material includes a copper substrate and boron-doped graphene uniformly distributed in the copper substrate. The boron-doped graphene is doped with boron on the graphene sheet, and Cu-B-C bonds are formed between the graphene and the copper substrate.

[0052] The preparation method of boron-doped graphene reinforced copper-based composite material in the present embodiment, the steps are as follows:

[0053] (1) Preparation of boron-doped graphene

[0054] Boric acid is dissolved in ethanol, then add graphene and mix, obtain graphene / boric acid mixed solution, the mass ratio of described boric acid and graphene is 3:1, and graphene sheet size is 30-50 μ m, sheet layer 2- 3 floors;

[0055] Filter the graphene / boric acid mixture to obtain a solid mixture; place the solid mixture in a hydrogen-argon gas mixture, wherein hydrogen accounts for 5 vol%, raise the temperature to 1000° C. and keep...

Embodiment 3

[0061] In this embodiment, the boron-doped graphene-reinforced copper-based composite material includes a copper substrate and boron-doped graphene uniformly distributed in the copper substrate. The boron-doped graphene is doped with boron on the graphene sheet, and Cu-B-C bonds are formed between the graphene and the copper substrate.

[0062] The preparation method of boron-doped graphene reinforced copper-based composite material in the present embodiment, the steps are as follows:

[0063] (1) Preparation of boron-doped graphene

[0064] Boric acid is dissolved in ethanol, then add graphene and mix, obtain graphene / boric acid mixed solution, the mass ratio of described boric acid and graphene is 5:1, and graphene sheet size is 30-50 μ m, sheet layer 2- 3 floors;

[0065] Filter the graphene / boric acid mixture to obtain a solid mixture; place the solid mixture in a hydrogen-argon gas mixture, wherein hydrogen accounts for 5 vol%, raise the temperature to 1100°C and keep i...

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Abstract

The invention relates to the technical field of metal-based composite materials, and particularly discloses a boron-doped graphene reinforced copper-based composite material and a preparation method thereof. According to the copper-based composite material, the boron-doped graphene serves as a reinforcement body, the bonding interface of copper and graphene is effectively increased, interface electron transmission is improved, boron doping is carried out on a complete graphene sheet layer, the structural integrity of the graphene is basically not damaged, the electron transmission performance of the boron-doped graphene is better, meanwhile, a Cu-B-C bond can be formed between the graphene and a copper substrate, and interface bonding and electron transmission are both considered. According to the preparation method, processes such as graphene doping, mixing of a copper raw material and a reinforcement body and heat treatment are combined, and the copper-based composite material with uniformly distributed boron-doped graphene is successfully prepared, experiments prove that the tensile strength of the boron-doped graphene reinforced copper-based composite material is not lower than 308.6 MPa, and the conductivity of the boron-doped graphene reinforced copper-based composite material is not lower than 90.6% IACS.

Description

technical field [0001] The invention relates to the technical field of metal-based composite materials, in particular to a boron-doped graphene-reinforced copper-based composite material and a preparation method thereof. Background technique [0002] Copper and copper alloys have the characteristics of electrical conductivity, thermal conductivity, corrosion resistance, and good plasticity. They are important basic materials for national economic construction and are widely used in many fields such as electronic information and aerospace. With the development of material science and modern industry, higher requirements are placed on the properties of copper, and copper-based composites are likely to meet these requirements. In copper-based composite materials, the improvement of mechanical strength and the improvement of electrical conductivity are a pair of prominent contradictions, and it is difficult to improve them synergistically. [0003] At present, there are mainly ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C1/05C22C1/10B22F3/02B22F3/14B22F1/00C22F1/08C22F1/02C01B32/194
CPCB22F1/0003C22C9/00C22C1/05B22F3/02B22F3/14C22F1/08C22F1/02C01B32/194
Inventor 杨名李铁军刘文祎王耀奇侯红亮
Owner AVIC BEIJING AERONAUTICAL MFG TECH RES INST
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