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Low-temperature soldering paste added with anti-falling particles

An anti-drop and particle technology, which is applied in welding equipment, welding medium, metal processing equipment, etc., can solve the problem of low drop performance of solder joints, and achieve the effects of diverse acquisition methods, strong impact resistance, and simple preparation process

Inactive Publication Date: 2021-06-11
云南锡业集团(控股)有限责任公司研发中心
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem of low drop performance of solder joints formed by low-temperature SnBi solder paste, the invention provides a low-temperature solder paste with anti-drop particles. The low-temperature solder paste includes 80%-90% of solder alloy, 10%-20% of flux %, also includes organic particles and / or Mxene material;

Method used

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  • Low-temperature soldering paste added with anti-falling particles
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  • Low-temperature soldering paste added with anti-falling particles

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Example 1: The preparation method of low temperature solder paste without the addition of anti-drop particles is as follows:

[0033] 1, prepare flux:

[0034] The active agent (5% dika, DL-maline acid 3%, 2-ethylimidazole), film forming agent (PEG-2000 2%, acrylic modified rosin 18%, hydrogen smear 18%), touch The variable agent (4% hydrogenated castor oil), surfactant (PVP 1%), corrosion inhibitor (benzotriazole 1%) and solvent (40% of diethylene glycol Handhehered ether) mixed;

[0035] 2, 90% of the Sn-Bi alloy solder powder and the flux 10% in the step 1 are mixed, stirred for 0.5 h, resulting in an additional low temperature solder paste;

[0036] 3. Printing the solder paste in the surface of the pure copper pad, the pad size is 0.8mm, and reflow solder after the mounting components; the solder joint is from 75cm, freely fall, record the number of pads, as the pad diameter is 0.8 MM's reference sample, which falls behind the broken SEM map figure 1 See Table 1 for th...

Embodiment 2

[0037] Example 2: The preparation method of low temperature solder paste added to nylon 6 particles is as follows:

[0038] 1, prepare flux:

[0039] According to the mass ratio, the active agent (5% dika, 3%, 2-ethylimidazole), a film forming agent (PEG-20002%, acrylic-modified rosin 18%, 18% hydrogen fluid) , Thixotropic (4% hydrogenated castor oil), surfactant (PVP 1%), corrosion inhibitor (benzatonazole 1%), and solvent (diethylene glycol Handhethoid ether 40%) mixed uniform; According to 2%, 4%, 6% of the flux mass, nylon 6 particles having a particle diameter of 5 to 10 μm are added to the flux, respectively, and mixed mixing is mixed.

[0040] 2, 90% of the Sn-Bi alloy solder powder with the flux 10% in the step 1, stirred for 0.5 h, resulting in a low temperature solder paste added nylon 6 particles; nylon 6 particles SEM map Figure 5 ;

[0041] 3. Printing the solder paste in the surface of the pure copper pad, the pad size is 0.8mm, and reflow after the mounting componen...

Embodiment 3

[0042] Example 3: Preparation of low temperature solder paste without adding a reference contrast is as follows:

[0043] 1, prepare flux:

[0044] According to the mass ratio, the active agent (5% dika, 3%, 2-ethylimidazole), a film forming agent (PEG-20002%, acrylic-modified rosin 18%, 18% hydrogen fluid) , Thixotropic (4% of hydrogenated castor oil), surfactant (PVP 1%), corrosion inhibitor (benzatrazole 1%) and solvent (diethylene glycol Handhethhethoid ether 40%) mix well;

[0045] 2, 90% of the Sn-Bi alloy solder powder and the flux 10% in the step 1 are mixed, stirred for 0.5 h, resulting in an additional low temperature solder paste;

[0046] 3. Printing the solder paste in the surface of the pure copper pad, the pad size is 0.6mm, and reflow after the mounting components; the solder joint is from 75cm, freely fall, record the number of pads, as the pad diameter is 0.6 MM's reference, see Table 1.

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Abstract

The invention discloses low-temperature soldering paste added with anti-falling particles. The low-temperature soldering paste is characterized in that organic matter particles and / or Mxene materials are added into lead-free soldering paste, so that the falling performance of the low-temperature soldering paste is improved, and the problems of low mechanical property, poor falling performance and the like caused by brittleness of a welding spot formed by the low-temperature Sn-Bi-based soldering paste after welding due to Bi aggregation are solved. On the basis of Sn-Bi soldering paste, the organic matter particles accounting for 2%-6% of the mass of soldering paste are added; the Mxene materials are added according to the amount of 0.2%-0.5% of the mass of the alloy solder; and after backflow, the Mxene materials are dispersed in the welding spot, part of the organic matter particles exist around the welding spot in a residual mode, and the anti-falling performance of the welding spot is improved through the Mxene materials and the organic matter particles in different mechanisms.

Description

Technical field [0001] The present invention relates to a low temperature solder paste to add anti-fall particles, belonging to the technical field of electronic devices soldering material. Background technique [0002] Tin based solder is referred to as its lower melting point is an integrated connection material in the field of electronics manufacturing. Since lead has toxicity, the Sn-Ag-Cu alloy has replaced a conventional SNPB alloy into a mainstream alloy of the electronic manufacturing surface mounting process. However, since the input temperature of the reflow soldering is not less than 260 ° C, there is a problem that the heat input is large during the manufacturing process. This makes thin and large chips or PCBs easy to warp. The Sn-Bi alloy having only 138 ° C is only 138 ° C, then enter the researcher's sight. The alloy limits its application due to poor thermal tissue thermal stability due to poor thermal tissue, and low impact resistance. However, its low temperatu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/02B23K35/26B23K35/28B23K35/36B23K35/40
CPCB23K35/025B23K35/264B23K35/282B23K35/3613B23K35/3601B23K35/40
Inventor 蔡珊珊王加俊彭巨擘罗晓斌
Owner 云南锡业集团(控股)有限责任公司研发中心
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