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ptfe modified film for high frequency copper clad laminate

A copper-clad laminate and modification technology, which is applied in the field of electronic information engineering materials, can solve the problems of high melt viscosity, little research, and low creep, and achieve the effects of small dimensional stability, uniform thickness of the plate, and improved service life

Active Publication Date: 2022-08-02
SHANDONG SENRONG PLASTIC IND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Although polytetrafluoroethylene is a thermoplastic, it is difficult to process with ordinary thermoplastic molding methods due to its high melt viscosity, shear sensitivity, large shrinkage, creep and low friction factors; and polytetrafluoroethylene There are even fewer technologies for 3D printing raw materials, and little research

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The PTFE modified film for high-frequency copper clad laminates described in Example 1 is composed of the following raw materials in parts by weight: 7 parts of PTFE dispersion resin, 18 parts of solvent oil, 25 parts of water, 43 parts of PTFE dispersion, 2 parts of fuel, 4 parts of plasticizer and 32 parts of ceramic powder.

[0028] in:

[0029] The particle size of the PTFE dispersion resin is 450 microns.

[0030] Mineral spirits were a mixture of white oil and Isopar M.

[0031] The water is distilled water.

[0032] The flame retardant is polydimethylsiloxane.

[0033] The plasticizer is a mixture of dioctyl phthalate, trioctyl trimellitate and dioctyl adipate, wherein dioctyl phthalate, trioctyl trimellitate and adipic acid The mass ratio of dioctyl ester is 1.5:3.5:0.5.

[0034] In terms of mass percentage, the ceramic powder includes the following chemical composition: SiO 2 48.2%, Al 2 O 3 30.8%, Na 2 O2.5%, K 2 O 4.3%, CaO 4.7%, MgO 2.5%, Fe 2 O...

Embodiment 2

[0038] The PTFE modified film for high-frequency copper clad laminates described in Example 2 is composed of the following raw materials in parts by weight: 10 parts of PTFE dispersion resin, 20 parts of solvent oil, 20 parts of water, 44 parts of PTFE dispersion, 1 part of fuel, 3 parts of plasticizer and 30 parts of ceramic powder.

[0039] in:

[0040] The particle size of the PTFE dispersion resin is 500 microns.

[0041] Mineral spirits are mixtures of gasoline and Isopar M.

[0042] The water is distilled water.

[0043] The flame retardant is polydimethylsiloxane.

[0044] The plasticizer is a mixture of dioctyl phthalate, trioctyl trimellitate and dioctyl adipate, wherein dioctyl phthalate, trioctyl trimellitate and adipic acid The mass ratio of dioctyl ester is 1:3:0.7.

[0045] In terms of mass percentage, the ceramic powder includes the following chemical composition: SiO 2 48.2%, Al 2 O 3 30.8%, Na 2 O2.5%, K 2 O 4.3%, CaO 4.7%, MgO 2.5%, Fe 2 O 3 0....

Embodiment 3

[0049] The PTFE modified film for high-frequency copper clad laminate described in Example 3 is composed of the following raw materials in parts by weight: 5 parts of PTFE dispersion resin, 15 parts of solvent oil, 30 parts of water, 40 parts of PTFE dispersion, 3 parts of fuel, 5 parts of plasticizer and 25 parts of ceramic powder.

[0050] in:

[0051] The particle size of the PTFE dispersion resin is 400 microns.

[0052] The mineral spirits are a mixture of kerosene and Isopar M.

[0053] The water is distilled water.

[0054] The flame retardant is polydimethylsiloxane.

[0055] The plasticizer is a mixture of dioctyl phthalate, trioctyl trimellitate and dioctyl adipate, wherein dioctyl phthalate, trioctyl trimellitate and adipic acid The mass ratio of dioctyl ester is 2:4:1.

[0056] In terms of mass percentage, the ceramic powder includes the following chemical composition: SiO 2 48.2%, Al 2 O 3 30.8%, Na 2 O2.5%, K 2 O 4.3%, CaO 4.7%, MgO 2.5%, Fe 2 O 3 ...

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Abstract

The invention belongs to the technical field of electronic information engineering materials, and particularly relates to a PTFE modified film for high-frequency copper clad laminates. The PTFE modified film for high-frequency copper clad laminates of the present invention, in parts by weight, is composed of the following raw materials: 5-10 parts of PTFE dispersion resin, 15-20 parts of solvent oil, 20-30 parts of water, PTFE dispersion liquid 30-54 parts, 1-3 parts of flame retardant, 3-5 parts of plasticizer and 25-35 parts of ceramic powder. The PTFE modified film for high-frequency copper clad laminates of the present invention has excellent dielectric properties, dimensional stability and small thermal expansion coefficient. The high frequency copper clad laminate prepared by using the PTFE modified film for the high frequency copper clad laminate of the present invention has uniform and stable thickness and small tolerance, which can ensure the uniform stability of dielectric properties and impedance characteristics, and improves the high frequency copper clad laminate. service life.

Description

technical field [0001] The invention belongs to the technical field of electronic information engineering materials, and particularly relates to a PTFE modified film for high-frequency copper clad laminates. Background technique [0002] Copper clad laminate (Copper Clad Laminate, the full name of copper clad laminate, CCL for short), is made of wood pulp paper or glass fiber cloth as a reinforcing material, impregnated with resin, and covered with copper foil on one or both sides. A product made of it; copper clad laminates used in the fields of high frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meters) are called high frequency copper clad laminates. CCL is the basic material of the electronics industry, mainly used for processing and manufacturing printed circuit boards (PCB), widely used in televisions, radios, computers, computers, mobile communications and other electroni...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L27/18C08L91/06C08L83/04C08K13/02C08K5/12C08K5/11C08K3/22C08K3/36C08L91/00C08J5/18B32B15/085B32B15/20B32B27/32
CPCC08J5/18B32B15/085B32B15/20B32B27/322C08J2327/18C08J2427/18C08J2491/06C08J2483/04C08K13/02C08K5/12C08K5/11C08K3/36C08K2003/2227C08K2003/2206C08K2003/222C08K2003/2272C08K2003/2241C08K3/22C08J2491/00
Inventor 荣钦功曹开斌胥平周静
Owner SHANDONG SENRONG PLASTIC IND TECH