Hole-filling printing paste for HTCC and preparation method of hole-filling printing paste

A slurry and raw material technology, applied in the field of HTCC hole-filling printing paste and its preparation, can solve the problems of metal frame offset, micro cracks, inconsistent shrinkage, etc.

Pending Publication Date: 2021-07-16
瓷金科技(河南)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a hole-filling printing paste for HTCC to solve the problems of air leakage and metal frame offset when the existing high-temperature co-fired ceramic paste is made into a ceramic base and framed
[0008] Another object of the present invention is to provide a method for preparing hole-filling prin

Method used

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  • Hole-filling printing paste for HTCC and preparation method of hole-filling printing paste
  • Hole-filling printing paste for HTCC and preparation method of hole-filling printing paste
  • Hole-filling printing paste for HTCC and preparation method of hole-filling printing paste

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Effect test

Embodiment 1

[0042] The HTCC hole-filling printing paste of this embodiment is made of the following components by weight: 83 parts of tungsten powder; 0 parts of molybdenum powder; 9 parts of inorganic additives, including 7 parts of alumina and 2 parts of silicon dioxide; 8 parts in total of organic vehicle, wherein 5.57 parts of terpineol, 1.2 parts of tributyl citrate, 0.03 part of slurry additive, 1.2 parts of binder ethyl cellulose, 0.01 part of plasticizer in slurry additive, 0.01 part of variable agent and 0.01 part of leveling agent, wherein the plasticizer is dibutyl phthalate, the thixotropic agent is hydrogenated castor oil, and the leveling agent is lecithin.

Embodiment 2

[0044] The HTCC hole-filling printing paste of this embodiment is made of the following components by weight: 67 parts of tungsten powder; 13 parts of molybdenum powder; 10 parts of inorganic additives, including 8 parts of alumina and 2 parts of silicon dioxide; A total of 10 parts of organic vehicles, including 6.95 parts of terpineol, 1.5 parts of tributyl citrate, 0.05 parts of slurry additives, 1.5 parts of binder polyvinyl butyral, and 0.01 parts of plasticizers in slurry additives , 0.025 parts of thixotropic agent, 0.015 parts of leveling agent, wherein the plasticizer is dibutyl phthalate, the thixotropic agent is hydrogenated castor oil, and the leveling agent is lecithin.

Embodiment 3

[0046] The HTCC hole-filling printing paste of this embodiment is made of the following components by weight: 42 parts of tungsten powder; 36 parts of molybdenum powder; 10 parts of inorganic additives, including 8 parts of alumina and 2 parts of silicon dioxide; There are 12 parts in total of organic carrier, wherein 8.45 parts of terpineol, 1.7 parts of tributyl citrate; 0.025 part of variable agent and 0.015 part of leveling agent, wherein the plasticizer is dibutyl phthalate, the thixotropic agent is hydrogenated castor oil, and the leveling agent is lecithin.

[0047] Two, the specific embodiment of the preparation method of the HTCC hole-filling printing paste of the present invention

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Abstract

The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to hole-filling printing paste for HTCC and a preparation method of the hole-filling printing paste. The pore-filling printing paste is composed of the following raw materials in parts by weight: 75-85 parts of metal powder, 9-12 parts of an inorganic additive and 8-10 parts of an organic carrier, the metal powder is tungsten powder or mixed powder composed of tungsten powder and molybdenum powder, and the inorganic additive is composed of aluminum oxide and silicon dioxide according to the weight part ratio of (7-10): (1-3). The organic carrier is composed of a solvent, a slurry auxiliary agent and a binder according to a weight part ratio of (6-10): (0.03-0.06): (0.5-2). Through selection of the types and proportions of the raw materials, good flatness after slurry hole filling and sintering is realized, downstream processing procedures are not affected, and the yield is high.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to a hole-filling printing paste for HTCC and a preparation method thereof. Background technique [0002] Functional ceramic materials provide important support for modern electronic information technology, and are widely used in energy, communication, household appliances, automobiles and other fields. Co-fired multilayer ceramic substrates use thick-film technology to embed passive components such as signal lines and micro-wires into the substrate to meet many requirements of integrated circuits, and have received more and more attention. Co-fired multilayer ceramic substrates can be divided into high-temperature co-fired multilayer ceramic (HTCC) substrates and low-temperature co-fired multilayer ceramic (LTCC) substrates. Among them, alumina ceramic substrates have high thermal conductivity, high electrical insulation strength, Low dielectric con...

Claims

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Application Information

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IPC IPC(8): H01B1/16H01B1/22H01B13/00H01L23/498
CPCH01B1/16H01B1/22H01B13/00H01L23/49883
Inventor 刘永良潘亚蕊赵鑫卢红霞
Owner 瓷金科技(河南)有限公司
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