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High-toughness and high-temperature-resistant polyimide composite material and preparation method thereof

A technology of polyimide and composite materials, which is applied in the field of polyimide composite materials and can solve problems such as poor fracture toughness

Active Publication Date: 2021-07-27
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the above analysis, the present invention aims to provide a high toughness, high temperature resistant polyimide composite material and its preparation method, in order to solve the existing resistance The problem of poor fracture toughness between layers of polyimide composite materials at high temperature (greater than 300°C)

Method used

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  • High-toughness and high-temperature-resistant polyimide composite material and preparation method thereof
  • High-toughness and high-temperature-resistant polyimide composite material and preparation method thereof
  • High-toughness and high-temperature-resistant polyimide composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] (1) 470.75g (1.6mol) of 2,3,3',4'-biphenyltetraacid dianhydride (a-BPDA) and 99.29g (0.4mol) of 4-phenylethynylphthalamide An acid anhydride (PEPA) was refluxed for 4 hours in a 50wt% ethanol mixture to obtain a homogeneous esterification solution, which was then added to 360.43g (1.8mol) 4,4'-diaminodiphenyl ether (4, 4'-ODA) and 302.95g N, in the mixed solution of N-dimethylacetamide (DMAc), react at room temperature to obtain the precursor solution (n=8) of the thermosetting polyimide matrix resin of solid content 43wt% );

[0075] (2) After the precursor solution of the above-mentioned thermosetting polyimide matrix resin is impregnated with carbon fibers, it is evenly arranged, and after drying to remove the solvent, a prepreg with a content of 36 wt% of the thermosetting polyimide resin is obtained;

[0076] (3) Dissolve 65.62g (0.205mol) of 4,4'-diamino-2,2'-bistrifluoromethylbiphenyl (TFDB) in 623.66g of N,N-dimethylacetamide (DMAc) 88.85g (0.2mol) of 4,4'-(he...

Embodiment 2

[0081] (1) 470.75g (1.6mol) of 2,3,3',4'-biphenyltetraacid dianhydride (a-BPDA) and 132.39g (0.53mol) of 4-phenylethynylphthalamide An acid anhydride (PEPA) was refluxed for 4 hours in a 50wt% methanol mixture to obtain a homogeneous esterification solution, which was then added to 687.75g (1.87mol) of 4,4'-bis(4-aminophenoxy ) biphenyl (BAPB) and 645.45gN, in the mixed solution of N-dimethylformamide (DMF), the precursor solution (n= 6);

[0082] (2) After the precursor solution of the above-mentioned thermosetting polyimide matrix resin is impregnated with carbon fibers, the carbon fibers are evenly arranged, and after drying to remove the solvent, a prepreg with a content of 37wt% of the thermosetting polyimide resin is obtained;

[0083] (3) Dissolve 70.16g (0.202mol) of 9,9'-bis(4-aminophenyl)fluorene (BAFL) in 531.77g of N-methylpyrrolidone (NMP), and add 62.04g of it under nitrogen protection (0.2mol) of 3,3',4,4'-diphenyl ether tetra-acid dianhydride (ODPA) and 0.74g...

Embodiment 3

[0088] (1) 470.75g (1.6mol) of 2,3,3',4'-biphenyltetraacid dianhydride (a-BPDA) and 99.29g (0.4mol) of 4-phenylethynylphthalamide An acid anhydride (PEPA) was refluxed for 4 hours in a 50wt% ethanol mixture to obtain a homogeneous esterification solution, which was then added to 360.43g (1.8mol) 4,4'-diaminodiphenyl ether (4, 4'-ODA) and 206.77g N, in the mixed solution of N-dimethylacetamide (DMAc), the precursor solution (n= 8);

[0089] (2) After the precursor solution of the above-mentioned thermosetting polyimide matrix resin is impregnated with carbon fibers, the carbon fibers are evenly arranged, and after drying to remove the solvent, a prepreg with a content of 35wt% of the thermosetting polyimide resin is obtained;

[0090] (3) Dissolve 53.86g (0.204mol) of 5-amino-1-(4-aminophenyl)-1,3,3-trimethylindan (PIDA) in 477.61g N,N-dimethyl In acetamide (DMAc), under the protection of nitrogen, add 64.45g (0.2mol) of 3,3',4,4'-benzophenone tetra-acid dianhydride (BTDA) an...

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Abstract

The invention relates to a high-toughness and high-temperature-resistant polyimide composite material and a preparation method thereof, belongs to the technical field of polyimide composite materials, and solves the problem of poor interlayer fracture toughness of an existing high-temperature-resistant polyimide composite material. The high-toughness and high-temperature-resistant polyimide composite material comprises a thermosetting polyimide matrix, thermoplastic polyimide and reinforced fibers, the thermoplastic polyimide is in a non-woven fabric form, and the difference between the glass-transition temperature of the thermoplastic polyimide and the glass-transition temperature of the thermosetting polyimide matrix does not exceed 50 DEG C. The preparation method comprises the following steps: preparing a thermosetting polyimide prepreg and a thermoplastic polyimide non-woven fabric; and alternately laying the thermosetting polyimide prepreg and the thermoplastic polyimide non-woven fabric, and carrying out pressure forming to obtain the high-toughness and high-temperature-resistant polyimide composite material. The polyimide composite material has high toughness and high temperature resistance.

Description

technical field [0001] The invention relates to the technical field of polyimide composite materials, in particular to a high-toughness, high-temperature-resistant polyimide composite material and a preparation method thereof. Background technique [0002] Due to its excellent heat resistance and mechanical properties, polyimide resin-based fiber-reinforced composite materials have increasingly replaced metal materials in the fields of aerospace, weaponry, and automobile manufacturing in recent years for high-temperature-resistant load-bearing structural parts. manufacturing to achieve lightweight. High-temperature resistant polyimide composite materials usually use thermosetting polyimide resin as a matrix, and are composited by impregnating continuous reinforcing fibers, and then cured after laying to obtain composite material parts. However, due to the highly cross-linked rigid structure of thermosetting polyimide resin, the interlayer fracture toughness of the composite...

Claims

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Application Information

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IPC IPC(8): B32B9/00B32B9/04B32B27/02B32B27/28B32B5/12B32B37/06B32B37/10B32B38/08B32B38/16C08L79/08C08K7/06C08J5/24
CPCB32B5/02B32B5/022B32B5/26B32B5/12B32B37/06B32B37/10B32B38/08B32B38/164C08J5/24B32B2038/168B32B2250/42B32B2260/021B32B2260/046B32B2262/02B32B2262/106B32B2307/306B32B2307/558C08J2379/08C08K7/06
Inventor 范琳蓝邦伟刘仪莫松翟磊何民辉
Owner INST OF CHEM CHINESE ACAD OF SCI