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Multi-axis laser scanning optical system

A laser scanning and optical system technology, applied in the field of laser processing, can solve problems such as the quality degradation of the laser focus, limiting the processing width and aspect ratio, and limiting the adjustment speed of the lens spacing.

Active Publication Date: 2021-08-31
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The system uses a parallel plate to make the laser beam off-axis, and the maximum off-axis amount is limited. With the increase of the refractive index and thickness of the parallel plate, the dynamic adjustment performance of the laser beam off-axis will decrease. The off-axis amount is amplified, and the beam expander system will affect the laser energy distribution, resulting in a decrease in focusing performance;
[0006] 2. To amplify the off-axis laser beam, a large-diameter lens must be used. If the size of the lens is too large, the adjustment speed of the lens spacing will be limited, which will affect the dynamic performance of the laser Z-axis adjustment;
[0007] 3. The system cannot realize the adjustment of the laser beam diameter. While the beam expander system amplifies the off-axis amount of the laser, it also amplifies the laser beam diameter, which limits the processing format and depth-to-diameter ratio, and cannot simultaneously realize large-format ultra-fine processing and small-format processing. Switching of processing with large depth-to-diameter ratio;
[0008] 4. The system belongs to an overall system. If any component is missing or the characteristics or installation position of any component in the system has changed, the system cannot continue to work;
[0009] 5. The method provided by this system is not compatible with the existing two-dimensional or three-dimensional galvanometer system, that is, the two-dimensional or three-dimensional galvanometer system cannot have the function of five-dimensional scanning through a simple upgrade, and realize the switch from two-dimensional to five-dimensional
[0012] 2. The system cannot realize the adjustment of the laser beam diameter, and cannot simultaneously realize the switching between large-format ultra-fine processing and small-format large-depth-to-diameter ratio processing;
[0013] 3. The oblique incidence of the laser used in the system to adjust the scanning laser beam inclination and focus position will introduce very large aberrations. If the laser beam inclination is too large or the scanning range is too large, it will lead to a sharp decline in the quality of the laser focus, which limits scanning. The adjustment range of inclination and sweeping field of the system;
[0014] 4. The system belongs to an overall system. If any component is missing or the characteristics or installation position of any component in the system has changed, the system cannot continue to work;
[0015] 5. The method provided by this system is not compatible with the existing two-dimensional or three-dimensional galvanometer system, that is, the two-dimensional or three-dimensional galvanometer system cannot have the function of five-dimensional scanning through a simple upgrade, and realize the switch from two-dimensional to five-dimensional

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Examples

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Effect test

example 1

[0070] Example 1: Large-scale high-precision etching of superalloy plates with multi-axis laser scanning optical system

[0071] A laser with an average power of 60W, a wavelength of 1064nm, and a pulse length of 10ps is used as a light source, the repetition frequency is selected as 200kHz, and the material to be processed is a 50x50x2mm superalloy flat plate. The diameter of the incident laser beam 2 is 6mm, the diameter of the high dynamic lens 19 in the dynamic focusing module 15 is 7mm, the maximum inclination angle of the scanning laser beam is 7°, the scanning range of the two-dimensional scanning module 7 is 50x50mm, and the multi-axis system follows the planned path on the surface of the material The corresponding three-dimensional shape is etched to realize high-efficiency three-dimensional etching processing without flanging in large format.

example 2

[0072] Example 2: Manufacture of multi-axis laser scanning optical system with large depth-to-diameter ratio and large format group holes

[0073] A laser with a maximum average power of 20W and a wavelength of 355nm is used as a light source, the pulse width is set to 100ns, the repetition frequency is selected to be 200kHz, and the material to be processed is a titanium alloy plate with a thickness of 500μm. The diameter of the incident laser beam 2 is 0.8mm, the diameter of the high dynamic mirror 19 in the dynamic focusing module 15 is 1mm, the inclination angle of the scanning laser beam is 2°, and the two-dimensional scanning module 7 is in a square format of 10x10mm, with a radius of 50μm. It is the scanning unit and the distance between the centers of the circles is 150 μm to scan the array circle. Under the control of the dynamic focus module 15, the laser focus moves to the bottom of the material at a speed of 50 μm / s, so that the laser focus is always located on the ...

example 3

[0074] Example 3: Special-shaped cutting of large-sized copper plates with multi-axis laser scanning optical system

[0075] A laser with a maximum average power of 200W and a wavelength of 1064nm is used as a light source, the pulse width is set to 100ns, and the repetition frequency is selected to be 200kHz. The material to be processed is a copper plate with a thickness of 1000μm. The diameter of the incident laser beam 2 is 3 mm, the diameter of the high dynamic mirror 19 in the dynamic focusing module 15 is 4 mm, the inclination angle of the scanning laser beam is 3 °, the scanning pattern of the two-dimensional scanning module 7 is a square of 100x100 mm, the inclination angle of the laser beam As the different sides of the square change, under the control of the dynamic focus module 15, the laser focus moves to the bottom of the material at a speed of 50 μm / s, so that the laser focus is always located on the surface of the copper plate, and the side wall of the square wi...

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Abstract

The invention belongs to the field of laser processing, and discloses a multi-axis laser scanning optical system. The multi-axis laser scanning optical system comprises a dynamic focusing module (15), a light beam parallel translation module (18), a two-dimensional scanning module (7) and a focusing module (8), wherein the dynamic focusing module is used for controlling the diameter of a laser beam and the Z coordinate of the focus of the output laser, and the light beam parallel translation module is used for adjusting the projection position of the laser beam transmission direction on the Y axis and the projection position of the laser beam transmission direction on the Z axis. According to the system, the off-axis direction and the off-axis distance of the laser beam input to a two-dimensional scanning module along the Y axis and the Z axis can be regulated and controlled based on the principle that the included angle between the focused parallel off-axis laser beam and a focal plane can change, and the included angle alpha between the propagation direction of the output laser beam and the Y-axis direction and the included angle beta between the propagation direction and the X-axis direction are regulated and controlled, so that multi-axis regulation and control of the laser are realized.

Description

technical field [0001] The invention belongs to the field of laser processing, and more specifically relates to a multi-axis laser scanning optical system, which can realize multi-dimensional control of scanning laser. Background technique [0002] The development of science and technology continues to pose new challenges to manufacturing technology. The manufacturing technical indicators of many high-end equipment have approached or even exceeded the limits of traditional manufacturing technologies, such as the manufacture of aviation / aerospace parts, etching or cutting of three-dimensional irregular materials, etc. Using traditional processing technologies, such as mechanical processing, electric discharge processing, ultrasonic processing, etc., it is difficult to meet the technical indicators of the above processing requirements. In recent years, high-energy beam manufacturing technology represented by laser and electron beam has developed rapidly in precision machining....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/082B23K26/064B23K26/046B23K26/70
CPCB23K26/082B23K26/064B23K26/046B23K26/702
Inventor 邓磊敏乔亚庆段军熊伟杨少睿吴思
Owner HUAZHONG UNIV OF SCI & TECH
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