Processing device and process for ultraviolet-assisted chemical mechanical polishing of diamond wafer

Abstract

The invention provides a processing device and process for ultraviolet-assisted chemical mechanical polishing of a diamond wafer. The device comprises a polishing device, a polishing solution supply device and an ultraviolet irradiation device, wherein a polishing disc is made of JGS1 quartz glass; the polishing solution supply device is positioned above the polishing disc; and the ultraviolet irradiation device is positioned below the polishing disc. According to the processing device and process, ultraviolet light is directly irradiated to the surface of the single crystal diamond wafer, and a proper oxidizing agent is combined, so that the wafer is efficiently oxidized and modified; an oxidation modification layer is mechanically removed through the polishing disc and abrasive particles; in a processing process, the wafer and the polishing disc rotate separately to generate relative motion; and meanwhile, ultraviolet irradiation and polishing solution feeding enable a photochemical modification effect and a mechanical polishing effect to be alternatively performed, so that photochemical mechanical processing can be performed on the wafer, and high-quality and high-efficiency processing of single crystal diamond can be realized under the action of multi-energy field coupling.

Description

technical field [0001] The invention relates to the technical field of polishing processing, in particular to a light-assisted chemical mechanical polishing processing device and process for hard, brittle and refractory materials, and in particular to a processing device and process for ultraviolet light-assisted chemical mechanical polishing of diamond wafers. Background technique [0002] Monocrystalline silicon is an important material for making integrated circuits (ICs), and more than 99% of today's ICs need to use monocrystalline silicon wafers. However, with the development of high-power and high-speed electronic devices, silicon materials have been difficult to adapt to high-frequency, high-power, high-temperature working environments. Diamond has a higher band gap, thermal conductivity and material stability, and has significant advantages and great development potential in the application of a new generation of deep ultraviolet optoelectronic devices, high-voltage ...

AI Technical Summary

Problems solved by technology

[0004] At present, the mechanical polishing method is the most traditional diamond polishing method, and it is also the only diamond polishing method widely used at present, but the processing efficiency of this method is low and it is easy to cause processing damage, and the surface roughness is difficult to reach sub-nanometer level

Chemical mechanical polishing (CMP) is an ultra-smooth and low-damage surface polishing method widely used in integrated circuit manufacturing. This method can obtain high-quality diamond surfaces, but the processing efficiency of CMP is extremely low, and the removal rate is <200nm / h (Yuan Z, et al.The International Journal of Advanced Manufacturing Technology.2018;95(5-8):1715-1727 and Kubota A, et al.Diamond and Related Materials.2015;60:75-80)

Scholars at home and abroad also try to increase the chemical reaction rate of single crystal diamond by preparing new polishing liquid to increase the types of oxidants in the polishing liquid and increase the concentration, but the removal rate has not been significantly improved, and the removal rate is improved only by the chemical action of the polishing liquid. Very little (Yuan Z, et al. Journal of Manufacturing Science & Engineering. 2013; 135(4): 41006 and Yuan ZW, et al. Journal of Synthetic Crystals. 2016; 45(1): 73-79.)

The CMP method is currently a mature polishing method to obtain an ultra-smooth and ultra-low damage surface, but the efficiency of polishing diamond is extremely low at present, and only relying on the mechanical action of abrasive grains and the chemical action of polishing fluid cannot meet the needs of diamond processing. Therefore, how to improve the performance of single crystal diamond The material removal rate of CMP processing is the key problem to be solved urgently

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