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A kind of acetylacetonate palladium doped modified low resistance chip thick film resistor paste

A palladium acetylacetonate, low-resistance chip technology, applied in thick film resistors, resistors, non-adjustable metal resistors, etc., can solve the problem of poor resistance dispersion of chip resistors, increase production costs, poor solder resistance, etc. problems, to achieve the effect of improving electrical properties, improving yield, and improving dispersibility

Active Publication Date: 2021-12-21
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The uneven dispersion of conductive phases such as silver powder and palladium powder in the paste will not only lead to poor dispersion of the resistance value of the mass-produced chip resistors, but also cannot effectively cut and adjust the resistance in the subsequent laser resistance adjustment process, and will increase the resistance during sintering. The risk of cracking and shrinkage cavity on the rear surface will lead to a large number of defective products and increase the production cost
[0003] The reason for the above problems is that the content of metal conductive phase silver powder and palladium powder in the paste of chip thick film resistors in the low resistance section (0.1Ω / □~100Ω / □) increases, especially because palladium has good stability The content of palladium powder in the paste in the low-resistance segment can reach up to 30%, and the paste preparation process cannot disperse it evenly, which not only leads to poor resistance dispersion of chip resistors At the same time, some silver powder and palladium powder are agglomerated. During the sintering process, the thermal expansion coefficient difference between the agglomerated metal conductive phase and the bonding phase is too large, surface cracks and shrinkage cavities occur, and a large number of defective products are produced.

Method used

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  • A kind of acetylacetonate palladium doped modified low resistance chip thick film resistor paste
  • A kind of acetylacetonate palladium doped modified low resistance chip thick film resistor paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The mass percentage of the low-resistance chip thick film resistor paste in this embodiment consists of: 35% of palladium acetylacetonate solution with a mass concentration of 57%, 3% of flake silver powder, 2% of spherical silver powder, 3% of ruthenium dioxide, five Niobium oxide 2%, glass powder 30%, 5% terpineol, 15% ethyl cellulose, 3% hydrogenated rosin, 2% polyvinyl butyral; the glass powder is composed of two micron silicate glass Powders A and B are composed at a mass ratio of 5:5, and the mass percentage of glass powder A is: 15% PbO, 20% SiO 2 , 5% B 2 o 3 , 5%Al 2 o 3 , the mass percent composition of glass frit B is 15% CaO, 8% Al 2 o 3 , 35% SiO 2 , 0.3% Na 2 O composition, glass powder particle size D50 is 1.0-1.5 μm. The mass content of palladium in the resistor paste is 7%.

[0021] The preparation method of the chip thick film resistor paste in this embodiment is as follows:

[0022] (1) 40g palladium acetylacetonate was completely dissolved ...

Embodiment 2

[0027] The mass percent of the low-resistance chip thick-film resistor slurry in this embodiment consists of: 28% of palladium acetylacetonate solution with a mass concentration of 57%, 12% of spherical palladium powder, 3% of flake silver powder, 2% of spherical silver powder, Ruthenium dioxide 2%, niobium pentoxide 2%, copper oxide 0.5%, manganese dioxide 0.5%, glass powder 20%, terpineol 10%, ethyl cellulose 15%, hydrogenated rosin 3%, polyvinyl alcohol Butyral 2%; the glass powder is composed of two micron-sized silicate glass powders A and B in a mass ratio of 4:6, and the mass percentage of glass powder A is: 15% PbO, 20% SiO 2 , 5% B 2 o 3 , 5%Al 2 o 3 , the mass percent composition of glass frit B is 15% CaO, 8% Al 2 o 3 , 35% SiO 2 , 0.3% Na 2 O composition, glass powder particle size D50 is 1.0-1.5 μm. The mass content of palladium element in the resistance paste is 17.5%.

[0028] The preparation method of the chip thick film resistor paste in this embodime...

Embodiment 3

[0034] The mass percent of the low-resistance chip thick-film resistor slurry in this embodiment consists of: 18% of palladium acetylacetonate solution with a mass concentration of 57%, 7% of spherical palladium powder, 5% of flake silver powder, 3% of spherical silver powder, Niobium pentoxide 1%, copper oxide 0.5%, zirconia 0.5%, glass powder 35%, terpineol 7%, ethyl cellulose 15%, hydrogenated rosin 3%, polyvinyl butyral 2%, horse Lycate resin 3%; wherein the glass powder is composed of two micron silicate glass powders A and B in a mass ratio of 5:5, and the mass percentage of glass powder A is composed of: 15% PbO, 20% SiO 2 , 5% B 2 o 3 , 5%Al 2 o 3 , the mass percent composition of glass frit B is 15% CaO, 8% Al 2 o 3 , 35% SiO 2 , 0.3% Na 2 O composition, glass powder particle size D50 is 1.0-1.5 μm. The mass content of palladium element in the resistance paste is 10.5%.

[0035] The preparation method of the chip thick film resistor paste in this embodiment i...

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Abstract

The invention discloses a modified low-resistance sheet-type thick-film resistor slurry doped with palladium acetylacetonate, which is composed of palladium acetylacetonate solution, palladium powder, silver powder, ruthenium dioxide, additives, glass powder, and an organic carrier. The additives are niobium pentoxide, copper oxide, titanium dioxide, manganese dioxide, zirconium oxide and the like. In the present invention, palladium acetylacetonate solution is used instead of palladium powder. Since palladium acetylacetonate is completely decomposed into palladium before 400°C in the air atmosphere, palladium acetylacetonate solution is used instead of palladium powder to improve the dispersibility of high-content palladium in the resistance slurry. , Improve the electrical performance of chip resistors. At the same time, flake or rod silver powder and spherical silver powder are mixed in a certain proportion, and the surface cracks and shrinkage holes are filled with flake or rod silver powder to improve the yield of low-resistance chip resistors.

Description

technical field [0001] The invention belongs to the technical field of resistance paste, and in particular relates to a modified low-resistance sheet-type thick-film resistance paste doped with palladium acetylacetonate. Background technique [0002] Chip thick film resistors are widely used in various electronic devices due to their small size and high reliability. As the core components of integrated circuits, there are extremely strict requirements on their reliability. Chip thick film resistors use resistor paste as the core raw material to determine the main working performance of chip resistors. Resistance dispersion is one of the key electrical properties that determine whether chip resistors can be used reliably. Especially in the low-resistance section (0.1Ω / □~100Ω / □) the increase of silver powder, palladium powder and other metal conductive phases in the slurry, the uniform dispersion of conductive phase materials puts forward higher requirements for the slurry pre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/00H01B1/16H01B1/22C03C12/00C03C3/072
CPCH01C7/003H01B1/16H01B1/22C03C12/00C03C3/072
Inventor 张帅周宝荣赵科良吴高鹏马小强马倩兰金鹏刘琦瑾
Owner 西安宏星电子浆料科技股份有限公司