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Etching solution for stabilizing line width loss and etching taper angle in panel copper manufacturing process

A technology for stabilizing wire and etching solution, which is applied in the field of etching solution for stabilizing line width loss and etching cone angle. The effect of widening loss and reducing the cost of use

Active Publication Date: 2021-11-05
湖北兴福电子材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the wet etching process also has some disadvantages. Wet etching has the effect of isotropic etching, which will lead to side etching and etching cone angle. Excessive side etching will lead to a reduction in the line width of the wire and affect the quality of the product. Electrical characteristics, and too large or too small etching cone angle will cause defects in subsequent processing processes and affect product yield

Method used

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  • Etching solution for stabilizing line width loss and etching taper angle in panel copper manufacturing process
  • Etching solution for stabilizing line width loss and etching taper angle in panel copper manufacturing process
  • Etching solution for stabilizing line width loss and etching taper angle in panel copper manufacturing process

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Experimental program
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Effect test

Embodiment 1

[0043] Embodiment 1 provides an etchant that provides a stable line width loss and an etching taper angle in a panel copper manufacturing process, specifically:

[0044] The copper etching solution is composed of hydrogen peroxide, citric acid, glycolic acid, alanine, bipyridine, furan, sodium alkylnaphthalene sulfonate, ethylene glycol ether, imidazole and deionized water.

[0045] Wherein, the mass fraction of hydrogen peroxide is 9%; the mass fraction of citric acid is 6%; the mass fraction of glycolic acid is 1%; the mass fraction of alanine is 1%; the mass fraction of bipyridine is 1.5%; the mass fraction of furan is 0.05 %; sodium alkylnaphthalene sulfonate is 0.1%; the mass fraction of ethylene glycol ether is 2%; the mass fraction of imidazole is 2%; the balance is deionized water. First, weigh citric acid, glycolic acid, alanine, bipyridine, furan and sodium alkylnaphthalene sulfonate in sequence, dissolve them in an appropriate amount of deionized water, then add eth...

Embodiment 2

[0048] Embodiment 2 provides an etchant that provides a stable line width loss and an etching taper angle in a panel copper manufacturing process, specifically:

[0049] The copper etchant is composed of hydrogen peroxide, malic acid, oxalic acid, glutamic acid, 4,4-diamino-2,2-bipyridine, furan, sodium alkylnaphthalene sulfonate, ethylene glycol ether, imidazole and Composition of deionized water.

[0050] Wherein, the mass fraction of hydrogen peroxide is 9%; the mass fraction of malic acid is 6%; the mass fraction of oxalic acid is 1%; the mass fraction of glutamic acid is 1%; The mass fraction is 1.5%; the mass fraction of furan is 0.05%; the sodium alkylnaphthalene sulfonate is 0.1%; the mass fraction of ethylene glycol ether is 2%; the mass fraction of imidazole is 2%; the balance is deionized water. First, weigh malic acid, oxalic acid, glutamic acid, 4,4-diamino-2,2-bipyridine, furan and sodium alkylnaphthalene sulfonate in sequence, dissolve them in an appropriate am...

Embodiment 3

[0053] Embodiment 3 provides an etchant that provides a stable line width loss and an etching cone angle in a panel copper manufacturing process, specifically:

[0054] The copper etching solution is composed of hydrogen peroxide, citric acid, glycolic acid, lysine, 3-aminopyridine, piperazine, sodium alkyl naphthalene sulfonate, ethylene glycol ether, imidazole and deionized water.

[0055] Wherein, the mass fraction of hydrogen peroxide is 9%; The mass fraction of citric acid is 6%; The mass fraction of glycolic acid is 1%; The mass fraction of lysine is 1%; The mass fraction of 3-aminopyridine is 1.5%; The fraction is 0.05%; the sodium alkylnaphthalene sulfonate is 0.1%; the mass fraction of ethylene glycol ether is 2%; the mass fraction of imidazole is 2%; the balance is deionized water. First, weigh citric acid, glycolic acid, lysine, 3-aminopyridine, piperazine and sodium alkylnaphthalene sulfonate in sequence, dissolve them in appropriate amount of deionized water, then...

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Abstract

The invention relates to an etching solution for stabilizing line width loss and an etching taper angle in a panel copper manufacturing process. According to the solution, hydrogen peroxide, a chelating agent, an etching inhibitor, a wetting agent, a solubilizer, a pH regulator and deionized water form the etching solution used in the copper panel manufacturing process. In the etching process, along with the increase of copper ions in the etching solution, the stability of the etching taper angle and the line width loss can still be kept. A chelating agent system composed of composite organic acid, pyridine and derivatives thereof in the etching solution can form a stable chelate more quickly with the copper ions generated during etching in the form of coordinate bonds, so that the influence of the copper ions on the etching rate and the etching life is reduced, and the stability of the etching solution is enhanced; through cooperative use of the wetting agent and the solubilizer, the dissolving property of the etching solution can be improved, the wettability of the etching solution on photoresist and copper surfaces can be enhanced, the copper ions can be promoted to be quickly dispersed into the etching solution, the etching solution can etch out the stable taper angle, the service life of the etching solution is prolonged, and the use cost is reduced.

Description

technical field [0001] The invention relates to the technical field of electronic chemicals in the liquid crystal display thin film transistor industry, in particular to an etchant for stabilizing line width loss and etching cone angle in a panel copper manufacturing process. Background technique [0002] In recent years, in order to meet the needs of end users, flat-panel displays have gradually developed in the direction of large size and high resolution. However, large-size panels will increase the impedance of wires and reduce the speed of signal transmission. In order to adapt to the development of the panel industry, replace aluminum and its alloys with metal copper and its alloys with lower electrical conductivity and excellent electromigration resistance, which can effectively reduce wire impedance and current loss, increase signal transmission speed, and simplify driver ICs process. [0003] The etching process is one of the very important processes in the TFT-LCD ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18
CPCC23F1/18
Inventor 钟昌东贺兆波刘悦张庭冯凯尹印万杨阳王书萍李鑫李书航
Owner 湖北兴福电子材料股份有限公司