Polyurethane adhesive with high humidity and heat resistance, protective film and preparation method thereof
A technology of polyurethane glue and polyurethane glue, applied in the direction of polyurea/polyurethane adhesive, adhesive, film/flake adhesive, etc. Effect of heat resistance, good mechanical properties, good hydrolysis resistance
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Embodiment 1
[0048] The high heat-and-moisture-resistant polyurethane adhesive of this embodiment is, from top to bottom, a substrate layer, a polyurethane adhesive layer with high heat-and-moisture resistance, and a release film layer, wherein the substrate layer is specifically a 50 μm PET original film; the polyurethane adhesive layer with high heat-and-moisture resistance, The components are as follows: 100 parts of polyurethane glue (polyurethane glue is composed of polycarbonate polyol (UH-300 number average molecular weight 3000 hydroxyl value 34-40 from Ube Industries, Ltd.), polyether polyol (National Chemical Industry DP2000E number average molecular weight 2000 hydroxyl value) value 53-58), polyester polyol (PCL220AL number average molecular weight 2000, hydroxyl value 53-59) of Dalu Chemical Co., Ltd. polymerized, the mass ratio is: 60:20:20); 7.5 parts of hexamethylene diisocyanate Trimer curing agent; 2 parts of antistatic agent (lithium bistrifluoromethanesulfonimide); 1 part...
Embodiment 2
[0053] The high heat-and-moisture-resistant polyurethane adhesive of this embodiment is, from top to bottom, a substrate layer, a polyurethane adhesive layer with high heat-and-moisture resistance, and a release film layer, wherein the substrate layer is specifically a 50 μm PET original film; the polyurethane adhesive layer with high heat-and-moisture resistance, The components are as follows: 100 parts of polyurethane glue (polyurethane glue is made of polycarbonate polyol (Ube Industries Co., Ltd. UH-300), polyether polyol (National Chemical Industry DP2000E), polyester polyol (Dailu Chemical Co., Ltd. PCL220AL) Polymerized, the mass ratio is: 80:10:10); 9 parts of trimer curing agent of hexamethylene diisocyanate; 1 part of antistatic agent (lithium bistrifluoromethanesulfonimide); 0.5 part of imine; 1 part of surfactant (organic silicon leveling agent BYK3700, Germany); 0.12 part of dibutyltin dilaurate; add ethyl acetate as a dilution solvent to a solid content of 40%; an...
Embodiment 3
[0058] The high heat-and-moisture-resistant polyurethane adhesive of this embodiment is, from top to bottom, a substrate layer, a polyurethane adhesive layer with high heat-and-moisture resistance, and a release film layer, wherein the substrate layer is specifically a 50 μm PET original film; the polyurethane adhesive layer with high heat-and-moisture resistance, The components are as follows: 100 parts of polyurethane glue (polyurethane glue is made of polycarbonate polyol (Ube Industries Co., Ltd. UH-300), polyether polyol (National Chemical Industry DP2000E), polyester polyol (Dailu Chemical Co., Ltd. PCL220AL) Polymerized, the mass ratio is: 70:10:20); 9.2 parts of trimer curing agent of hexamethylene diisocyanate; 1 part of antistatic agent (lithium trifluoromethanesulfonimide); 1 part of imine; 1.2 parts of surfactant (organic silicon leveling agent BYK3700 Germany); 0.12 parts of dibutyltin dilaurate; add ethyl acetate as a dilution solvent to 40% solid content; antista...
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Abstract
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