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Layered micro-nano composite structure for enhancing boiling heat transfer, and processing method thereof

A composite structure and enhanced boiling technology, which is applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating transformation, etc., can solve the complexity of the micro-nano composite structure process, the blockage of liquid supply channels and heat transfer, and the Difficult heat transfer enhancement effects and other issues, to achieve the effect of delaying heat transfer deterioration, increasing critical heat flux density, and increasing actual heat transfer area

Active Publication Date: 2021-12-21
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current micro-nano composite structure only realizes the simple combination of microstructure and nanostructure, which leads to the blockage of too dense bubbles in the channel formed by the microstructure in the high heat flux area, which will cause the blockage of the liquid supply channel and heat transfer. Therefore, it is difficult to achieve further heat transfer enhancement effect
[0005] In addition, many microstructure and nanostructure processing technologies have the disadvantage of high processing cost, and the processing technologies and processing conditions of microstructure and nanostructure are usually different, resulting in the processing of micro-nano composite structures usually requiring a combination of multiple processing technologies or The same processing technology can only be obtained by repeating it many times, which further highlights the shortcomings of the complexity of the process flow and the high processing cost of the micro-nano composite structure in the processing process.

Method used

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  • Layered micro-nano composite structure for enhancing boiling heat transfer, and processing method thereof
  • Layered micro-nano composite structure for enhancing boiling heat transfer, and processing method thereof
  • Layered micro-nano composite structure for enhancing boiling heat transfer, and processing method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0035] Goal: To etch a regular array of square column microstructures with a column width of 20 μm, a column height of 120 μm, and a center-to-center distance of 60 μm, and to etch nanoscale holes on the four edges of the top surface of the square columns.

[0036] Step 1: Design a corresponding mask pattern according to the etching target, and process the mask.

[0037] Step 2: Pretreat the silicon wafer with HMDS for 10 minutes; then stick it on the glue homogenizer, rotate it forward at a speed of 600r / min for 6s, and reverse it at a speed of 4000r / min for 30s, so that the photoresist AZ6130 Evenly coat the front side of the silicon wafer with a coating thickness of 7.5 μm; then place the silicon wafer on a contact hot plate at 100°C and dry for 5 minutes to obtain a relatively strong photoresist layer. Then place the silicon wafer on the MA6 photolithography machine for exposure for 23s, and place it in 2.38% TMAH developer for 150s to complete the developing process. Aft...

Embodiment 2

[0039] Objective: To etch a regular array of square column microstructures with a column width of 50 μm, a column height of 60 μm, and a center-to-center distance of 100 μm, and to etch nanoscale holes on the four edges of the top surface of the square columns.

[0040] Step 1: Design a corresponding mask pattern according to the etching target, and process the mask.

[0041]Step 2: pretreat the silicon wafer with HMDS for 10 minutes; then stick it on the glue homogenizer, rotate it forward at a speed of 600r / min for 6s, and reverse it at a speed of 1000r / min for 30s, so that the photoresist AZ6130 Evenly coat the front side of the silicon wafer with a coating thickness of 5.2 μm; then place the silicon wafer on a contact hot plate at 100°C and dry for 5 minutes to obtain a relatively strong photoresist layer. Then put the silicon wafer on the MA6 photolithography machine for 4.2s exposure, and put it in the 3038 developer solution for 70s to complete the development process. ...

Embodiment 3

[0044] Goal: To etch a regular array of square column microstructures with a column width of 100 μm, a column height of 60 μm, and a center-to-center distance of 200 μm, and to etch nanoscale holes on the four edges of the top surface of the square columns.

[0045] Step 1: Design a corresponding mask pattern according to the etching target, and process the mask.

[0046] Step 2: pretreat the silicon wafer with HMDS for 10 minutes; then stick it on the glue homogenizer, rotate it forward at a speed of 600r / min for 6s, and reverse it at a speed of 1000r / min for 30s, so that the photoresist AZ6130 Evenly coat the front side of the silicon wafer with a coating thickness of 5.2 μm; then place the silicon wafer on a contact hot plate at 100°C and dry for 5 minutes to obtain a relatively strong photoresist layer. Then put the silicon wafer on the MA6 photolithography machine for 4.2s exposure, and put it in the 3038 developer solution for 70s to complete the development process. Af...

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Abstract

The invention discloses a layered micro-nano composite structure for enhancing boiling heat transfer, and a processing method thereof. The layered micro-nano composite structure comprises a silicon substrate, a cylindrical microstructure grown on the silicon substrate and nano holes around the top surface of the cylindrical microstructure. The composite structure is based on the cylindrical microstructures arranged in an array mode, and the liquid supply speed of a heat flux density area can be effectively increased; and the nano holes generated on the periphery of the top surface of the cylindrical microstructure can effectively improve the vaporization core density, so that the boiling heat transfer coefficient is improved. The nano holes are only distributed around the top surface of the cylindrical microstructure, so that large-area transverse merging of bubbles in a high-heat-flux area at the bottom of the cylindrical microstructure is effectively prevented, heat transfer deterioration is effectively delayed, and it is ensured that the liquid supply capacity cannot be weakened due to introduction of the nano-structure. The layered micro-nano composite structure is machined and formed at a time through a dry corrosion method, accurate regulation and control of the micro-structure are achieved, and the machining method is easy to operate and low in manufacturing cost.

Description

technical field [0001] The invention belongs to the technical field of phase change enhanced heat transfer, and relates to a technology applicable to boiling heat transfer enhancement, in particular to a layered micro-nano composite structure for enhanced boiling heat transfer and a processing method thereof. Background technique [0002] As a very efficient heat dissipation method, boiling heat transfer is widely used in the heat dissipation of ultra-high heat flux devices such as aerospace, military equipment, high-power LED lights, and integrated circuits. However, with the continuous improvement of the integration and performance of electronic devices, the heat flux of ultra-high heat flux devices continues to rise, and new challenges are constantly posed to boiling heat transfer technology. Therefore, the enhancement of boiling heat transfer, including reducing the temperature of the heat transfer wall, increasing the boiling heat transfer coefficient and critical heat ...

Claims

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Application Information

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IPC IPC(8): H05K7/20F28D15/04H01L23/427
CPCH05K7/2029F28D15/046H01L23/427
Inventor 刘斌李庆魏进家杨曦李瑾
Owner CENT SOUTH UNIV
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