W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient and preparation method thereof

A low thermal expansion coefficient, composite powder technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problem of W and Cu immiscible wettability, unfavorable material physical properties, and difficult mass production To achieve the effect of improving density and physical properties, less agglomeration, and reducing thermal expansion coefficient
CN113909484APending Publication Date: 2022-01-11安徽亿恒新材料科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
安徽亿恒新材料科技有限公司
Publication Date
2022-01-11

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Abstract

The invention discloses W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient. The thermal conductivity is 200-235W / (m.K), and the thermal expansion coefficient is (5.6-9.3) * 10<-6> / K. The invention further discloses a preparation method of the W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient. The preparation method comprises the following steps of: preparing a W-Cu precursor by adopting a wet chemical method; carrying out pyrolysis reduction on the W-Cu precursor in a hydrogen environment; and carrying out compression molding on the reduced W-Cu composite powder, then heating to 1100-1300 DEG C in a hydrogen atmosphere, carrying out heat preservation for 100-140 minutes, and cooling to obtain the W-Cu composite powder. According to the preparation method, the W-Cu composite precursor is prepared by adopting the wet chemical method, the W-Cu composite powder with high sintering activity is obtained through different reduction process combinations, and then the W-Cu composite powder with high density, high thermal conductivity, low thermal expansion coefficient and uniform tissue distribution is prepared through subsequent liquid phase sintering.
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Description

technical field

[0001] The invention relates to the technical field of integrated circuit packaging materials, in particular to a chemical preparation method of W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient and its composite material. Background technique

[0002] In integrated circuits, electronic packaging materials play the role of chip protection, chip support, chip heat dissipation, chip insulation and chip and external circuit connection, which requires packaging materials to have excellent electrical conductivity, thermal conductivity, good chemical inertia, low thermal expansion coefficient and high hardness and so on. With the rapid development of microelectronics technology, integrated circuits are gradually becoming highly integrated and miniaturized, which means that packaging materials need to release heat in a timely manner, and have a low thermal expansion coefficient to ensure compatibility with Si, Semiconductor ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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