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Oxygen-free copper microstructure functional surface jet flow polishing solution and polishing method

A technology of polishing liquid and microstructure, which is applied in the direction of polishing compositions containing abrasives, etc., and can solve the problems of easy oxidation, need for improvement, and low removal efficiency

Pending Publication Date: 2022-01-21
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage of jet polishing is that it has lower requirements on the shape of the processed sample, and is especially suitable for ultra-precision machining of complex structure surfaces. However, the removal efficiency of traditional jet polishing materials is low. In addition, oxygen-free copper is a non-ferrous metal with active molecules. The production process is extremely easy to oxidize
[0003] Therefore, the current oxygen-free copper structural functional surface jet polishing fluid and polishing method still need to be improved

Method used

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  • Oxygen-free copper microstructure functional surface jet flow polishing solution and polishing method
  • Oxygen-free copper microstructure functional surface jet flow polishing solution and polishing method
  • Oxygen-free copper microstructure functional surface jet flow polishing solution and polishing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Add 20wt% of 200nm silicon oxide particles, 0.1wt% perchloric acid, 0.5wt% ethylenediaminetetraacetic acid, 0.5wt% sodium hydroxide, and 0.005wt% liquiritin to the deionized water in sequence, and keep stirring until they are evenly mixed. After uniform mixing, a jet polishing liquid is formed, and the pH of the polishing liquid is 6.8. The oxygen-free copper surface is polished by jet polishing, after polishing, the surface is cleaned and dried. The surface defects (scratches and pits) were observed with an optical microscope, and the polishing depth and surface roughness of the polished samples were measured with a white light interferometer. The results are shown in Table 1.

Embodiment 2

[0043] The remaining operating steps are the same as in Example 1, except that the contents of each component in the polishing solution are: 10 wt% of alumina particles with a diameter of 5000 nm, 10 wt% of hydrogen peroxide, 0.1 wt% of aspartic acid, 1 wt% of ammonia water, and 0.001 wt% of puerarin wt%, stirring continuously until it is uniformly mixed, and then a jet polishing fluid is formed after uniform mixing, and the pH of the polishing fluid is 7.5. The surface defects (scratches and pits) were observed with an optical microscope, and the polishing depth and surface roughness of the polished samples were measured with a white light interferometer. The results are shown in Table 1.

Embodiment 3

[0045] The remaining operating steps are the same as in Example 1, except that the contents of each component in the polishing solution are: 1 wt% of 1000nm diamond particles, 0.2 wt% of sulfuric acid, 1 wt% of glycine, 1 wt% of potassium hydroxide, and 0.002 wt% of delphinidin wt%, stirring continuously until it is uniformly mixed, and then a jet polishing fluid is formed after uniform mixing, and the pH of the polishing fluid is 8.0. The surface defects (scratches and pits) were observed with an optical microscope, and the polishing depth and surface roughness of the polished samples were measured with a white light interferometer. The results are shown in Table 1.

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Abstract

The invention provides an oxygen-free copper microstructure functional surface jet flow polishing solution and a polishing method. The polishing solution comprises the following components in percentage by mass based on the total mass of the polishing solution: 1%-20% of particles, 0.1%-10% of an oxidizing agent, 0.01%-1% of a complexing agent, 0.1%-1% of a pH regulator, 0.001%-0.1% of an oxidation balance agent and the balance of deionized water. Therefore, by adopting the polishing solution, the ultra-precision machining efficiency of the surface of the oxygen-free copper microstructure can be remarkably improved, and meanwhile oxidation of the oxygen-free copper after machining is avoided.

Description

technical field [0001] The invention relates to the technical field of metal microstructure processing, in particular to a jet polishing liquid and a polishing method for an oxygen-free copper structure functional surface. Background technique [0002] Micro-structured Surface is a micro-structured surface with a regular periodic array and can achieve specific functions such as optics, physics, and biology. Oxygen-free copper itself has excellent cold workability, welding performance, and durability. It has important applications in high-demand fields such as light, electricity, magnetism, and heat. Therefore, the surface of oxygen-free copper microstructure has broad application prospects. The surface of the microstructure requires high smoothness and surface roughness. In the production process, due to reasons such as production equipment, material characteristics, and processing technology, the microstructure of the oxygen-free copper surface is firstly processed by machi...

Claims

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Application Information

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IPC IPC(8): C09G1/02C23F3/04
CPCC09G1/02C23F3/04
Inventor 潘国顺艾天成张馨张文静郭丹
Owner TSINGHUA UNIV
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