Acid pore-conditioning agent and surface metallization treatment process method of inorganic non-metal base material
An acidic and porogen technology, applied in metal material coating process, liquid chemical plating, coating, etc., can solve problems such as uneven copper plating on the surface, achieve good corrosion inhibition effect, simple control, and reduce the average The effect of roughness
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[0028] (1) Preparation of acidic pore modifier: add ionic liquid, organic acid and repairing agent to deionized water, stir and mix uniformly to obtain acidic pore modifier, wherein the preparation method of ionic liquid comprises the following steps:
[0029] Trioctylamine and dodecyl bromide are added to the DMF solvent, and reflux reaction is carried out under the protection of nitrogen. After the reaction is completed, the reaction product is cooled to room temperature, left standing, solid-liquid separation, ethyl acetate recrystallization, namely A white solid was obtained, and then the white solid and lithium bistrifluoromethanesulfonylimide were added to methanol solvent, the reaction was stirred, then cooled to room temperature, the organic phase was dried, the solvent was concentrated, dichloromethane was added, and washed with deionized water , concentrating the solvent to obtain a colorless viscous liquid, and then vacuum-drying the colorless viscous liquid to obtai...
Embodiment 1
[0048]Add 200 g of ionic liquid bistrifluoromethanesulfonimide trioctyldodecylammonium, 10 g of acetic acid, 10 g of glycolic acid, 10 g of hydroxyethylidene diphosphonic acid and 1 g of graphene oxide into 1 L of deionized water, stir and mix well , to obtain an acidic pore modifier;
[0049] Heat the prepared pore adjusting agent to 50°C for later use, and process the through-hole copper-clad laminate with a thickness of 2.0mm to be tested according to the hole metallization process of the aforementioned steps a~i. After the copper plating is completed, dry the sample for Test evaluation.
Embodiment 2
[0051] Add 300 g of ionic liquid bistrifluoromethanesulfonimide trioctyltetradecyl ammonium, 20 g of methanesulfonic acid, 10 g of citric acid, 10 g of hydroxyethylene diphosphonic acid, and 2 g of graphene oxide into 1 L of deionized water, Stir and mix evenly to obtain an acidic pore modifier;
[0052] Heat the prepared pore adjusting agent to 50°C for later use, and process the through-hole copper-clad laminate with a thickness of 2.0mm to be tested according to the hole metallization process of the aforementioned steps a~i. After the copper plating is completed, dry the sample for Test evaluation.
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