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High-weather-resistance packaging dielectric paste for thick film circuit

A dielectric paste and thick film circuit technology, applied in the direction of circuits, electrical components, quartz/glass/glass enamel, etc., can solve the problems of restrictions on the popularization and application of conductors and resistance pastes, reduce the use limitations, improve stress and Excessively high brittleness, the effect of improving inertness

Active Publication Date: 2022-02-18
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Electronic paste has been widely used in capacitors, potentiometers, thick film hybrid integrated circuits, sensitive components, surface mount technology and other fields in the electronics industry. However, in terms of thick film circuits, there is no perfect package dielectric paste Therefore, the promotion and application of conductor and resistance paste is limited, so it is particularly important to find a highly weather-resistant encapsulating dielectric paste that can perfectly match the conductor and resistance paste without affecting the electrical properties of the components themselves.

Method used

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  • High-weather-resistance packaging dielectric paste for thick film circuit

Examples

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Comparison scheme
Effect test

Embodiment 1

[0017] Preparation of modified glass powder: In the corundum tank, the composition is composed of 30% calcium oxide, 34% silicon dioxide, 12% zinc oxide, 18% strontium nitrate, 4% zirconium oxide, and 2% titanium dioxide in a corundum tank. Then seal the corundum jar and place it on an eight-roll ball mill for mixing for 1 hour; after the mixing is completed, the obtained mixture is put into a quartz crucible, placed in a 1400 ℃ resistance furnace for 1 hour, and the obtained glass solution is water-quenched to obtain glass slag , put the glass slag into the corundum ball mill tank, add isopropyl alcohol according to the mass ratio of 1:1, put it on an eight-roll ball mill to ball mill to a particle size of D50≤1.0μm, pour it out, and use a 600-mesh sieve for sieving , put the sieved liquid into an oven to dry at 120°C for 24 hours to obtain Ca-Si glass powder; reload the Ca-Si glass powder into a quartz crucible and put it into a pit-type nitriding furnace at 550°C to cool dow...

Embodiment 2

[0021] Preparation of modified glass powder: In a corundum tank, the composition is composed of 20% calcium oxide, 40% silicon dioxide, 20% zinc oxide, 15% strontium nitrate, 3% zirconia, and 2% titanium dioxide in a corundum tank. Then seal the corundum jar and place it on an eight-roll ball mill for mixing for 1 hour; after the mixing is completed, the obtained mixture is put into a quartz crucible, and placed in a 1300 ℃ resistance furnace for heat preservation and melting for 1 hour, and the obtained glass solution is water-quenched to obtain glass slag , put the glass slag into the corundum ball mill tank, add isopropyl alcohol according to the mass ratio of 1:1, put it on an eight-roll ball mill to ball mill to a particle size of D50≤1.0μm, pour it out, and use a 600-mesh sieve for sieving , put the sieved liquid into an oven to dry at 120°C for 24 hours to obtain Ca-Si glass powder; reload the Ca-Si glass powder into a quartz crucible and put it into a pit nitriding furn...

Embodiment 3

[0025] Preparation of modified glass powder: In a corundum tank, the composition is composed of 40% calcium oxide, 30% silicon dioxide, 10% zinc oxide, 15% strontium nitrate, 3% zirconium oxide, and 2% titanium dioxide in a corundum tank. Then seal the corundum jar and place it on an eight-roll ball mill for mixing for 1 hour; after the mixing is completed, the obtained mixture is put into a quartz crucible, placed in a 1500 ° C resistance furnace for 2 hours, and the obtained glass solution is water-quenched to obtain glass slag , put the glass slag into the corundum ball mill tank, add isopropyl alcohol according to the mass ratio of 1:1, put it on an eight-roll ball mill to ball mill to a particle size of D50≤1.0μm, pour it out, and use a 600-mesh sieve for sieving , put the sieved liquid into an oven to dry at 120°C for 24 hours to obtain Ca-Si glass powder; reload the Ca-Si glass powder into a quartz crucible and put it into a pit nitriding furnace at 600°C to cool down. ...

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Abstract

The invention discloses a high-weather-resistance packaging dielectric paste for a thick film circuit. Modified glass powder used by the dielectric paste is obtained by carrying out nitrogen removal treatment on Ca-Si series glass powder; an organic carrier is prepared by using lecithin, dimethyl sulfoxide, beta-cellulose and the like; and zinc oxide, cadmium trioxide, titanium dioxide and the like are added as oxide additives to further enhance the stability of the slurry. The prepared dielectric paste has high weather resistance, is low in price and easy to obtain, expands the use environment and the application range, is free of pollution to the environment, conforms to the strategy of sustainable development and has obvious economic benefits.

Description

technical field [0001] The invention belongs to the technical application field of dielectric slurry, and in particular relates to a high-weather-resistant encapsulation medium slurry for thick-film circuits and a preparation method thereof. Background technique [0002] The main function of the encapsulating dielectric slurry is to adhere to the conductors and resistors to prevent the harmful influence of the external environment, to make the conductors and resistors have stable electrical properties, to be protected from external corrosive substances, to prevent mechanical damage and to interact with other conductors. Therefore, it must have high weather resistance, and the overall cost and performance can be optimized. [0003] Electronic paste has been widely used in various fields of the electronic industry such as capacitors, potentiometers, thick-film hybrid integrated circuits, sensitive components, and surface assembly technology. Therefore, the promotion and appli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B3/08C03C12/00C03C6/04C03C23/00
CPCH01B3/087H01B3/08C03C12/00C03C1/00C03C23/007
Inventor 周碧张豪艾志远王明奎王要东
Owner 西安宏星电子浆料科技股份有限公司
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