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Thermosetting resin composition, thermosetting resin film, thermosetting film, laminate, and printed wiring board and method for producing same

A resin composition, thermosetting technology, applied in the direction of multi-layer circuit manufacturing, printed circuit, printed circuit components, etc., can solve the problems of difficult circuit design, transmission speed signal waveform interference, electrical signal attenuation, etc., to achieve excellent heat resistance , the effect of low dielectric constant and dielectric loss tangent

Pending Publication Date: 2022-03-18
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the high-frequency region, when the dielectric constant is high, the transmission speed is delayed and the waveform of the signal is disturbed, so it is difficult to carry out circuit design
In addition, if a high-speed signal flows through the wiring, the electrical signal is converted into heat, and the electrical signal is significantly attenuated when the dielectric loss is large in the GHz band.

Method used

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  • Thermosetting resin composition, thermosetting resin film, thermosetting film, laminate, and printed wiring board and method for producing same
  • Thermosetting resin composition, thermosetting resin film, thermosetting film, laminate, and printed wiring board and method for producing same
  • Thermosetting resin composition, thermosetting resin film, thermosetting film, laminate, and printed wiring board and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0054] (Preparation of terminal isocyanate urethane oligomer)

[0055] A urethane oligomer having an isocyanate group at a terminal can be obtained by reacting a diol compound and a diisocyanate compound so that the diisocyanate compound becomes an excess ratio. The compounding ratio of a diol compound and a diisocyanate compound should just be more than 1 as long as the ratio (isocyanate group / hydroxyl group) of the number of isocyanate groups to the number of hydroxyl groups. The ratio of isocyanate group / hydroxyl group is preferably 1.1 to 2.0, more preferably 1.15 to 1.8, still more preferably 1.2 to 1.6. When the ratio of isocyanate group / hydroxyl group is 1 or less, the ratio of terminal isocyanates becomes low. When the ratio of isocyanate group / hydroxyl group is large, the reaction does not proceed at the stage where diisocyanate is bonded to both ends of one molecule of diol, so the molecular weight of the oligomer does not increase, and sometimes the heat resistance...

Embodiment

[0150] The present invention will be specifically described below by showing examples, but the present invention is not limited to these examples.

Synthetic example 1

[0153] (Synthesis of urethane prepolymer)

[0154] 16.0 g of triethylene glycol dimethyl ether and 20.7 g (0.100 mol) of norbornene diisocyanate were charged into a reaction vessel as a polymerization solvent, and heated to 80° C. while stirring under a nitrogen stream to dissolve them. To this solution, 50.0 g (0.025 mol) of polycarbonate diol (manufactured by Asahi Kasei "DURANOL T5652") and 8.1 g (0.050 mol) of 2,2-bis(hydroxymethyl)butyric acid were dissolved in three After adding the obtained solution to 40.0 g of ethylene glycol dimethyl ether, it was stirred at 80° C. for 5 hours to obtain an isocyanate-terminated urethane prepolymer having a carboxyl group in the molecule.

[0155] (Synthesis of terminal acid anhydride urethane imide oligomer)

[0156] 40.0 g of triethylene glycol dimethyl ether and 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl] propane dianhydride (BPADA) 52.0 g (0.100 mol) were put into the reaction vessel, Heat to 80°C and stir. The above-mentioned uret...

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Abstract

The thermosetting resin composition includes component (A): a compound having an imide group and a carboxyl group in a molecule; and component (B): a polymer having a repeating unit represented by general formula (1). R1 and R2 are each independently a hydrogen atom or a methyl group. R3 represents a hydrogen atom or an arbitrary substituent, and a plurality of R3 may be bonded to form a ring structure. And R4 is a hydrogen atom or an alkyl group. M and n are each independently an integer of 1 or more, and m / n is preferably 1-50.

Description

technical field [0001] The present invention relates to a thermosetting resin composition, a thermosetting resin film and a thermosetting film suitable for use as an interlayer adhesive material of a multilayer printed circuit board. Furthermore, this invention relates to a printed circuit board and its manufacturing method. Background technique [0002] With the miniaturization, weight reduction and multi-functionalization of electronic components, the printed circuit boards inside the equipment are further highly integrated and multi-layered. As a method of multilayering printed wiring boards, a lamination system in which conductive layers (circuit patterns) and organic insulating layers are alternately laminated on a substrate material has attracted attention. An insulating interlayer adhesive material is used for the interlayer bonding of the conductor layer and the organic insulating layer. The interlayer adhesive requires embedability in a circuit pattern and strong ...

Claims

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Application Information

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IPC IPC(8): C08L75/04C08L25/08B32B27/06B32B27/40H05K1/03H05K3/46
CPCC08L75/04C08L25/08B32B27/08B32B27/40H05K1/0353H05K3/46C08G18/44C08G81/02H05K1/03C08G18/757C08G18/348C08G18/341C08G18/831C08G18/672C09J175/06C09D175/16C08G18/12C08G18/42C08K5/29C08L39/04C08G18/10C08G73/08
Inventor 河野富美弥木户雅善
Owner KANEKA CORP
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