Method for preparing copper-iron alloy based on electro-deposition method

A technology of copper-iron alloy and electrodeposition method, which is applied in the field of electrochemical deposition, can solve the problems of large difference in properties between copper and iron, high degree of alloy segregation, high impurity content, etc., achieve low cost, uniform coating thickness, and reduce hydrolysis reactions.

Active Publication Date: 2022-03-29
SANMENXIA HONGXIN NONFERROUS METALS
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Problems solved by technology

However, the properties of copper and iron are very different, and the mutual solubility is low. Only about 4% of iron can be dissolved into the copper matrix to form an alloy.
Therefore, when copper-iron alloys are produced through the above preparation process, problems such as high impurity content, complex process, high cost and high degree of alloy segregation will inevitably occur, which seriously affect the overall performance of the alloy.

Method used

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  • Method for preparing copper-iron alloy based on electro-deposition method
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  • Method for preparing copper-iron alloy based on electro-deposition method

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preparation example Construction

[0036] An embodiment of the present invention provides a method for preparing a copper-iron alloy by electrodeposition, comprising:

[0037] The sulfate aqueous solution system is used as the electrolyte, the copper plated or stainless steel plate is used as the negative electrode, the oxygen evolution anode is used as the positive electrode, and the pulse power supply is used for deposition. The low potential range is -3~-5V, and the high potential range is -3.5. ~-5.5V; pulse voltage is applied, and the corresponding cathode current density is 80~200mA / cm 2 , the pulse width range is 1-100ms, the electrolyte circulation rate is controlled at 700-1400mL / min, the pH value is 2.5-4, the deposition temperature is 45-50°C, and the deposition time is 15-120min; the distance between positive and negative electrodes is 1- 4cm, the obtained copper-iron alloy composition is Fe0.84-86wt%, Cu5.10-95wt%.

[0038] Wherein, the sulfate aqueous solution system electrolyte comprises the com...

Embodiment 1

[0043] (1) Taking the oxygen-analysis anode as the positive pole, and copper plating on the stainless steel plate as the negative pole, the sulfate aqueous electrolyte:

[0044] Fe(NH 4 ) 2 (SO 4 ) 2 ·6H 2 O 200g / L; copper sulfate 80g / L; boric acid 20g / L; o-benzoylsulfonimide 3g / L; sodium gluconate 100g / L.

[0045] Using pulse power deposition, the potential range of low potential is -3.5V, and the potential range of high potential is -4V; pulse voltage is applied, and the corresponding cathode current density is 120mA / cm 2 , the pulse width range is 80ms, the electrolyte circulation rate is controlled at 1000mL / min, the pH value is 3, the deposition temperature is 50°C; the positive and negative electrode spacing is 3cm, and the electrodeposition is 30min to produce iron-copper alloy.

[0046] Using the electrochemical deposition method of this embodiment, an iron-copper alloy with a composition of 9.97wt% Fe, 87.24wt% Cu, uniform coating and low impurity content was con...

Embodiment 2

[0048] The oxygen-evolving anode is used as the positive electrode, the copper plating on the stainless steel plate is used as the negative electrode, and the sulfate aqueous electrolyte is used:

[0049] Fe(NH 4 ) 2 (SO 4 ) 2 ·6H 2 O 300g / L; copper sulfate 30g / L; boric acid 20g / L; o-benzoylsulfonimide 5g / L; sodium citrate 80g / L.

[0050] Using pulse power deposition, the low potential potential is -3V, the high potential potential range is -3.8V; pulse voltage is applied, and the corresponding cathode current density is 80mA / cm 2 , the pulse width range is 1ms, the electrolyte circulation rate is controlled at 1200mL / min, the pH value is 2.5, the deposition temperature is 45°C; the positive and negative electrode spacing is 1cm, and the electrodeposition is 30min to produce iron-copper alloy.

[0051] The copper-iron alloy with the composition of 20.16wt% Fe, 76.38wt% Cu, uniform coating and low impurity content was continuously prepared by using the electrochemical depo...

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Abstract

The invention discloses a method for preparing a copper-iron alloy based on an electro-deposition method, which belongs to the field of electrochemical deposited alloys, and comprises the following steps: by taking a sulfate aqueous solution system as an electrolyte, electroplating copper on a copper plate or a stainless steel plate as a negative electrode and an oxygen evolution positive electrode as a positive electrode, depositing by adopting a pulsed power supply, and applying pulse voltage; and the circulation speed, the pH value, the current density, the pulse width, the deposition temperature, the deposition time and the distance between the positive electrode and the negative electrode of the electrolyte are controlled, and the copper-iron alloy is obtained. The copper-iron alloy prepared by the method is controllable in component and thickness, excellent in mechanical property and corrosion resistance, has electromagnetic shielding performance, compact microstructure and fine crystal, has excellent mechanical property, electrical property, magnetic property and corrosion resistance, and can be widely applied to the industrial fields of electronics, medical treatment, electromechanics, communication and the like.

Description

technical field [0001] The invention belongs to the technical field of electrochemical deposition, and in particular relates to an electrodeposition preparation method of a copper-iron alloy. The electrochemical deposition method is used to continuously prepare the copper-iron alloy in a sulfate aqueous solution system. Background technique [0002] Copper-iron alloy has high hardness, excellent thermal conductivity, wear resistance and high bending strength. When the iron content is greater than 30%, it also has excellent magnetic and electromagnetic shielding properties. Therefore, the application prospect of this alloy is very broad. For example, copper-iron alloy strips can be used for shielding covers, large-size OLED backplanes, 5G mobile phone heat sinks, large-size LED display heat sinks, air-conditioning condensers, wireless charging circuit boards, etc.; copper-iron alloy rods , rods, wires and other materials can be used for electromagnetic shielding wires, high-f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25C1/22C25C7/06C25C7/02
CPCC25C1/22C25C7/06C25C7/02Y02P10/20
Inventor 杨生春宋雨芬朱涛纪新平
Owner SANMENXIA HONGXIN NONFERROUS METALS
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